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1. Incorrect Hole Attributes (Via vs. Pad) In the 3D drawing below, the designer intended for two specific pads to remain exposed (uncovered by solder mask). However, these holes were defined with "Via" attributes in the EDA software, and the order was placed with the ...
Grid Copper vs. Solid Copper Pour: Choosing the Right Copper Fill for Your PCB By NextPCB Engineering Team | Last updated: August 2026 | Reading time: 5 min Copper pour (also called copper fill or copper flood) is used across large open areas of a PCB &mdash...
The blistering on a circuit board is primarily caused by poor bonding force on the board's surface, which is fundamentally a surface quality issue. This problem generally stems from two aspects: The cleanliness of the board surface. Surface micro-roughness (...
PCB is the abbreviation of the printed circuit board, which is the basic platform for carrying electronic components to realize corresponding functions. According to the substrate material, the PCB is manufactured according to the PCB design document, and the conne...
By NextPCB Engineering Team | Last updated: August 2026 | Reading time: 6 min Judging the quality of a printed circuit board generally comes down to two approaches: a visual inspection that catches obvious defects before a board is even powered on, and verifica...
PCB Design Considerations: 5 Key Rules for Signal Integrity and Reliable Manufacturing By NextPCB Engineering Team | Last updated: August 2026 | Reading time: 8 min PCB design is the foundation that determines the performance, manufacturability, ...
PCB is the abbreviation of the...