PCB Stackup

What is Stack Design?

The PCB stack structure design is the process of designing the layers of a printed circuit board (PCB). The stack structure is a critical part of the PCB design process, as it determines the electrical performance, mechanical strength, and thermal characteristics of the PCB.

The stack structure is typically composed of the following layers:

- Signal layers: These layers are used to route the electrical signals on the PCB.

- Power layers: These layers are used to distribute the power and ground signals on the PCB.

- Dielectric layers: These layers are used to insulate the signal and power layers from each other.

- Mechanical layers: These layers are used to provide mechanical strength to the PCB.

- Thermal layers: These layers are used to dissipate heat from the PCB.

The stack structure is designed to meet the specific requirements of the PCB application. For example, a PCB for a high-speed digital application will require a different stack structure than a PCB for a low-power analog application.

The stack structure is designed using a variety of software tools. These tools allow the designer to create a 3D model of the PCB and to simulate the electrical, mechanical, and thermal performance of the PCB.

The PCB stack structure is a critical part of the PCB design process. A well-designed stack structure will ensure that the PCB meets the electrical, mechanical, and thermal requirements of the application.

Here are some tips for designing a PCB stack structure:

- Use the minimum number of layers necessary to meet the requirements of the application.

- Use high-quality dielectric materials to minimize signal crosstalk and to provide good electrical insulation.

- Use mechanical layers to provide mechanical strength to the PCB.

- Use thermal layers to dissipate heat from the PCB.

By following these tips, you can design a PCB stack structure that meets the requirements of your application and provides the best possible performance.

Why do PCB stackup structure design?

The PCB stackup structure design is the process of determining the layers, materials, and thickness of the materials used in a printed circuit board (PCB). The stackup structure design is important because it affects the electrical performance, mechanical properties, and cost of the PCB.

The stackup design process typically begins with the electrical requirements of the PCB. The designer will need to determine the number of layers needed, the type of materials to use for each layer, and the thickness of each layer. The designer will also need to consider the mechanical requirements of the PCB, such as the weight, thickness, and rigidity. Finally, the designer will need to consider the cost of the PCB, which is affected by the materials and the number of layers.

The stackup design process is a complex one, and it is important to get it right. A poorly designed stackup can lead to problems with electrical performance, mechanical properties, and cost.

Here are some of the reasons why it is important to design a PCB stackup structure:

- To improve electrical performance: The stackup design can affect the electrical performance of the PCB in a number of ways. For example, the thickness of the dielectric layers can affect the impedance of the PCB, and the type of materials used can affect the crosstalk between signals.

- To improve mechanical properties: The stackup design can also affect the mechanical properties of the PCB. For example, the thickness of the board and the type of materials used can affect the strength and rigidity of the PCB.

- To reduce cost: The stackup design can also affect the cost of the PCB. For example, using thinner dielectric layers and less expensive materials can reduce the cost of the PCB.

By considering all of these factors, the designer can create a PCB stackup structure that meets the electrical, mechanical, and cost requirements of the application.

The PCB stackup structure design is a critical part of the PCB design process. A well-designed stackup can improve the electrical performance, mechanical properties, and cost of the PCB.

Stackup structure recommended by NextPCB

4 layer pcb stackup

Plate thickness: 1.6mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 0.5oz

HDI: no

Plate thickness: 1.6mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 1oz

HDI: no

Plate thickness: 2.0mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 1oz

HDI: no

6 layer pcb stackup

Plate thickness: 1.6mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 0.5oz

HDI: no

Plate thickness: 2.0mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 0.5oz

HDI: no

8 layer pcb stackup

Plate thickness: 1.6mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 0.5oz

HDI: no

Plate thickness: 2.0mm

Outer layer copper thickness: 1oz

Inner layer copper thickness: 0.5oz

HDI: no

Specify Requirements Stackup Design

The requirements for a stackup design vary depending on the application. However, there are some general requirements that are common to all stackup designs. These include:

Electrical performance: The stackup design should be able to meet the electrical requirements of the application. This includes the impedance of the signal traces, the crosstalk between signals, and the noise immunity of the board.

Mechanical performance: The stackup design should be strong enough to support the weight of the components and the stresses that will be placed on it during assembly and operation.

Thermal performance: The stackup design should be able to dissipate heat from the components without overheating the board.

Cost: The stackup design should be as cost-effective as possible. This includes the cost of the materials, the labor costs, and the manufacturing costs.

In addition to these general requirements, there may be specific requirements for the stackup design that are specific to the application. For example, a stackup design for a high-speed digital application may need to have a lower impedance than a stackup design for a low-speed analog application.

The stackup design process typically begins with the electrical requirements of the application. The designer will need to determine the number of layers needed, the thickness of each layer, and the type of materials to use for each layer. The designer will also need to consider the mechanical and thermal requirements of the application.

Once the designer has determined the requirements for the stackup design, they can begin to create a prototype. The prototype will be tested to ensure that it meets the requirements of the application. If the prototype is successful, it will be used to create the final stackup design.

The stackup design process is an important part of the PCB design process. A well-designed stackup design can help to ensure that the PCB will meet the electrical, mechanical, and thermal requirements of the application.