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In the world of high-performance electronics—particularly in RF (Radio Frequency) and Microwave applications—"Rogers PCB" is a name that commands respect. For many engineers, it is not just a brand; it is synonymous with high frequency, high speed, and superior reliability.
This guide provides an in-depth look at Rogers PCBs, comparing them with standard materials and providing a detailed specification list of Rogers materials available at NextPCB.
A Rogers PCB refers to a printed circuit board manufactured using laminates produced by the Rogers Corporation. Unlike traditional FR-4 boards, which use epoxy resin and glass fiber, Rogers laminates are typically based on ceramics, hydrocarbons, or PTFE (Polytetrafluoroethylene) composites.
These materials are engineered to maintain extremely low signal loss and a highly stable Dielectric Constant (Dk) even at very high frequencies (up to 110 GHz).

Source: https://www.rogerscorp.com/advanced-electronics-solutions/ro4000-series-laminates/ro4000-lopro-laminates
While Rogers materials come at a higher cost than standard FR-4, they offer specific performance characteristics that are non-negotiable for designs operating above 500MHz.
| Feature | Rogers Material (e.g., RO4350B) | Standard FR-4 | Performance Impact |
|---|---|---|---|
| Frequency | Ideal for > 1GHz (RF/Microwave) | Typically < 1GHz | Rogers maintains signal clarity at high frequencies. |
| Dissipation Factor (Df) | Very Low (~0.0037) | Higher (~0.020) | Rogers minimizes signal transmission loss. |
| Dielectric Constant (Dk) | Stable & Precise | Fluctuates | Rogers allows for precise impedance control. |
NextPCB Expert Tip: To balance performance and budget, consider a Hybrid Buildup. Use Rogers material for critical signal layers and standard FR-4 for power/ground layers.
At NextPCB, we understand that selecting the right material is the first step to a successful RF design. NextPCB’s PCB manufacturing capabilities cover both PTFE and non-PTFE Rogers laminates for consumer to extremely high-frequency applications.
Below is a list of the most popular Rogers materials we support. For other low-loss options, you can also view our high-speed materials.
| Material Code | Brand | Max Freq | Df (@10GHz) | Dk (@10GHz) | Tg/Td (°C) | CTE (ppm/°C) X/Y/Z | Type | Datasheet |
|---|---|---|---|---|---|---|---|---|
| RO4003C | ROGERS | 30 GHz | 0.0027 | 3.38 | 280 (TMA) | 11 / 14 / 46 | Hydrocarbon / Ceramic / Woven Glass | RO4003C.pdf |
| RO4350B | ROGERS | 30 GHz | 0.0037 | 3.48 | 280 (TMA) | 14 / 16 / 50 | Hydrocarbon / Ceramic / Woven Glass | RO4350B.pdf |
| RO3003 | ROGERS | 77 GHz | 0.0013 | 3.00 | 500 (TGA) | 17 / 16 / 25 | PTFE + Ceramic Filling | RO3003.pdf |
| RO5880 | ROGERS | 110 GHz | 0.0009 | 2.20 | 500 (TGA) | 22 / 28 / 173 | Reinforced PTFE | RO5880.pdf |
| RO5870 | ROGERS | 110 GHz | 0.0012 | 2.33 | 500 (TGA) | 31 / 48 / 237 | Reinforced PTFE | RO5870.pdf |
Processing PTFE and ceramic materials requires specialized knowledge and equipment. NextPCB has extensive experience in high-reliability manufacturing, particularly for complex high-frequency and hybrid stack-ups.
| Capability Highlight | Benefit |
|---|---|
| Hybrid Stack-ups | Expert capability in Rogers + FR-4 hybrid lamination to optimize cost. |
| Advanced Processing | Support for Laser-Drilled Microvias (HDI), Back Drilling, and specialized surface treatments essential for PTFE. |
| Strict Impedance | Impedance control tolerance as tight as ±5%. |
| Feature | NextPCB Capabilities | Notes on Advanced/Standard |
|---|---|---|
| Layers | 1 - 32 Layers | Supports complex high-layer count hybrid compression. |
| Board Thickness | Standard: 0.6mm – 3.2mm | Thinner/thicker boards (e.g., 0.1mm up to 6.0mm) available upon inquiry/special process evaluation. |
| Min Trace/Space | Common: 3mil / 3mil | Advanced manufacturing can achieve 2.5mil / 2.5mil (dependent on copper weight). |
| Copper Weight | Standard: Up to 4oz | Advanced Capability: Outer layers up to 10oz. (Standard service commonly uses 1oz or 2oz). |
| Surface Finishes | ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold | |
| Advanced Tech | HDI (Blind/Buried Vias), Back Drilling, Resin Plugged Vias, Castellated Holes | Essential processes for high-frequency, complex designs. |
Choosing a Rogers PCB is a commitment to signal integrity. Whether you are designing a 77GHz automotive radar using RO3003 or a cost-effective microwave link using RO4350B, NextPCB has the stock and the manufacturing expertise to bring your design to life.
Ready to start?Visit our Online Quote System to upload your Gerber files, or contact our engineering team for advice on material selection and stack-up design.
Material: SYTECH
Layer Count: 4 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 0.1mm/0.1mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG+OSP
Material: Fr-4
Layer Count: 4 layers
PCB Thickness: 1.4mm
Min. Trace / Space Outer: 0.065mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
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