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support@nextpcb.comHere you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The concepts of Layer, Via, Overlay, Pad, Mask, etc.,
PCB light painting process is a very important part of PCB in the circuit transfer process. Any errors that occur in this link may bring serious problems to the subsequent process, so each step inside must be strictly controlled.
55 elements
The advantage of Protel is that it is more popular in the Chinese market. As long as the PCB is Protel, any file can make a board. Southern China is more likely to accept the OrCAD format.
PCB shape and size are determined by the placement machine's PCB transmission method and mounting area.
5-7 Measures taken to increase the system's ability of it.
The detection of components is a basic skill of appliance repair. How to accurately and effectively detect the relevant parameters of components and determine whether the components are normal is not a one-size-fits-all thing.
PCB design needs to set different points in different stages. In the layout stage, large grid points can be used for device layout.
In this case, we need to make holes in the board so that the pins can pass through the board to the other side, so the parts are soldered to the other side. Because of this, the front and back sides of the PCB are called the Component Side and the Solder Side.
How to define differential pairs in the schematic
As memory designs become more complex and compact, and data rates are increasing, the use of BGA probes to detect DDR DRAM is becoming more popular and has become a requirement. The DDR3 and DDR4 data rates have increased from 800 MT/s to approximately 3200 MT/s. Memory system designers are concerned about whether current BGA probe designs can meet high bandwidth requirements for optimal signal fidelity. Signal fidelity is important for accurate DDR conformance measurements based on JEDEC specifications. In addition, the memory designer needs to perform signal integrity measurements to complete the margin test. Moreover, the margin after eliminating the DDR BGA probe detection effect can be used to design components with lower tolerances. This article describes a new probe calibration method for scalable DDR BGA probe bandwidth to increase the margin of signal integrity testing and minimize errors caused by DDR BGA probes.
As an electronic engineer, designing a circuit is a must-have hard work, and the principle design is perfect. If the board design is unreasonable, the performance will be greatly reduced, and even if it is serious, it will not work properly.
How to complete the complicated 3D components?
1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.
Regarding signal integrity issues, when the system clock exceeds 50 MHz, the signal interconnect on the board introduces signal delays on the timing path, and these signal delays constrain the performance of the board-level design. How the transmission line effect will quickly introduce serious signal integrity issues like signal oscillation, overshoot and undershoot, and how these issues will threaten the noise tolerance of the design and the monotonic consistency principle of the design.
The increase in the functionality of the mobile phone requires higher design of the PCB.
The DFT team should be aware of the existing testing strategy. As OEMs turn to relying on more and more CMs, the equipment used varies from plant to plant. Without a clear understanding of the manufacturer's process, too many or too few tests may be used. Existing test methods include:
1. What is Signal Integrity?
When a square wave of a signal is propelled forward by a high-level positive pressure signal in the signal line of the transmission line assembly, the theoretical reference layer (such as the ground layer) is theoretically necessary. The negative pressure signal induced by the electric field is accompanied by the forward path (equal to the return path of the positive pressure signal reverse path), so that the integral loop system can be completed. If the "signal" advances its flight time for a short period of time, it can be imagined that it suffers from the instantaneous impedance value (Instantanious Impedance) from the signal line, the dielectric layer and the reference layer. This is called "Characteristic impedance."
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as a variety of microcontrollers. Simulation software.
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