PCB Manufacturer & PCB Assembly

Solder mask

Posted on October 21, 2025 by NextPCB

Hey guys, today we are going to talk about solder mask.

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Tag: NextPCB printed circuit board NextPCB order solder mask green ink

Through-Hole Assembly

Posted on October 21, 2025 by NextPCB

Hey guys in this article we are going to learn the through-hole mounting technology.

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Tag: NextPCB PCB assembly through-hole mounting technology THT THM SMT

Printed Circuit Board Prototype

Posted on October 21, 2025 by NextPCB

With the present rapid development in science and technology, electronic engineers need to develop more new products to cater to the social development requirements.

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How to Place Order On NextPCB？

Posted on November 24, 2025 by NextPCB

Hey guys, in this article we are going to show you how to order Printed Circuit Boards for your projects in the simplest way.

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Basic Knowledge of PCB Prototyping

Posted on September 19, 2025 by G

In this case, we need to make holes in the board so that the pins can pass through the board to the other side, so the parts are soldered to the other side. Because of this, the front and back sides of the PCB are called the Component Side and the Solder Side.

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Tag: pcb pcb prototyping through hole

Advantages and Disadvantages of Different Surface Treatments of PCB

Posted on September 22, 2025 by G

There are many types of surface treatment of circuit boards, which should be selected according to performance and requirements. The following are simple analysis of the advantages and disadvantages of various surface treatments of PCB.

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Tag: HASL OSP advantages pcb pcb surface

PCB Test Equipment Availability

Posted on September 19, 2025 by G

The DFT team should be aware of the existing testing strategy. As OEMs turn to relying on more and more CMs, the equipment used varies from plant to plant. Without a clear understanding of the manufacturer's process, too many or too few tests may be used. Existing test methods include:

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PCB Single Sided Production Process

Posted on September 19, 2025 by G

Remarks: The grinding process between silk screen and solder mask may be omitted. It can be soldered first and then screen printed, depending on the substrate.

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Introduction of PCB Material

Posted on September 19, 2025 by G

PCB material are divided into: 94HB, fireproof board (94VO, FR-1, FR-2), semi-glass (22F, CEM-1, CEM-3), and full glass (FR-4).

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PCB Design Principles

Posted on September 19, 2025 by G

Eight Principles of PCB Design

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Summary of Multilayer Board (BUM-PCB)

Posted on September 19, 2025 by G

Build up Multilayer PCB, BUM refers to the application of insulating dielectric on the insulating substrate, or the traditional double-panel or multi-layer board, and then electroless copper plating and electroplating copper to form wires and connecting holes. A multilayer printed board requiring a number of layers.

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Introduction to HDI and circuit boards

Posted on January 13, 2026 by G

Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.

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Summary of Multilayer Board (BUM-PCB)

Posted on September 19, 2025 by G

As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.

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Introduction of high-density HDI circuit boards and circuit boards

Posted on January 13, 2026 by G

Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.

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How to deal with the interference of circuit board parasitic components on circuit performance

Posted on October 14, 2025 by G

The main parasitic components generated by board layout are resistors, capacitors, and inductors. When switching from a circuit diagram to an actual board, all parasitic components have a chance to interfere with circuit performance. When a system mixes digital and analog components, careful routing is key to the success of the board. In particular, digital traces that are often close to high-impedance analog traces will cause severe coupling noise, which can only be avoided by keeping the two traces at a distance. This article quantifies the toughest board parasitic components, board capacitors, and lists the performance examples that can be clearly seen on the board.

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Circuit board PCB design and process

Posted on September 19, 2025 by G

Printed circuit board design is another important part of Protel 98. In this process, you can use the powerful functions provided by protel98/protel99se to realize the layout design of the board and complete the difficult wiring work.

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