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Rogers PCBs

Rogers PCBs

In the world of high-performance electronics—particularly in RF (Radio Frequency) and Microwave applications—"Rogers PCB" is a name that commands respect. For many engineers, it is not just a brand; it is synonymous with high frequency, high speed, and superior reliability.

This guide provides an in-depth look at Rogers PCBs, comparing them with standard materials and providing a detailed specification list of Rogers materials available at NextPCB.

What is a Rogers PCB?

A Rogers PCB refers to a printed circuit board manufactured using laminates produced by the Rogers Corporation. Unlike traditional FR-4 boards, which use epoxy resin and glass fiber, Rogers laminates are typically based on ceramics, hydrocarbons, or PTFE (Polytetrafluoroethylene) composites.

These materials are engineered to maintain extremely low signal loss and a highly stable Dielectric Constant (Dk) even at very high frequencies (up to 110 GHz).

High-frequency electronics product selector guide sample showing multiple RF microstrip test patterns on a substrate panel

Source: https://www.rogerscorp.com/advanced-electronics-solutions/ro4000-series-laminates/ro4000-lopro-laminates

Why Choose Rogers? Core Advantages

While Rogers materials come at a higher cost than standard FR-4, they offer specific performance characteristics that are non-negotiable for designs operating above 500MHz.

  • Extremely Low Dielectric Loss: With a Dissipation Factor (Df) as low as 0.0009, Rogers materials minimize signal attenuation.
  • Stable Dielectric Constant (Dk): Dk remains consistent across frequency and temperature changes, which is vital for impedance control.
  • Superior Thermal Management: Materials like the RO4000 series offer high thermal conductivity to prevent overheating in power amplifiers.
  • Low Moisture Absorption: Ideal for outdoor base stations and automotive radar sensors.

Rogers PCB vs. FR-4: Key Differences

Feature Rogers Material (e.g., RO4350B) Standard FR-4 Performance Impact
Frequency Ideal for > 1GHz (RF/Microwave) Typically < 1GHz Rogers maintains signal clarity at high frequencies.
Dissipation Factor (Df) Very Low (~0.0037) Higher (~0.020) Rogers minimizes signal transmission loss.
Dielectric Constant (Dk) Stable & Precise Fluctuates Rogers allows for precise impedance control.

NextPCB Expert Tip: To balance performance and budget, consider a Hybrid Buildup. Use Rogers material for critical signal layers and standard FR-4 for power/ground layers.

NextPCB High-Frequency PCB Materials

At NextPCB, we understand that selecting the right material is the first step to a successful RF design. NextPCB’s PCB manufacturing capabilities cover both PTFE and non-PTFE Rogers laminates for consumer to extremely high-frequency applications.

Below is a list of the most popular Rogers materials we support. For other low-loss options, you can also view our high-speed materials.

Material Code Brand Max Freq Df (@10GHz) Dk (@10GHz) Tg/Td (°C) CTE (ppm/°C) X/Y/Z Type Datasheet
RO4003C ROGERS 30 GHz 0.0027 3.38 280 (TMA) 11 / 14 / 46 Hydrocarbon / Ceramic / Woven Glass RO4003C.pdf
RO4350B ROGERS 30 GHz 0.0037 3.48 280 (TMA) 14 / 16 / 50 Hydrocarbon / Ceramic / Woven Glass RO4350B.pdf
RO3003 ROGERS 77 GHz 0.0013 3.00 500 (TGA) 17 / 16 / 25 PTFE + Ceramic Filling RO3003.pdf
RO5880 ROGERS 110 GHz 0.0009 2.20 500 (TGA) 22 / 28 / 173 Reinforced PTFE RO5880.pdf
RO5870 ROGERS 110 GHz 0.0012 2.33 500 (TGA) 31 / 48 / 237 Reinforced PTFE RO5870.pdf

Note on Selection:

  • RO4000 Series (RO4350B/RO4003C): Best balance of performance and cost. Easy to process (compatible with FR-4 processes).
  • RO3000 Series: Excellent Dk stability, ideal for automotive radar (77 GHz).
  • RT/duroid (RO5880): Ultra-low loss for millimeter-wave and aerospace applications.

NextPCB Rogers Manufacturing Capabilities

Processing PTFE and ceramic materials requires specialized knowledge and equipment. NextPCB has extensive experience in high-reliability manufacturing, particularly for complex high-frequency and hybrid stack-ups.

Capability Highlight Benefit
Hybrid Stack-ups Expert capability in Rogers + FR-4 hybrid lamination to optimize cost.
Advanced Processing Support for Laser-Drilled Microvias (HDI), Back Drilling, and specialized surface treatments essential for PTFE.
Strict Impedance Impedance control tolerance as tight as ±5%.

Detailed Fabrication Specifications

Feature NextPCB Capabilities Notes on Advanced/Standard
Layers 1 - 32 Layers Supports complex high-layer count hybrid compression.
Board Thickness Standard: 0.6mm – 3.2mm Thinner/thicker boards (e.g., 0.1mm up to 6.0mm) available upon inquiry/special process evaluation.
Min Trace/Space Common: 3mil / 3mil Advanced manufacturing can achieve 2.5mil / 2.5mil (dependent on copper weight).
Copper Weight Standard: Up to 4oz Advanced Capability: Outer layers up to 10oz. (Standard service commonly uses 1oz or 2oz).
Surface Finishes ENIG, Immersion Silver, Immersion Tin, OSP, Hard Gold  
Advanced Tech HDI (Blind/Buried Vias), Back Drilling, Resin Plugged Vias, Castellated Holes Essential processes for high-frequency, complex designs.

Conclusion

Choosing a Rogers PCB is a commitment to signal integrity. Whether you are designing a 77GHz automotive radar using RO3003 or a cost-effective microwave link using RO4350B, NextPCB has the stock and the manufacturing expertise to bring your design to life.

Ready to start?Visit our Online Quote System to upload your Gerber files, or contact our engineering team for advice on material selection and stack-up design.

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