PCB Manufacturer & PCB Assembly

Building Better PCBs: Key Design Strategies and Modern Manufacturing Tips

Posted on November 13, 2025 by Abiola

PCB design is the process of creating detailed layouts that connect electronic components on a circuit board. Building better PCBs starts with mastering essential design strategies and understanding modern manufacturing processes. This article guides engineers, students, and organizations through key principles, advanced techniques, common pitfalls, and how partnering with manufacturers like NextPCB can streamline your PCB development journey.

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Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Posted on March 10, 2025 by NextPCB

Comprehensive introduction of Tang Nano 20K application and how nextpcb provides pcb assembly prototyping service.

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Enhancing IoT Connectivity with SIM7600 Series

Posted on September 11, 2025 by NextPCB

Combined with the application scenarios, detailed introduction of sim7600 series chip product parameters and advantages

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The most comprehensive introduction to FPC PCB design principles

Posted on January 23, 2025 by NextPCB

Flexible printed circuit (FPC), also known as soft circuit board, flexible circuit board, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the substrate. It has the characteristics of high wiring density, light weight, thin thickness and good bending.

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PCB Positive and Negative Difference: From Design to Process

Posted on June 24, 2025 by nextpcb

Introduce the difference between pcb positive and negative process, application scenarios, advantages and disadvantages

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FPGA vs MCU : Understanding the Differences

Posted on November 20, 2024 by nextpcb

When it comes to embedded systems and electronics, two commonly discussed components are FPGAs (Field-Programmable Gate Arrays) and microcontrollers (MCUs). Both of these devices play critical roles in different applications, but they operate in fundamentally different ways. In this blog post, we'll explore the key differences between FPGAs and microcontrollers, covering their architecture, use cases, and advantages.

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PCB Thermal Design Case Study for Aluminum Core PCBs

Posted on November 07, 2025 by LL

Master aluminum core PCB thermal design. This guide analyzes a 4.8W case study, calculating a minimal 6.15K temperature rise and exploring dielectric layer challenges for reliable high-power electronics.

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Tag: NextPCB PCB assembly SMT Aluminum PCB PCB design PCB capabilities PCB Types pcb thermal design

PCB Thermal Design Case Study: Copper Thickness for Uniform Heat Load

Posted on November 13, 2025 by LL

How to choose PCB copper thickness for uniform heat: IPC-2152 sizing, k_eff modeling, plane & thermal-via design, plus NextPCB HQDFM tips for reliability.

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Tag: NextPCB Thick-copper PCBs PCB design Reflow Soldering PCB Stackup IPC Standard HQDFM pcb thermal design

10 kΩ Resistor: Principles, Advantages, and Applications in Electronic Design

Posted on October 15, 2025 by iotbyhvm - LL

Comprehensive guide to the 10 kΩ resistor: understand E-series standards, color codes, SMD vs through-hole packaging, power ratings, 555 timer applications, and I²C pull-up design. Perfect for electronics engineers and hobbyists seeking deep insight and practical selection tips.

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Tag: PCB Design & Layout PCB design PCBA through-hole assembly resistor SMD Components electronics

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

Posted on November 28, 2025 by NextPCB Content Team

Uncover the 6 critical PCB manufacturing cost traps—from material selection (High-TG/Copper thickness) to drilling density and surface finish. Learn NextPCB's actionable strategies to optimize your design and procurement process to drastically lower overheads and secure a competitive edge.

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Tag: pcb order NextPCB PCB assembly PCB fabrication PCB manufacturing PCB design Turnkey PCBA Cost PCB Cost pcba cost

電解コンデンサの深堀りとPCBアプリケーションガイド

Posted on November 27, 2025 by NextPCB Content Team

電解コンデンサの基本的な物理、性能、およびPCB設計における適用についての詳細な探索。これらの重要なコンポーネントの構造、分類、信頼性を学び、回路設計における役割を理解します。

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Tag: NextPCB PCB design electrolytic capacitors BOM Circuit Board Components electronic components thermal management

Electrolytic Capacitor Deep Dive and PCB Application Guide

Posted on November 27, 2025 by NextPCB Content Team

Master Electrolytic Capacitors: physics, polarization, and electrolyte function. Compare aluminum electrolytic capacitor vs. solid polymer for low-ESR, high-reliability PCB design.

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Tag: NextPCB PCB design electrolytic capacitors BOM Circuit Board Components electronic components thermal management

What is a Ceramic Capacitor? Guide to MLCCs, Codes, and Stability for PCB Engineers

Posted on November 27, 2025 by NextPCB Content Team

Master ceramic capacitors (MLCCs, Disk Caps): learn cap codes, temperature coefficients (C0G, X7R, Y5V), and DFM layout rules. Essential guide for robust PCB design and BOM sourcing.

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Tag: components sourcing components Filter Circuit PCB capacitors HQDFM DFM basic electronics MLCCs

How Is Copper (Cu) Used in PCB Manufacturing?

Posted on November 19, 2025 by NextPCB Content Team

Cu, copper is vital in PCB manufacturing for conductive traces, power planes, and heat dissipation, ensuring reliable electrical and thermal performance.

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Tag: NextPCB PCB fabrication Thick-copper PCBs PCB manufacturing PCB Design & Layout

Class D Amplifier Board Design: Thermal Management & Cost Optimization

Posted on November 17, 2025 by LL

Master Class D amplifier PCB design for India. Essential guide to thermal management, low-distortion layout, EMI mitigation, and cost optimization via Value Engineering.

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Tag: EMI PCB design pcb layout IPC Standard Amplifier PCB PCB Cost pcba cost pcb thermal design thermal management

What Factors Affect Characteristic Impedance Precision in High-Speed PCB?

Posted on November 13, 2025 by LL

Master PCB characteristic impedance precision. Explore the core factors (W, H, Dk), quantification models, and manufacturing tolerances (Trace Width, Dielectric Thickness) critical for high-speed signal integrity. Learn advanced TDR control techniques and NextPCB capabilities.

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Tag: NextPCB PCB fabrication PCB design Impedance Control high speed pcb design impedance calculation advanced pcb

Understanding VCC, VDD, VEE, and VSS Notation in Electronics

Posted on November 12, 2025 by LL

Decode VCC, VDD, VEE, and VSS. This guide explains their BJT/MOSFET origins, complex VSS/GND definitions, and expert PCB grounding techniques for power integrity.

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Tag: PCB design pcb grounding mixed-signal pcb Zero-ohm resistor signal integrity (SI) mosfet cmos

The Crucial Role of Annular Rings in Multilayer Printed Circuit Board Design

Posted on November 11, 2025 by LL

Learn the importance of annular rings in PCB design and manufacturing. Understand how their width affects trace and via connections, and how to calculate the ideal dimensions to avoid issues like tangency and breakout. Ensure reliable connections with optimal annular ring design.

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Tag: NextPCB PCB fabrication PCB manufacturing PCB design Annular Rings The copper rings

When to Use Vias in PCB Design: An Engineer's Decision Guide

Posted on November 14, 2025 by LL

Master the complex trade-offs of PCB via design. Learn when to use blind, buried, and microvias for superior signal integrity, high-current power delivery, and essential thermal management. Essential engineering guide to avoiding costly manufacturing failures and SI issues.

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Tag: PCB manufacturing PCB Design & Layout PCB design Impedance Control pcb layout HDI Signal Integrity Vias HQDFM DFM

PCB Trace Width Calculation: High-Current Design & Thermal Analysis

Posted on November 10, 2025 by LL

Optimize your high-current PCBs. This guide covers trace width calculation, thermal verification (simulation), heavy copper fabrication limits, and comprehensive IPC-2152 compliance.

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Tag: PCB Design & Layout PCB design PCB Design Layout PCB Trace pcb thermal design thermal management

Building Better PCBs: Key Design Strategies and Modern Manufacturing Tips

Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Enhancing IoT Connectivity with SIM7600 Series

The most comprehensive introduction to FPC PCB design principles

PCB Positive and Negative Difference: From Design to Process

FPGA vs MCU : Understanding the Differences

PCB Thermal Design Case Study for Aluminum Core PCBs

PCB Thermal Design Case Study: Copper Thickness for Uniform Heat Load

10 kΩ Resistor: Principles, Advantages, and Applications in Electronic Design

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

電解コンデンサの深堀りとPCBアプリケーションガイド

Electrolytic Capacitor Deep Dive and PCB Application Guide

What is a Ceramic Capacitor? Guide to MLCCs, Codes, and Stability for PCB Engineers

How Is Copper (Cu) Used in PCB Manufacturing?

Class D Amplifier Board Design: Thermal Management & Cost Optimization

What Factors Affect Characteristic Impedance Precision in High-Speed PCB?

Understanding VCC, VDD, VEE, and VSS Notation in Electronics

The Crucial Role of Annular Rings in Multilayer Printed Circuit Board Design

When to Use Vias in PCB Design: An Engineer's Decision Guide

PCB Trace Width Calculation: High-Current Design & Thermal Analysis

Categories

Recommended Article:

BLOG

Building Better PCBs: Key Design Strategies and Modern Manufacturing Tips

Unlocking FPGA Innovation with Tang Nano 20K: Features, Advantages, and Applications

Enhancing IoT Connectivity with SIM7600 Series

The most comprehensive introduction to FPC PCB design principles

PCB Positive and Negative Difference: From Design to Process

FPGA vs MCU : Understanding the Differences

PCB Thermal Design Case Study for Aluminum Core PCBs

PCB Thermal Design Case Study: Copper Thickness for Uniform Heat Load

10 kΩ Resistor: Principles, Advantages, and Applications in Electronic Design

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

電解コンデンサの深堀りとPCBアプリケーションガイド

Electrolytic Capacitor Deep Dive and PCB Application Guide

What is a Ceramic Capacitor? Guide to MLCCs, Codes, and Stability for PCB Engineers

How Is Copper (Cu) Used in PCB Manufacturing?

Class D Amplifier Board Design: Thermal Management & Cost Optimization

What Factors Affect Characteristic Impedance Precision in High-Speed PCB?

Understanding VCC, VDD, VEE, and VSS Notation in Electronics

The Crucial Role of Annular Rings in Multilayer Printed Circuit Board Design

When to Use Vias in PCB Design: An Engineer's Decision Guide

PCB Trace Width Calculation: High-Current Design & Thermal Analysis

Categories

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