PCB Manufacturer & PCB Assembly

6-Layer PCB Stackup Design Principles and HDI Case Study

Posted on April 27, 2026 by NextPCB Content Team

Explore 6-layer PCB stackup types and 1+4+1 HDI solutions. Optimize signal integrity using NextPCB's impedance tools and DFM checks for reliable manufacturing.

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Tag: NextPCB HDI PCBs Hardware Engineer signal integrity (SI) PCB Stackup 6 layer pcb HQDFM DFM

Cost-Driven High-Speed Stackup: 4-Layer & 6-Layer Impedance Control Guide

Posted on April 27, 2026 by NextPCB Content Team

Learn to optimize 4-layer & 6-layer PCB stackups for high-speed signals. Practical guide on impedance control, resin flow, and cost-reduction manufacturing.

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Tag: cost-efficiency 4-layer pcb PCB manufacturing PCB design Impedance Control signal integrity (SI) PCB Stackup 6 layer pcb

What is an SMA Connector? The Ultimate Guide for High-Frequency RF PCB Design

Posted on April 27, 2026 by NextPCB Content Team - L

Discover everything you need to know about the SMA connector, from technical specs and RP-SMA differences to expert PCB layout tips for high-frequency RF designs.

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Tag: pcb layout wireless networks RF design High Frequency PCB PCB Connector

NextPCB PCB Impedance Control and Stack-up Query System Guide

Posted on April 27, 2026 by NextPCB Content Team - L

Guide to NextPCB's impedance control system. Explore 4-20 layer stack-ups, solder mask parameters, and professional HQDFM design tools.

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Tag: NextPCB PCB manufacturing PCB design Layer Stack-up PCB Impedance Control HQDFM DFM impedance calculation

What Is RF PCB? Understanding the Core Differences from Digital Circuits

Posted on April 27, 2026 by NextPCB Content Team

Learn what is RF PCB and how it differs from digital circuits. This technical guide covers impedance matching, signal integrity, and 2026 trends like 6G and Sub-THz routing for engineers.

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Tag: PCB manufacturing PCB design RF circuit High-frequency PCB RF PCB layout signal integrity (SI) PCB Impedance Control pcb substrates

RF PCB Routing Design: Physical Layout to Manufacturing-Driven Impedance Control

Posted on April 27, 2026 by NextPCB Content Team - L

Master RF PCB routing guidelines: trace length, smooth corners, and width transitions. Learn how DFM and stackup planning ensure precise impedance control.

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Tag: PCB design RF circuit PCB routing High-frequency PCB signal integrity (SI) PCB Stackup PCB Impedance Control HQDFM DFM

Top 10 Free PCB Design Software (2026)

Posted on April 16, 2026 by NextPCB Content Team - S

Discover the best free PCB design software in 2026. Compare KiCad, EasyEDA, Flux.ai, and more. Learn how to choose the right EDA tool for your hardware startup.

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Tag: NextPCB kicad PCB design pcb design software hardware EDA/CAD software HQDFM DFM electronics engineering

PCB Design for IoT Devices: Layout, Stackup, Power & Reliability Challenges

Posted on March 23, 2026 by NextPCB Content Team - iotbyhvm

Design reliable IoT PCBs with proper layout, stackup planning, power integrity control, RF discipline, and long-term reliability strategies

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Tag: PCB design PCB Stackup IoT devices IoT

HDI PCB Design for Compact IoT Controllers: A Step-by-Step Project Guide

Posted on March 20, 2026 by NextPCB Content Team - iotbyhvm

Explore a step-by-step HDI PCB design workflow for compact IoT controllers using a 1+4+1 stackup for clean BGA fanout, stable power and RF routing

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Tag: HDI PCBs PCB design Blind & Buried Vias IoT products High-Speed PCB Design DFM stackup design

How to generate a complete Bill of Materials (BOM) file from KiCad?

Posted on April 12, 2026 by Carmen Zheng

With so many turnkey assembly providers, one would have thought the process of exporting a Bill of Materials or BOM, would be relatively straight forward. Unfortunately, for KiCad that is still not the case. In this article, we cover how to generate and build a complete Bill of Materials from KiCad for various PCBA services.

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Tag: kicad eda software Production files guides

PCB Panelization Design Guide: V-Score, Tab-Route & Cost Optimization

Posted on February 11, 2026 by NextPCB Content Team

Master PCB panelization (array) design to reduce manufacturing costs and improve assembly efficiency. Learn about V-scoring, tab-routing, fiducials, and 2026 DFM standards. Get a free quote from NextPCB today.

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Tag: NextPCB PCB assembly PCB manufacturing PCB design Low Cost PCB smt assembly DFM PCB Panelization

PCB Layer Orientation Guide: Avoiding Mirrored Board Errors

Posted on February 11, 2026 by NextPCB Content Team

Learn how to prevent costly mirrored PCB errors with our expert guide on layer orientation, copper labeling best practices, and 2026 DFM standards for PCBA.

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Tag: Layer Orientation PCB manufacturing PCB design PCBA copper Gerber files DFM software electronics engineering

PCB Panelization Guide: V-Score vs. Tab-Routing & DFM Rules

Posted on February 11, 2026 by NextPCB Content Team

Master PCB panelization for 2026. Compare V-score vs. tab-routing, learn residual thickness for thin PCBs, and discover laser depaneling for 01005 components.

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Tag: PCB manufacturing PCBA turnkey services smt assembly High-Density Interconnectivity Mouse Bites DFM panelization electronics engineering

PCB Via Tenting, Plugging, and Filling: The Engineering Guide

Posted on February 10, 2026 by NextPCB Content Team

Compare PCB via tenting, plugging, and filling (VIPPO). Learn IPC-4761 standards to prevent solder wicking and improve PCBA yield. Professional DFM guide by NextPCB.

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Tag: PCB assembly solder mask Via Covering PCB manufacturing VIPPO structure Via Tenting IPC Standard DFM via plugging via filling

PCB Gold Fingers: Design & Manufacturing Guide

Posted on February 10, 2026 by NextPCB Content Team

Learn professional PCB gold fingers design & manufacturing. Covers Hard Gold vs ENIG, IPC standards, beveling & DFM tips for reliable PCB assembly and connectors.

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Tag: Surface Finish Gold Fingers rigid PCB pcb design rules signal integrity (SI) IPC Standard high-speed design

PCB Stackup: Core, Prepreg & Copper Foil

Posted on April 09, 2026 by NextPCB Content Team

Master PCB stackup: Learn the differences between Prepreg, Core, and Copper Foil. Optimize Dk/Df & insertion loss for 2026. Get a free DFM check at NextPCB.

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Tag: NextPCB PCB manufacturing Impedance Control high-speed circuits PCB material PCB Stackup PCB prepreg

How to generate pick and place (centroid) files in KiCad? (Updated for KiCad 9)

Posted on April 28, 2026 by Carmen Zheng

Export pick and place files in KiCad for JLCPCB, PCBWay, NextPCB, or others. Step-by-step guide explaining CSV/ASCII formats, units, and export options for PCB assembly.

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Tag: PCB assembly kicad eda software Production files guides

2026 UHDI Design: Is Gerber Precision Killing Your High-End PCB Yield?

Posted on February 03, 2026 by NextPCB Content Team

Boost UHDI PCB yields in 2026. Learn why 2:4 Gerber resolution causes 17% errors in 15μm traces and why switching to Metric 4:6 is vital for signal integrity.

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Tag: NextPCB PCB fabrication HDI PCBs Gerber File signal integrity (SI) DFM UHDI

Why Gerber Files Are the Sole Criterion for Solder Mask Definition

Posted on January 19, 2026 by NextPCB Content Team

Ensure PCB reliability: Why Gerber files rule solder mask. Avoid BGA via errors & missing test points with NextPCB DFM tools to match design intent perfectly.

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Tag: NextPCB solder mask PCB fabrication PCB design Gerber File hardware design Via in Pad Via Tenting HQDFM DFM quality control

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

Posted on November 28, 2025 by NextPCB Content Team

Uncover the 6 critical PCB manufacturing cost traps—from material selection (High-TG/Copper thickness) to drilling density and surface finish. Learn NextPCB's actionable strategies to optimize your design and procurement process to drastically lower overheads and secure a competitive edge.

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Tag: pcb order NextPCB PCB assembly PCB fabrication PCB manufacturing PCB design Turnkey PCBA Cost PCB Cost pcba cost

6-Layer PCB Stackup Design Principles and HDI Case Study

Cost-Driven High-Speed Stackup: 4-Layer & 6-Layer Impedance Control Guide

What is an SMA Connector? The Ultimate Guide for High-Frequency RF PCB Design

NextPCB PCB Impedance Control and Stack-up Query System Guide

What Is RF PCB? Understanding the Core Differences from Digital Circuits

RF PCB Routing Design: Physical Layout to Manufacturing-Driven Impedance Control

Top 10 Free PCB Design Software (2026)

PCB Design for IoT Devices: Layout, Stackup, Power & Reliability Challenges

HDI PCB Design for Compact IoT Controllers: A Step-by-Step Project Guide

How to generate a complete Bill of Materials (BOM) file from KiCad?

PCB Panelization Design Guide: V-Score, Tab-Route & Cost Optimization

PCB Layer Orientation Guide: Avoiding Mirrored Board Errors

PCB Panelization Guide: V-Score vs. Tab-Routing & DFM Rules

PCB Via Tenting, Plugging, and Filling: The Engineering Guide

PCB Gold Fingers: Design & Manufacturing Guide

PCB Stackup: Core, Prepreg & Copper Foil

How to generate pick and place (centroid) files in KiCad? (Updated for KiCad 9)

2026 UHDI Design: Is Gerber Precision Killing Your High-End PCB Yield?

Why Gerber Files Are the Sole Criterion for Solder Mask Definition

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

Categories

Recommended Article:

BLOG

6-Layer PCB Stackup Design Principles and HDI Case Study

Cost-Driven High-Speed Stackup: 4-Layer & 6-Layer Impedance Control Guide

What is an SMA Connector? The Ultimate Guide for High-Frequency RF PCB Design

NextPCB PCB Impedance Control and Stack-up Query System Guide

What Is RF PCB? Understanding the Core Differences from Digital Circuits

RF PCB Routing Design: Physical Layout to Manufacturing-Driven Impedance Control

Top 10 Free PCB Design Software (2026)

PCB Design for IoT Devices: Layout, Stackup, Power & Reliability Challenges

HDI PCB Design for Compact IoT Controllers: A Step-by-Step Project Guide

How to generate a complete Bill of Materials (BOM) file from KiCad?

PCB Panelization Design Guide: V-Score, Tab-Route & Cost Optimization

PCB Layer Orientation Guide: Avoiding Mirrored Board Errors

PCB Panelization Guide: V-Score vs. Tab-Routing & DFM Rules

PCB Via Tenting, Plugging, and Filling: The Engineering Guide

PCB Gold Fingers: Design & Manufacturing Guide

PCB Stackup: Core, Prepreg & Copper Foil

How to generate pick and place (centroid) files in KiCad? (Updated for KiCad 9)

2026 UHDI Design: Is Gerber Precision Killing Your High-End PCB Yield?

Why Gerber Files Are the Sole Criterion for Solder Mask Definition

6 Cost Mistakes to Avoid for Lower PCB Cost & Overheads

Categories

Recommended Article: