IoT PCB & PCBA
Compact IoT boards, built and tested
For smart home and connected devices, from first prototype to small batches, with engineers you can talk to before you order.
Rigid-flex and HDI boards · PCBA from 1 piece · Free DFM review
Why connected-device teams work with us
Fast iterations, compact boards and direct access to engineers.
Engineers on your project
Automated DFM pre-review in about a minute, then an engineer within 30 minutes. Talk to us before you order, not after.
Rigid-flex and flex
Rigid-flex with up to 32 rigid and 6 flex layers, and flex boards from one layer, for compact housings with fewer connectors.
PCB and PCBA in one place
Fabrication, component sourcing, assembly, firmware flashing and testing, with no hand-offs between suppliers.
PCB types for IoT devices
Start from the form factor, then pick the structure.
Folded designs for compact housings, with fewer connectors.
2–32 rigid layers · 1–6 flex layers
Sensor, antenna and board-to-board links in tight spaces.
1–6 layers · 2/2 mil
Dense modules with fine-pitch chips.
1+N+1 to 3+N+3 · 0.075 mm laser via
Multilayer FR-4
Main boards for hubs, gateways and controllers.
0.6–3.2 mm · 3/3 mil
Antenna and RF sections of wireless devices.
Rogers or PTFE · hybrid with FR-4
Lead times
Typical times for standard prototype orders.
| PCB build time |
| 1–2 layers | As fast as 24 hours |
| 4 layers | 1–2 days |
| 6 layers and above | 2–3 days |
| HDI | 8–14 days, by structure and layer count |
| Flex and rigid-flex | Confirmed at quotation |
| PCB assembly |
| Express | 24 hours once all parts are ready |
| Standard | 5–7 working days with parts from HQ Online |
| Order quantity | From 1 piece |
Your online quote shows the exact timing for your order. Get a PCB quote · Get a PCBA quote
IoT PCB capabilities
Best values from our published capability pages, by board type.
| Rigid-flex |
| Layers | Rigid 2–32, flex 1–6 |
| Trace / space | Rigid 3/3 mil, flex 2/2 mil |
| Min drill | 0.1 mm |
| Flex material | Polyimide, with PI coverlay or flexible solder mask |
| Stiffeners | FR-4, PI, aluminum or stainless steel |
| Flex |
| Layers | 1–6 |
| Thickness / copper | 0.1–0.45 mm / 1/3–2 oz |
| Trace / space / drill | 2/2 mil / 0.1 mm |
| Surface finish | ENIG, OSP, electroplated gold |
| HDI |
| Structure | 1+N+1, 2+N+2, 3+N+3; any-layer on advanced boards |
| Laser microvia | 0.075–0.15 mm |
| Via-in-pad | Filled and plated, filled via up to 0.45 mm |
| Trace / space | 3.5/3.5 mil standard; down to 2/2 mil on advanced boards |
| Multilayer FR-4 |
| Layers | Up to 32; 40+ on advanced boards |
| Finished thickness | 0.6–3.2 mm (1.0, 1.2, 1.6 mm common) |
| Trace / space (1 oz outer) | 3/3 mil |
| Drill / aspect ratio | 0.15 mm mechanical / 12:1 |
| Impedance tolerance | ±10% (>50 Ω), ±5 Ω (≤50 Ω) |
| Special features | Castellated holes, gold fingers, via-in-pad |
| High frequency |
| Materials | Rogers 4000/3000 series, Taconic, PTFE; hybrid with FR-4 |
| Dk / Df | 2.55–10.2 / 0.0013–0.0037 at 10 GHz |
| Finish and test |
| Surface finish | ENIG, lead-free HASL, OSP; ENEPIG, hard gold on advanced boards |
| Electrical test | Flying probe; fixture test up to 14,000 pads |
| Reports | Shipping, microsection, impedance test |
Fabrication follows IPC-6012 and IPC-A-600, and rigid-flex follows IPC-6013, up to Class 3. Full tables: Standard PCB · Advanced PCB
PCB assembly for connected devices
From component sourcing to a tested, working board.
Turnkey, consigned or mixed
We source everything, you send your own parts, or you split it. Pre-purchase key chips and store them with us.
SMT, wave and through-hole
Double-sided SMT, wave soldering and through-hole assembly on one order.
Firmware flashing and testing
Firmware and bootloader flashing, plus UART, I2C, SPI, USB, memory and power tests from your test plan.
Coating and box build
Selective conformal coating with infrared curing, plus enclosures, kitting, printing and cabling.
| Smallest passives | 01005 |
| Fine-pitch ICs | 0.38 mm pitch |
| BGA / LGA | 0.25 mm ball pitch |
| Boards | Single- or double-sided; FR-4, flex, rigid-flex, metal core |
| Inspection | SPI, AOI, X-ray (BGA, QFN, LGA), ICT, FCT |
| Moisture control | Humidity cards, sealed packaging, pre-baking when needed |
| Workmanship | IPC-A-610 Class 2, Class 3 on request |
Learn more: assembly capabilities · turnkey PCBA · functional testing · cable assembly
Example project: ESP32-C3 IoT board
A 4-layer smart-sensing board for local edge inference, designed in KiCad 9, manufactured and assembled by NextPCB.
Assembled board (silkscreen shows V2.0). PCB manufactured and assembled by NextPCB.
Design preview in the KiCad 3D viewer (silkscreen shows V3.0).
| Board | 4-layer PCB, designed in KiCad 9 |
| Processor | ESP32-C3 with Wi-Fi and Bluetooth LE |
| Sensing | BME280 environment sensor, ambient light sensor, microphone with pre-amplifier |
| Storage and interfaces | microSD slot, SPI flash, I2C, SPI, USB-to-UART bridge |
| Power | USB-C input, LiPo battery connector, onboard 3.3 V and 5 V regulation |
The board runs inference and decisions locally, without cloud dependence, for uses such as smart home monitoring and predictive maintenance. See the design and build details in the full article: KiCad 9 design and assembly of an ESP32 IoT 4-layer PCB
Design tips for a smooth build
Short checks that save a revision.
Start from a proven stack-up
Use our reference 4- and 6-layer stack-ups with impedance values. A 7628 prepreg option can lower BOM cost.
Keep antenna areas clear
Keep copper, ground fill and parts out of the antenna zone, following your module vendor's guidelines.
Add test points
Place test points for power, programming and debug so boards can be flashed and tested after assembly.
Run a free DFM check
Upload your files to HQDFM before ordering to catch manufacturing and assembly issues early.
Stack-ups and impedance values · HQDFM free DFM tool
Certified quality
The quality systems and compliance behind our PCB and PCBA services.
- ≥98%First-pass yield
- ≥98%On-time delivery
- ≤0.05%Quality complaint rate
- 100,000 m²Monthly capacity at our volume PCB site
Third-party RoHS, REACH and PFAS test reports (CTI) are available for boards with ENIG, lead-free HASL or OSP finishes. View all certificates · Quality control
From prototype to production
You
Send requirements
Upload Gerber and BOM, plus pick-and-place files for assembly. Add a test plan if you need functional testing.
Get a PCB quote →
NextPCB
Engineering review
Automated DFM pre-review in about a minute, then an engineer within 30 minutes. Questions that affect cost or process are confirmed with you first.
Try HQDFM →
NextPCB
Build prototypes
PCB build, then assembly with sourcing, SMT, flashing and testing. 1–2 layer boards ship in as fast as 24 hours.
Get a PCBA quote →
Together
Revise and scale
Send revisions with your reorder, then move from samples to small batches and larger runs.
Talk to an engineer →
IoT PCB FAQ
Do you take small prototype orders?
Yes. PCB assembly starts from one piece, and 1–2 layer PCB prototypes have no minimum order quantity and can ship in as fast as 24 hours. Typical build times for multilayer and HDI boards are listed on this page, and flex or rigid-flex timing is confirmed at quotation.
Should I use rigid-flex or a rigid board with a flex cable?
Rigid-flex removes connectors and folds into tight housings, which saves space and removes connector failure points. A rigid board with a separate flex link can suit simpler designs. Send your outline and stack-up idea and our engineers can review both options before you order.
How do you handle fine-pitch parts and module boards?
Assembly handles 01005 passives, 0.38 mm fine-pitch ICs and 0.25 mm BGA or LGA ball pitch, and BGA, QFN and LGA boards are X-ray inspected. BGA and BTC packages with 0.8 mm pitch or below call for HDI: we support 1+N+1 to 3+N+3 structures, laser microvias from 0.075 mm and filled and plated via-in-pad. Castellated (half) holes are also supported, so send the hole size and spacing with your files.
Can you control impedance for antenna and RF traces?
Yes. Impedance tolerance is ±10% above 50 Ω and ±5 Ω at or below 50 Ω, and an impedance test report is available. Rogers, Taconic and PTFE materials, including hybrid stack-ups with FR-4, are available for RF sections. FCC, CE and similar approvals apply to your finished product, not to the PCB or the assembly.
Can you flash firmware and test the assembled boards?
Yes. We support firmware and bootloader flashing and functional tests such as UART, I2C, SPI, USB, Ethernet, memory, voltage, current and power. You provide the test plan, wiring diagram, firmware and fixture, and the fixture can be supplied by you or sourced by us. Discuss wireless or RF tests with our engineers before you order.
How do you handle part shortages and counterfeit risk?
Parts come through HQ Online from global distributors such as DigiKey and Mouser, or directly from manufacturers. Fake, second-hand and refurbished parts are not allowed. You can send your own parts, mix both, or use pre-purchase to buy key chips early and store them with us. No part is substituted without your written confirmation.
How do you handle moisture-sensitive parts?
We use humidity cards and sealed moisture-proof packaging, and parts or materials that need baking can be pre-baked in our ovens. Tell us the moisture sensitivity level and handling requirements for critical parts when you send your BOM.
Can you coat boards or build the complete device?
Yes. We support selective conformal coating with infrared curing for boards used in humid or outdoor environments. Box build services cover enclosures, kitting, printing and cabling.
What happens when I revise the design?
For a repeat order with changes, note the new requirements on your reorder. Our engineers update the production data and the price is updated before production starts. If a question affects cost or process, we confirm it with you first.
Do you sign an NDA?
Yes. We support legally binding NDAs. Contact support@nextpcb.com before you share files if you need one in place first.
NextPCB Capabilities
Process Capabilities
PCB Design-Aid & Layout
Mechanical Parts
Quality
Drills & Throughplating
Factory & Certificate
PCB Assembly Factory Show
Certificate
NextPCB Capabilities
PCB Assembly
Process Capabilities
PCB Design-Aid & Layout
Mechanical Parts
Quality
Drills & Throughplating
Factory & Certificate
