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Industrial Automation PCB & PCBA
PCBs built for the factory floor
For PLCs, drives, robots and sensors, with high-Tg materials, heavy copper and repeatable reorders.
Boards for harsh conditions, repeatable reorders and one source from board to unit.
High-Tg laminates, heavy copper, metal-core options and selective conformal coating.
Repeat orders reuse your previous files, stack-up and impedance parameters.
PCB, parts, assembly, programming, test and box build from one supplier.
Start from the load and the environment, then pick the structure.



Power stages and heat-sensitive control boards.
Aluminum, copper, iron, stainless


Best values from our published capability pages and quote tool, by board type.
| Multilayer and high-Tg | |
| Layers | Up to 40 |
| Tg | 170 °C and above (ShengYi High-Tg, KB TG170) |
| Thickness | 0.6–3.2 mm |
| Max dimension | 1–2 layers 1500 × 600 mm · 4 layers 1500 × 500 mm · 6+ layers 500 × 400 mm |
| Trace / space | 3/3 mil |
| Impedance tolerance | ±10% standard, ±5% on request, TDR verified |
| Insulation | Dielectric strength 750 V/mil, arc resistance over 60 s |
| Copper weights | |
| Standard copper | 0.5, 1 and 2 oz; 3 oz also available |
| Inner-layer core copper | 0.5–4 oz |
| Outer copper, online quote | Up to 6 oz and above |
| Heavy copper process | Up to 10 oz |
| Min. outer trace / space | 1 oz 3/3 mil · 2 oz 5.5/5.5 mil · 3 oz 8/8 mil |
| Solder mask thickness | 10 µm or more over traces, 5 µm or more at trace corners |
| Metal core and copper base | |
| Copper base | 1–2 layers, 1/2/3 W/mK, 0.8–3.0 mm |
| Copper base trace / copper | Down to 4/4 mil, outer copper 0.5 oz up to 6 oz and above |
| Copper base finish | HASL, lead-free HASL, ENIG, OSP |
| Other cores and structures | Aluminum, iron, stainless steel; copper coin, pedestal |
| Rigid-flex and HDI | |
| Rigid-flex layers | Flex 1–6, rigid 2–32 |
| HDI structure | 1–3 step; any-layer on advanced boards |
| Laser microvia | 0.075–0.15 mm |
| Vias, finish and test | |
| Via processing | Tented, opened, solder mask plug, non-conductive fill and cap |
| Press-fit hole tolerance | ±0.05 mm |
| Surface finish | HASL (lead-free or leaded), ENIG, immersion tin, immersion silver, OSP, hard gold |
| Electrical test | Flying probe; fixture test up to 14,000 pads |
| Reports | Shipping, microsection, impedance test |
Values are the best for each board type and do not always combine in one design. Advanced processes such as 3-step HDI, copper coin, rigid-flex and ±5% impedance are confirmed by engineers before quoting. Fabrication follows IPC-6012 and IPC-A-600, up to Class 3. Full tables: Advanced PCB · Standard PCB
What decides board life on the plant floor.
Tg 170 °C and above (ShengYi High-Tg, KB TG170), halogen-free options, UL 94V-0.
Thermal shock, high-temperature, T260/T288, water absorption and insulation resistance tests.
ENIG resists corrosion and takes several soldering passes. Silver can tarnish; OSP shelf life is short.
Cleaning, drying, then automated selective spraying with infrared curing. Potting supported. Send type, thickness and keep-out areas.
High-Tg PCB · Heavy copper PCB · Aluminum PCB · Surface finish options
Large boards, heavy connectors, programmed firmware and tested units.
SMT with selective wave, wave and hand soldering for connectors, terminals and relays. Leaded and lead-free soldering are supported.
Firmware flashing from .hex, .bin and .elf files, functional test and aging. Fixtures can come from you or be built by us.
2D/3D SPI, AOI, 2D/3D X-ray, ICT and functional test. Workmanship to IPC-A-610, up to Class 3.
Enclosures, cabling, kit assembly and heat sink fitting into finished units.

SIPLACE E-series placement machine on our PCBA line.

AOI inspection on our PCBA line.
| Factory | |
| SMT/PCBA site | 15,000 m² with 50 SIPLACE (Siemens) E-series SMT lines |
| Daily capacity | Over 98 million placements |
| Boards and parts | |
| Board size / thickness | 50 × 50 mm to 510 × 460 mm / 0.2–5 mm |
| Component size / height | 01005 to 45 × 98 mm / up to 25 mm |
| Fine pitch | IC 0.3 mm; BGA and LGA 0.25 mm ball pitch |
| Placement accuracy | Chip ±41 µm, IC ±37.5 µm |
| Soldering and inspection | |
| Reflow | 10–12 zone air reflow and nitrogen reflow |
| Through-hole | Selective wave soldering, wave soldering, hand soldering |
| Inspection | 2D/3D SPI, AOI, 2D/3D X-ray, automatic first-article inspection |
| Rework | BGA rework station |
| Services | |
| Added processes | Laser marking, conformal coating, potting, press-fit, assembly, FCT, aging |
| Order quantity | From 1 piece, up to large batches |
Learn more: assembly capabilities · PCB assembly services · functional testing · cable assembly
For products that run for years and get reordered.
Reorders reuse your previous files, including stack-up and impedance parameters.
Engineers contact you first and start only after you agree. Reorder changes are noted on the order.
Pre-purchase and storage avoid shortages. The HQDFM BOM check catches issues early.
HQ Online parts from authorized distributors and manufacturers, with incoming inspection and date code and laser-mark traceability.
Samples and volume runs share one quality management system and inspection stages. Need change-control terms in your supply agreement? Talk to our team before you order.
Typical times for standard prototype orders.
| PCB build time | |
| 1–2 layers | As fast as 24 hours |
| 4 layers | 1–2 days |
| 6 layers and above | 2–3 days |
| HDI | 8–14 days, by structure and layer count |
| Heavy copper, metal core, rigid-flex | Confirmed at quotation |
| PCB assembly | |
| Express | 24 hours once all parts are ready |
| Standard | 5–7 working days with parts from HQ Online |
| Order quantity | From 1 piece |
Sourcing can be turnkey, consigned or mixed. Your online quote shows the exact timing. Get a PCB quote · Get a PCBA quote
The quality systems and compliance behind our PCB and PCBA services.
Final inspection covers dimensions, solderability, peel strength, microsection, thermal shock, ionic contamination and insulation resistance. Orders can include shipping, microsection and impedance reports. Third-party RoHS, REACH and PFAS reports (CTI) are available. Defects found on delivery are repaired or reworked. View all certificates · Quality control
You
Upload Gerber files with copper, finish and coating needs. Add BOM and pick-and-place for assembly.
NextPCB
Automated DFM pre-review in about a minute, an engineer within 30 minutes. Stack-up and copper questions go to you first.
NextPCB
Built at our sample sites, then assembled with sourcing, SMT and testing. First-article debug sets up programming and test.
Together
After samples pass, volume moves to our high-capacity site.
Standard boards use 0.5, 1 and 2 oz copper, and 3 oz is also available. Inner-layer core copper is 0.5–4 oz, our online quote covers outer copper up to 6 oz and above, and the heavy copper process goes up to 10 oz. Minimum outer-layer trace and space is 3/3 mil at 1 oz, 5.5/5.5 mil at 2 oz and 8/8 mil at 3 oz. Send your copper weight, current and layer count so engineers can confirm the stack-up before you order.
High-Tg FR-4 with Tg 170 °C and above is available, including ShengYi High-Tg and KB TG170. We support thermal shock, high-temperature testing, T260/T288 delamination time, water absorption and insulation resistance tests, plus microsection analysis. For assembled boards, aging and temperature/humidity cycling are supported.
Yes. Conformal coating and potting are both supported. Our line cleans and dries boards before automated selective conformal coating with infrared curing, and our lab can test ionic contamination. Send the coating or potting type, thickness and keep-out areas with your assembly notes so engineers can confirm them before production.
ENIG is flat, hard and corrosion resistant, and it allows several soldering passes. Immersion silver can tarnish and has a shorter shelf life, and OSP has a short shelf life and does not suit repeated soldering. Hard gold suits connectors and edge fingers. Tell us the environment and we can recommend one.
Our online quote offers copper-base boards with 1–2 layers, 1, 2 or 3 W/mK thermal conductivity, 0.8–3.0 mm thickness, outer copper from 0.5 oz up to 6 oz and above, trace and space down to 4/4 mil, and HASL, lead-free HASL, ENIG or OSP finish. Aluminum, iron and stainless steel cores, copper coin and pedestal structures are also supported.
Flex sections can have 1–6 layers and rigid sections 2–32 layers, and we have built a 14-layer board with TG170 FR-4 and polyimide. Bend radius and cycle life depend on your design, so send your requirement for engineer review.
With no changes, engineering builds a repeat order from the files used for your previous order, including stack-up and impedance parameters. If engineers need to adjust your design, they contact you through an engineering question and start production only after you agree. Changes such as outline, drill, solder mask or thickness are noted on the reorder, and engineering updates the files and issues a change notice to planning. Samples and volume runs follow the same quality management system. For long-life parts, ask about our pre-purchase and storage service and run the HQDFM BOM check before you order.
Parts come through HQ Online, which connects to authorized distributors and manufacturers worldwide. Incoming parts are inspected, and X-ray inspection equipment is available. Date code and laser-mark traceability are supported, and our MES records production for traceability.
Yes. Firmware can be flashed from .hex, .bin and .elf files. Engineers and technicians debug the first article and turn your test plan into a work instruction before batch testing. Test fixtures can come from you or be built by us, and we support legally binding NDAs.
Prototypes ship as fast as 24 hours for 1–2 layers, 1–2 days for 4 layers and 2–3 days for 6 layers and above. Heavy copper, metal-core and rigid-flex timing is confirmed at quotation. Assembly is 24 hours for express and 5–7 working days with parts from HQ Online, and there is no minimum order, from 1 piece.
The main factors are board size and panel utilization (low utilization adds a surcharge), layer count, thickness, copper weight, surface finish (ENIG and plated gold cost more), drill size and hole density (holes under 0.3 mm add drilling cost), and special processes such as HDI, blind and buried vias, heavy copper, impedance control, half holes and edge plating. Engineering and test fees are included in prototype and small-batch pricing.
Final inspection covers dimensions, solderability, peel strength, microsection, thermal shock, ionic contamination and insulation resistance. Orders can include shipping reports, microsection reports and impedance test reports. Third-party RoHS, REACH (SVHC) and PFAS reports are available, and our UL file number is E469747 with UL 94V-0 flame rating. Defects found on delivery are repaired or reworked.
Upload Gerber and BOM files for an instant quote, or send your requirements to our engineers first.
Technical hotline +86 755 8364 3663 (24/7) · support@nextpcb.com
Support in English · Team time zone: China Standard Time (UTC+8)
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