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support@nextpcb.comHere you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
It's not easy to think about packaging well:
Routing is the overall requirement for high-frequency PCB design based on a reasonable layout. Wiring includes both automatic routing and manual routing. Generally, regardless of the number of critical signal lines, these signal lines are manually wired first. After the wiring is completed, these signal lines are carefully inspected, fixed after inspection, and then automatically routed to other wirings. That is, the combination of manual and automatic wiring is used to complete the wiring of the PCB.
How to improve anti-interference ability and electromagnetic compatibility when developing electronic products with processors?
In the design of power circuit, electromagnetic interference is one of the key factors affecting product performance. At present, there are many ways to solve the problem of EMI for engineers. Generally, methods for suppressing EMI include: EMI suppression coating, EMI simulation. Design and selection of suitable EMI suppression parts. This article will start with the PCB, and introduce the role and design skills of PCB layered stacking in controlling EMI radiation.
As device operating frequencies become higher and higher, the signal integrity issues faced by high-speed PCB design become a bottleneck in traditional design, and engineers face increasing challenges in designing complete solutions. Although the high-speed simulation tools and interconnect tools can help designers solve some of the problems, high-speed PCB design requires more experience and deep communication between the industry.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
1. First, have a reasonable direction:
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up, and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is very important to dissipate the board.
1. PCB clock frequency exceeds 5MHZ or signal rise time is less than 5ns, generally requires the use of multi-layer board design.
Most of the design performance of multi-substrate is similar to that of single-substrate or dual-substrate, that is, care should be taken not to fill too many circuits with too small space, resulting in unrealistic tolerances, high inner layer capacity, and possibly even endangering product quality. Security. Therefore, the performance specification should take into account the complete evaluation of thermal shock, insulation resistance, solder resistance, etc. of the inner-layer circuit. The following describes the important factors that should be considered in multi-substrate design.
In the field of network communication, in ATM switches, core routers, Gigabit Ethernet, and various gateway devices, the system data rate and clock rate continue to increase, and the operating frequency of the corresponding processor is also higher; data, voice, and image transmission.
The high precision of printed circuits refers to the use of fine line width/pitch, micro holes, narrow ring width (or no ring width), and buried, blind holes and other technologies to achieve high density. The high precision means that the result of "fine, small, narrow, thin" will inevitably bring high precision. Take the line width as an example: O.20mm line width, and O.16-0.24mm is qualified according to the regulations. The error is (O.20 soil 0.04) mm; and the line width of O.10mm, the same error is (0.10±O.02) mm, obviously the accuracy of the latter is doubled, and so on is not difficult to understand. Therefore, the high precision requirements are not discussed separately. But it is a prominent problem in production technology.
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
In design, layout is an important part. The quality of the layout results will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step in the success of PCB design.
1: This board's PCB design requirements are not high, use finer lines, automatically cloth it.
Analyze the differences and how to use Fill, Polygon Pour, Plane in Altium Designer
The pad design is designed to achieve the smallest diameter, which is at least 0.5 mm greater than the maximum diameter of the weld terminal orifice flange. The test pads must be provided for all nodes in accordance with ANSI/IPC 2221. Nodes are two or Electrical connection points between multiple components. A test pad requires a signal name (nodal signal name), the xy coordinate axis associated with the reference point of the printed circuit board, and the test pad's coordinate position (describe the test pad On which side of the printed circuit board). The information needed to provide fixtures for SMT will also need to be printed on the assembly technique of the circuit board assembly to "fix the device in the circuit test" or commonly referred to as "fixed nail bed." With the help of devices" to promote testability in the circuit. In order to achieve this purpose, you need to:
PowerPCB provides users with a quick set of commands. Shortcut commands are mainly used for operations that require frequent changes to the settings during the design process. For example, changing the line width, wiring layer, and changing the design Grid can be achieved by shortcut commands.
For the production of PCB printed boards, because many designers do not understand the production process of the circuit board, the circuit diagram of the design is only the most basic circuit diagram, and can not be directly used for production. Therefore, it is necessary to modify and edit the line file before actual production. It is not only necessary to produce a film map that can be suitable for the production process of the factory, but also to make corresponding punching data, mold opening data, and other data useful for production. It is directly related to various production projects in the future. These require engineers and technicians to understand the necessary production processes, and at the same time master the relevant software production, including common circuit design software such as: Protel, Pads2000, Autocad, etc., should be familiar with the necessary CAM software such as: View2001, CAM350; GCCAM Etc., CAM should include PCB design inputs, which can edit, correct, repair, and imprint circuit graphics, use disk as the dielectric material, and output automated data for ray mapping, drilling, and inspection.
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