High-TG PCB

Printed circuit boards made with high glass transition temperature (Tg) materials, typically 170°C and above.
- Enhanced thermal resistance and stability
- Improved mechanical strength at high temperatures
- Reduced thermal expansion
- Better chemical resistance
High Frequency PCB

PCBs designed to handle signals in the GHz range with minimal signal loss and distortion.
- Low dielectric constant (Dk) and dissipation factor (Df) materials
- Precise impedance control
- Specialized copper foils with low surface roughness
- Controlled dielectric thickness
High Speed PCB

Circuit boards optimized for high-speed digital signals with careful attention to signal integrity.
- Low-Dk/Df high-speed laminates (Megatron, Isola)
- Controlled impedance support
- Custom and hybrid stackup support
- Backdrilling & via optimization
HDI PCB

High Density Interconnect PCBs with finer lines, smaller vias, and higher connection density.
- Microvias (laser-drilled)
- Finer trace widths and spacing
- Higher pad density
- Sequential lamination HDI 3 above
- Any-layer via structures
Rogers PCB

PCBs manufactured using Rogers Corporation's high-performance laminate materials.
- Low dielectric loss for high-frequency applications
- Stable electrical properties over temperature
- Low moisture absorption
- Excellent thermal management
Heavy Copper PCB

PCBs with exceptionally thick copper layers, typically 3 oz or more, for high-current applications.
- Extremely high current-carrying capacity
- Enhanced thermal conductivity
- Ability to withstand repeated thermal cycling
- Reduced need for external heat sinks
Flexible PCB

Bendable PCBs made using polyimide or polyester substrates that can conform to dynamic or space-constrained designs.
- High flexibility and bendability (can flex over 200 million cycles)
- Lightweight and space-saving design
- Excellent vibration and shock resistance
- Can be single-layer, double-layer, or multi-layer
Rigid-Flex PCB

Hybrid circuit boards that combine rigid and flexible substrates into a single integrated assembly.
- Combines stability with flexibility
- Eliminates connectors and solder joints between rigid sections
- Increased reliability with fewer interconnection points
- Space and weight-saving
Ceramic PCB

Circuit boards manufactured using ceramic substrates like Al₂O₃ and AlN for extreme thermal and electrical performance.
- Excellent thermal conductivity
- High-temperature operation
- Superior electrical insulation and dielectric strength
- Low thermal expansion coefficient matching semiconductors