PCB Design, Fabrication & Assembly Blog

E-Test

Posted on October 21, 2025 by NextPCB

Hey guys, today we are going to talk about E-Test.

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Automated X-Ray Inspection (AXI) for PCBs explained: Learn the differences between 2D and 3D AXI systems, how AXI excels over AOI, defect detection targets like BGA voids, and key applications across electronics, automotive and aerospace.

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Tag: NextPCB NextPCB order X-RAY

A.O.I

Posted on October 21, 2025 by NextPCB

Automated Optical Inspection (AOI) as a crucial visual inspection method used by PCB assembly manufacturers to ensure quality. With the increasing complexity and miniaturization of modern circuits, AOI provides a reliable and efficient way to identify defects in both printed circuit boards (PCBs) and PCB assemblies (PCBAs).AOI can detect surface and dimensional defects, misplaced components, and solder issues, offering high accuracy and cost-effectiveness compared to other inspection methods like X-ray. Its flexibility allows for inspections at various stages of production, enhancing the overall quality control process.

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Layer Stack-up

Posted on April 09, 2026 by NextPCB

Hey guys, let's talk about Layer Stack-up.

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Back drilling

Posted on October 21, 2025 by NextPCB

Back drilling is the process of removing stubs from plated-through-holes (vias) in multilayered PCBs by the second drilling and allowing to transfer of signals from one layer to another layer of the board.

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Via-in-pad

Posted on October 21, 2025 by NextPCB

This article discusses via in pad technology, increasingly popular in PCB design for fine-pitch BGAs and compact electronics. via in pad places vias directly under component pads, enhancing thermal management, increasing component density, and optimizing routing for high-speed applications. Key benefits include improved heat dissipation and reduced inductance.

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Blind & Buried Vias

Posted on October 21, 2025 by NextPCB

Explores the intricacies of blind and buried vias in PCB fabrication, essential for connecting inner layers while optimizing space. Blind vias connect outer layers to inner ones without penetrating the entire board, while buried vias link inner layers only, remaining invisible from the exterior. Key advantages include reduced PCB volume and increased surface area for components, although they incur higher costs due to complex manufacturing processes.

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PCB Assembly Overview

Posted on October 21, 2025 by NextPCB

Hey guys, let's talk about PCB Assembly Overview

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Tag: NextPCB PCB assembly through-hole mounting technology THT THM SMT

PCB Design & Layout

Posted on October 21, 2025 by NextPCB

Hey guys, let's talk about PCB Design & Layout.

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Printed Circuit Board Materials

Posted on October 21, 2025 by NextPCB

Hey, we are going to talk about Printed Circuit Board Materials.

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Tag: NextPCB NextPCB order PCB fabrication Printed Circuit Board Materials PCB manufacturing

PCB Price Composition

Posted on October 21, 2025 by NextPCB

Hey guys, let's talk about PCB Price Composition.

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SMT Assembly Capabilities

Posted on October 21, 2025 by NextPCB-LL

Discover NextPCB's SMT assembly capabilities from printing to inspection with advanced equipment, flexible production, and multiple package options.

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Tag: NextPCB NextPCB order PCB assembly sourcing components PLCC SOIC QFN QFP UBGA SMT Assembly Capabilities through hole components Ball Grid Array BGA

Mixed Assembly Advantages

Posted on October 10, 2025 by NextPCB

Hey guys, we are going to talk about Mixed Assembly Advantages.

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Flexible PCBs

Posted on October 21, 2025 by NextPCB

What are flex PCBs? Learn about the different types of flex PCBs, their applications, advantages and discover NextPCB's flex PCB solutions for consumer electronics, automotive, aerospace, medical and industrial electronics.

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Tag: NextPCB Flexible PCBs cost-efficiency PCB prototype PCB fabrication FPC