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Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
People think that the earth can absorb all the charges, always maintain a stable, is the ultimate reference point. Although some boards are not connected to the earth, but the power plant is connected to the earth, the power of the board will eventually return to the power plant into the ground.
The design of the high-frequency circuit PCB is a complicated process, and many factors involved may directly affect the performance of the high-frequency circuit. Therefore, designers need to continuously research and explore in the actual work, accumulate experience, and combine the new EDA (Electronic Design Automation) technology to design high-performance circuit PCB with excellent performance.
PCB layout design to analyze the circuit board unit, based on the function of the layout design, layout of all the components of the circuit, to comply with the following principles.
In high speed designs, the characteristic impedance of the controllable impedance plates and lines is one of the most important and common problems. First, let's look at the definition of a transmission line: a transmission line consists of two conductors of a certain length, one for transmitting signals and the other for receiving signals (remember that the "loop" replaces the concept of "ground"). In a multi-layer board, each line is part of a transmission line, and an adjacent reference plane can be used as a second line or loop. The key to a line becoming a "good performance" transmission line is to keep its characteristic impedance constant throughout the line.
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as a variety of microcontrollers. Simulation software.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
1. Right angle line (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. The snake line (adjustment delay)
In SoC design, the coupling between signals can cause signal integrity problems. Neglecting signal integrity problems can lead to crosstalk between signals. Reliability, manufacturability and system performance will also be reduced. This article describes the design of ASIC chips. A method for solving signal integrity problems.
The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.
The moisture sensitivity of plastic integrated circuits (ICs) is getting worse and worse, due to many industry trends, including the constant search for higher reliability products to support critical communications and technology applications.
Build up Multilayer PCB, BUM refers to the application of insulating dielectric on the insulating substrate, or the traditional double-panel or multi-layer board, and then electroless copper plating and electroplating copper to form wires and connecting holes. A multilayer printed board requiring a number of layers.
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