HDI PCB

HDI PCB is characterized by high-density features, including laser micro vias, fine lines, and high-performance thin materials. This increased density can support more functions per unit area. because of its higher circuit density than normal PCBs, the design of HDI PCB can incorporate finer lines and spacing, smaller through holes and pads, and higher connection with pad density. HDI PCBs have blind vias and buried vias, and generally contain micro vias with a diameter of 0.006 or less.


The advantages and applications of HDI technology.
-Compact design
The combination of micro vias, blind vias, and buried vias greatly reduces board space. With the support of HDI technology, a standard 8-layer through-hole PCB can be simplified into a 4-layer HDI PCB but with the same functions.


- Excellent signal integrity
With smaller vias than normal PCBs, all stray capacitance and inductance will be reduced. Combining the technology of bonding vias and vias in pads helps to shorten the length of the signal path. These will lead to faster signal transmission and better signal quality.


-High reliability
HDI technology easier wiring and connection, and provides PCBs with better durability and reliability under hazardous conditions and extreme environments.


-Save costs
If the traditional pressing process is used and the board layer exceeds 8 layers, then more manufacturing costs are required. But HDI technology can reduce costs and maintain functional purpose.


This has promoted major advances in mobile phones, computer products, and other new products. Including touch screen computers, 4G communications, and military applications, such as avionics and smart military equipment.


The birth of HDI PCB brings more possibilities for portable electronic devices and also brings more challenges to PCB manufacturers. In order to adapt to the miniaturization and multi-function trend of electronic products, NextPCB has made a lot of efforts to improve the level of equipment and the professional level of employees. You can provide us with HDI design, we will provide you with satisfactory services and HDI products.

We have the ability to manufacture up to 20 layers of HDI PCB in various capabilities, please check the table below for the available HDI PCB capabilities:

 

Items

Manufacturing Capabilities

Layer Count

4-20 Layers

Quality Level

IPC 6012 2,IPC 6012 3

Materials

g 140°C FR4,Tg 150°C FR4,Tg 170°C FR4,Special Materials

Board Thickness

0.4-6.0mm

Min. Trace/Min. Trace Spacing

≥3mil

Min. hole size

0.15mm-0.3mm

Solder Mask

We have green, red, white, yellow, blue, black, and matte black solder mask color.

Legend

white, yellow, blue, black

Surface Finish

Tin / Lead Solder (HASL), ENIG,OSP

Finished Copper Weight

0.5-13oz

Recommended Products

  • HDI-14 layers

    Material: Fr-4

    Layer Count: 14 layers

    PCB Thickness: 1.6mm

    Min. Trace / Space Outer: 4/4mil

    Min. Drilled Hole: 0.25mm

    Via Process: Tenting Vias

    Surface Finish: ENIG

  • HDI-6 layers

    Material: Fr-4

    Layer Count: 6 layers

    PCB Thickness: 1.6mm

    Min. Trace / Space Outer: 3/3mil

    Min. Drilled Hole: 0.25mm

    Via Process: Tenting Vias

    Surface Finish: ENIG

  • HDI-10 layers

    Material: Fr-4(+RCC)

    Layer Count: 10 layers

    PCB Thickness: 1.6mm

    Min. Trace / Space Outer: 3/3mil

    Min. Drilled Hole: 0.125mm

    Via Process: Tenting Vias

    Surface Finish: ENIG

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