PCB Manufacturer & PCB Assembly

How to Prepare BOM for PCB Assembly

Posted on May 12, 2026 by NextPCB Content Team

Learn how to prepare a clear, error-free Bill of Materials (BOM) for seamless PCB assembly with this step-by-step guide from NextPCB.

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Tag: NextPCB components sourcing PCBA pcb manufacturing china BOM Sample EDA/CAD software BOM

Best Free Gerber File Viewer in 2026

Posted on May 21, 2026 by NextPCB Content Team

Compare the top 10 best free Gerber file viewers in 2026. Find the perfect tool for DFM analysis, 3D PCB review, and secure offline use.

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Tag: PCB design Gerber Viewer DFM electronics OpenSource NextPCB Gerber Viewer

Two Ways to Create Blind and Buried Vias in Cadence Allegro

Posted on April 27, 2026 by NextPCB Content Team

Learn two efficient methods to create blind and buried vias in Cadence Allegro, with step-by-step setup for HDI PCB stackups and design tips.

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Tag: PCB design Blind & Buried Vias pcb layout HDI PCB blind vias PCB Stackup Pad Design Cadence Allegro

How to Add and Plan Multi-layer PCB Stackups in Altium Designer?

Posted on May 08, 2026 by NextPCB Content Team

Learn how to scientifically plan multilayer PCB stackups in Altium Designer to control impedance and crosstalk, featuring practical tips and common FAQs.

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Tag: PCB design pcb design software Altium designer EDA Hardware Engineer signal integrity (SI) PCB Stackup

High Tg PCB vs. Standard FR4: The Engineering Guide to Material Reliability

Posted on December 26, 2025 by NextPCB Content Team

Understand the physics of Tg, CTE mismatch, and IPC-4101 standards. Learn why High Tg materials are critical for multilayer reliability and lead-free assembly.

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Tag: pcb prototype manufacturer NextPCB order Fr-4 High-TG PCBs HQDFM advanced pcb

Rogers vs FR4: How to Choose PCB Materials for High-Frequency Designs

Posted on June 08, 2026 by NextPCB Content Team - Lolly

Don't overspend. Learn the facts: When do you need Rogers vs. FR4 for high-frequency designs? Compare Dk/Df, thermal stability, and learn the cost-saving Hybrid Stackup solution.

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Tag: FR4 Impedance Control PCB material RF circuit board High Frequency PCB signal integrity (SI) High-speed PCB PCB Cost

KiCon Asia 2024 Highlights: Summary and Slides

Posted on May 13, 2026 by Carmen Zheng

KiCon Asia 2024, the KiCad conference celebrating the open-source EDA suite in the far East, was held for the second consecutive year in Shenzhen, China. Co-hosted by HQ Electronics, the 2-day event saw 14 speakers from all over the world step up to the stage on topics covering advanced KiCad workflows, user experiences and professional use cases. This time, a full day of KiCad training sessions was held prior to the main conference, which was a welcome addition to this year's KiCon Asia.

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Tag: kicad News

Open Circuit Explained: Causes, Diagram, How to Test & Fix

Posted on May 13, 2026 by iotbyhvm - LL

An open circuit means the path is broken — no current flows. Learn what causes it, how to test with a multimeter in 3 steps, and how to fix common open circuit faults.

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The Top 20 PCB Manufacturers in The World

Posted on September 09, 2025 by NextPCB

Top PCB manufacturers in the world include 1. NextPCB 2. ZDT 3. Compeq Manufacturing 4. Shengyi Technology 5. Advanced Circuit International

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Tag: pcb manufacturer

ISO 13485-Compliant Microvia PCB Manufacturing for MedTech Startups

Posted on March 27, 2026 by NextPCB Content Team - PF

Learn how MedTech startups can select ISO 13485-certified PCB manufacturers with microvia expertise, handle compliance, and manage risk for medical devices.

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Tag: Medical PCBs IPC Standard

Best Advanced PCB Fabrication Companies for Complex Boards 2026

Posted on March 24, 2026 by NextPCB Content Team - PF

A definitive guide to the best advanced PCB fabrication companies for complex boards in 2026, covering HDI, heavy copper, certifications, and DFM tooling.

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Tag: pcb prototyping PCB assembly HDI PCB IPC Standard Heavy Copper PCB IPC Class advanced pcb advanced pcb manufacturer

Choosing the Right Substrate Materials for PCB Manufacturing: A Comprehensive Guide

Posted on March 20, 2026 by NextPCB Content Team - PF

The PCB substrate, professionally known as copper clad laminate, forms the base of every PCB. Understanding how to select the right substrate material is essential for ensuring your PCB performs reliably under real-world conditions.

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Tag: MCPCB CTE Flexible PCBs High-TG PCBs PCB manufacturing FR4 hardware design Rogers PCB electronics engineering pcb substrates

A Beginner's Guide to FR-4 Material in PCB Manufacturing: Properties, Advantages, and Alternatives

Posted on November 07, 2025 by NextPCB

What is FR4 material definition? This is a beginner guide exploring FR4 properties, advantages, and alternative materials from NextPCB PCB Manufacturer

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Tag: Fr-4

HDI PCB for AI Servers: Stackup, Via-in-Pad & Laser Drill Guide

Posted on June 11, 2026 by Julia Wu

HDI PCB design for AI servers—stackup types, laser-drilled microvias, via-in-pad, any-layer HDI, sequential lamination, and manufacturing requirements for H100, B200, and NVSwitch boards.

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Building an AI GPU Cluster: Hardware Overview from PCB to Rack

Posted on June 10, 2026 by Arya Li

How to build an AI GPU cluster—hardware selection, GPU baseboard design, NVLink fabric, power infrastructure, liquid cooling, InfiniBand networking, and PCB requirements at every level.

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Google TPU v5 Explained: Architecture, PCB Layout & Deployment

Posted on June 10, 2026 by Arya Li

Google TPU v5 architecture explained for hardware engineers—systolic array design, ICI interconnect, PCB layout requirements, pod topology, and how TPU v5 compares to NVIDIA H100 for AI training.

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What Is AWS Trainium? Amazon's AI Chip & PCB Design Requirements

Posted on June 10, 2026 by Arya Li

AWS Trainium 2 explained: Amazon's custom AI training chip architecture, NeuronLink interconnect, PCB design requirements, power delivery, and how it compares to NVIDIA H100 for AI workloads.

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GPU vs TPU vs ASIC vs FPGA: Which AI Chip Dominates in 2027?

Posted on June 09, 2026 by Stacy Lu

Compare GPU, TPU, ASIC, and FPGA for AI workloads—architecture trade-offs, PCB design differences, performance per watt, and which platform will lead AI infrastructure through 2027.

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NVIDIA GB200 NVL72: PCB & System Architecture Explained

Posted on June 09, 2026 by Stacy Lu

Inside the GB200 NVL72: Grace Blackwell Superchip, NVLink 5.0 switch fabric, 120 kW rack power, liquid cooling, and the most demanding PCB designs in commercial production today.

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Intel Gaudi 3 vs NVIDIA H100: Comparing AI Accelerators from a Hardware Engineer's Perspective

Posted on June 09, 2026 by Lolly Zheng

Discover how Intel Gaudi 3 compares to NVIDIA H100 from a hardware perspective. Explore OAM vs SXM, power, thermals, and AI accelerator PCB design challenges.

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How to Prepare BOM for PCB Assembly

Best Free Gerber File Viewer in 2026

Two Ways to Create Blind and Buried Vias in Cadence Allegro

How to Add and Plan Multi-layer PCB Stackups in Altium Designer?

High Tg PCB vs. Standard FR4: The Engineering Guide to Material Reliability

Rogers vs FR4: How to Choose PCB Materials for High-Frequency Designs

KiCon Asia 2024 Highlights: Summary and Slides

Open Circuit Explained: Causes, Diagram, How to Test & Fix

The Top 20 PCB Manufacturers in The World

ISO 13485-Compliant Microvia PCB Manufacturing for MedTech Startups

Best Advanced PCB Fabrication Companies for Complex Boards 2026

Choosing the Right Substrate Materials for PCB Manufacturing: A Comprehensive Guide

A Beginner's Guide to FR-4 Material in PCB Manufacturing: Properties, Advantages, and Alternatives

HDI PCB for AI Servers: Stackup, Via-in-Pad & Laser Drill Guide

Building an AI GPU Cluster: Hardware Overview from PCB to Rack

Google TPU v5 Explained: Architecture, PCB Layout & Deployment

What Is AWS Trainium? Amazon's AI Chip & PCB Design Requirements

GPU vs TPU vs ASIC vs FPGA: Which AI Chip Dominates in 2027?

NVIDIA GB200 NVL72: PCB & System Architecture Explained

Intel Gaudi 3 vs NVIDIA H100: Comparing AI Accelerators from a Hardware Engineer's Perspective

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Recommended Article:

BLOG

How to Prepare BOM for PCB Assembly

Best Free Gerber File Viewer in 2026

Two Ways to Create Blind and Buried Vias in Cadence Allegro

How to Add and Plan Multi-layer PCB Stackups in Altium Designer?

High Tg PCB vs. Standard FR4: The Engineering Guide to Material Reliability

Rogers vs FR4: How to Choose PCB Materials for High-Frequency Designs

KiCon Asia 2024 Highlights: Summary and Slides

Open Circuit Explained: Causes, Diagram, How to Test & Fix

The Top 20 PCB Manufacturers in The World

ISO 13485-Compliant Microvia PCB Manufacturing for MedTech Startups

Best Advanced PCB Fabrication Companies for Complex Boards 2026

Choosing the Right Substrate Materials for PCB Manufacturing: A Comprehensive Guide

A Beginner's Guide to FR-4 Material in PCB Manufacturing: Properties, Advantages, and Alternatives

HDI PCB for AI Servers: Stackup, Via-in-Pad & Laser Drill Guide

Building an AI GPU Cluster: Hardware Overview from PCB to Rack

Google TPU v5 Explained: Architecture, PCB Layout & Deployment

What Is AWS Trainium? Amazon's AI Chip & PCB Design Requirements

GPU vs TPU vs ASIC vs FPGA: Which AI Chip Dominates in 2027?

NVIDIA GB200 NVL72: PCB & System Architecture Explained

Intel Gaudi 3 vs NVIDIA H100: Comparing AI Accelerators from a Hardware Engineer's Perspective

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