Support Team
Feedback:
support@nextpcb.comHere you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
Via is one of the important components of a multilayer PCB, and drilling costs typically account for 30% to 40% of PCB board costs.
Total 7 things.
75. -48V to -48V signal is only the return flow, there is no convergence to other places? If you can not, please explain the reason in the remarks column.
1. The information received is completed (including: schematics, *.brd, bill of materials, PCB design and change requirements, standardization requirements, process design documents)
In PCB Multilayer Board Design
At first glance, the PCB is similar in appearance regardless of its inherent quality. It is through the surface that we see the differences that are critical to the durability and functionality of the PCB throughout its lifetime.
Thermal design requirements for layout; Layout signal integrity requirements; EMC requirements
People think that the earth can absorb all the charges, always maintain a stable, is the ultimate reference point. Although some boards are not connected to the earth, but the power plant is connected to the earth, the power of the board will eventually return to the power plant into the ground.
With the advancement of technology, the signal blocking time of high-speed integrated circuits has reached several hundred ps, and the clock frequency can reach several hundred MHz. Such a high edge rate causes a large number of interconnect lines on the printed circuit board to be produced in low-speed circuits. The transmission line effect causes distortion of the signal, which seriously affects the correct transmission of the signal. If the board design is not considered, the circuit with the correct logic function will not work properly when debugging. In order to solve this problem, signal integrity analysis must be carried out when designing high-speed circuits. The system is thoroughly simulated by virtual template, and the influence of circuit layout and routing on signal integrity is accurately analyzed, and the circuit design is guided. In this way, many problems that can be found in debugging can be solved during the design, which greatly improves the design success rate and shortens the design cycle.
The design performance of multi-layer boards is mostly similar to single-panel or double-panel, which is to avoid avoiding too many circuits to fill too small space, resulting in impractical tolerances, high inner layer capacity, and possibly even dangerous products. Quality safety. Therefore, the performance specification should consider the complete evaluation of the thermal shock, insulation resistance, welding resistance, etc. of the inner layer. The following sections describe important factors that should be considered in the design of multilayer boards.
As integrated circuit output switching speeds increase and PCB board density increases, signal integrity has become one of the issues that must be addressed in high-speed digital PCB design. Factors such as components and PCB boards, layout of components on the PCB, and wiring of high-speed signals can cause signal integrity problems, resulting in unstable system operation or even no work at all.
Learn how to reduce signal interference and optimize your high-speed PCB design with crosstalk analysis techniques. Discover practical tips and insights in this comprehensive guide.
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as a variety of microcontrollers. Simulation software.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
1. Right angle line (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. The snake line (adjustment delay)
In SoC design, the coupling between signals can cause signal integrity problems. Neglecting signal integrity problems can lead to crosstalk between signals. Reliability, manufacturability and system performance will also be reduced. This article describes the design of ASIC chips. A method for solving signal integrity problems.
The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.
The moisture sensitivity of plastic integrated circuits (ICs) is getting worse and worse, due to many industry trends, including the constant search for higher reliability products to support critical communications and technology applications.
Dimensions: (mm) |
|
Quantity: (pcs) |
|
Layers: |
Thickness: |
Quote now |