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Get precision-engineered PCB prototypes in as fast as 24 hours, backed by ISO-certified quality and competitive pricing.
NextPCB delivers fast, affordable, high-quality PCB prototyping & production—1–32 layers (HDI, rigid-flex)—ISO 9001/IATF 16949/ISO 14001, UL, RoHS, REACH. > Explore our pcb capabilities.
Receive your 1–2 layer PCB prototypes in as fast as 24 hours, with no MOQ. Offer exclusive discount for new customers.
We support up to 32-layer boards, including HDI, high-frequency, and rigid-flex designs. Materials range from FR-4 to Rogers and Arlon.
With over 15 years of experience, NextPCB offers comprehensive services from prototyping to mass production, ensuring quality and reliability.
Benefit from over 10 years of layout experience, supporting up to 60GHz designs and 42-layer boards. We offer DFM, DFA, EMC, and SI verification.
Access a global supply chain with over 600,000 in-stock parts, ensuring competitive pricing and lead times. All components are 100% genuine.
Utilize our free online tools for DFM, DFA, and Gerber viewing to optimize your designs before submission.
We offer free functional testing for up to 10 prototype units, ensuring your designs meet performance expectations before mass production.
Leverage our robust global logistics network to ensure timely delivery of your prototypes, reducing lead time and minimizing production delays.
Explore NextPCB's diverse PCB layer offerings, from single-sided to advanced HDI designs. Our capabilities cater to various applications, ensuring optimal performance and reliability.
High density interconnect boards for space-constrained designs.
Learn More| Parameter | Standard PCB | Advanced PCB |
|---|---|---|
| Layer Count | 1–2 layers | 4–32 layers |
| Minimum Trace Width / Spacing | 3.5 mil (0.089 mm) | 3 mil (0.076 mm) |
| Minimum Hole Diameter | 0.2 mm (8 mil) | 0.15 mm (6 mil) |
| Surface Finish | HASL (Hot Air Solder Leveling) | ENIG (Electroless Nickel Immersion Gold), Immersion Silver, OSP (Organic Solderability Preservative) |
| PCB Dimensions | Min: 10 x 10 mm, Max: 520 x 600 mm | Min: 10 x 10 mm, Max: 400 x 500 mm |
| Material Options | FR-4 (TG130, TG150, TG170), FR-1 | High-frequency materials (e.g., Rogers RO3000, RO4000 series) |
| Impedance Control | ±10% | ±5% |
| Thermal Management | Standard thermal conductivity | High thermal conductivity materials available (e.g., RO4000 series) |
| Substrate Materials | FR4, High TG, Rogers, Shengyi, ITEQ, TU, Nanya | |
| Copper Thickness | Up to 10oz | |
| Colors | Green, Blue, Red, Yellow, White, Black, Matte Black | |
| Technologies |
HDI 3 blind/buried vias, impedance control, via capping, castellated holes, edge plating |
|
| Accepted File Formats | Gerber RS-274x/Gerber X2/ODB++ from Altium, KiCad, Eagle, etc. | |
| Other PCB Types | Metal Core, Flex, Rigid-Flex, Advanced | |
Automated optical inspection for surface defects
Verifies multilayer alignment and hidden solder joints.
Monitors trace impedance for signal integrity.
Confirms connectivity and checks for shorts and opens.
Ensures solder mask precision and durability.
Camera-guided drilling for accuracy.
erifies performance under real conditions.
ISO 9001, ISO 14001, IATF 16949, UL, RoHS, REACH compliance.
NextPCB's PCB prototypes are utilized across various industries and applications:
These applications highlight the versatility and importance of PCB prototypes in various sectors.
NextPCB operates state-of-the-art facilities to support their PCB prototype services:
These facilities are equipped with advanced machinery and adhere to stringent quality control measures, ensuring the production of high-quality PCB prototypes.
Here at NextPCB, we empower innovation through precision manufacturing. Below are concise technical answers to common PCB prototyping questions in line with NextPCB's engineering ethos:
A prototype is a functional pre-production unit used to validate design integrity, electrical performance, and manufacturability before mass production.
Motherboards are multilayer PCBs engineered with optimized circuitry for component integration and signal integrity – they form the backbone of electronic systems.
Refers to rapid fabrication equipment (e.g., laser drills, plating lines, AOI systems) enabling high-precision low-volume production for design verification.
Risk Mitigation: Identify signal/thermal flaws early
Cost Control: Avoid mass-production rework
DFM Validation: Confirm manufacturability
Finalize schematics/gerbers
Select materials (FR-4, HF, etc.)
Utilize NextPCB's instant-quote platform for prototyping services
Perform functional/EMC testing
Combine 3D-printed enclosures with precision-assembled PCBs. NextPCB offers integrated PCB + Assembly services under one roof.
Design: Use Altium/KiCad
Optimize: Follow IPC standards
Produce: Upload gerbers via NextPCB
We handle fabrication, component sourcing, and assembly
Cloning patented/copyrighted layouts violates IP laws. Reverse-engineering for interoperability may have limited exceptions – always consult legal counsel.
Unique circuitry layouts meeting patent criteria (novelty, utility) are patentable. Functional aspects > aesthetic designs.
An engineered initiative developing printed circuit boards for specific applications – from IoT wearables to aerospace control systems.
Rigid: FR-4, Aluminum-backed (industrial use)
Flexible: Polyimide/Kapton® (wearables, medical)
Rigid-Flex: Hybrid (military/aerospace applications)
Still have questions? Our technical support team is here to help.
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