PCB Manufacturer & PCB Assembly

PCB Test Equipment Availability

Posted on September 19, 2025 by G

The DFT team should be aware of the existing testing strategy. As OEMs turn to relying on more and more CMs, the equipment used varies from plant to plant. Without a clear understanding of the manufacturer's process, too many or too few tests may be used. Existing test methods include:

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PCB Single Sided Production Process

Posted on September 19, 2025 by G

Remarks: The grinding process between silk screen and solder mask may be omitted. It can be soldered first and then screen printed, depending on the substrate.

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Introduction of PCB Material

Posted on September 19, 2025 by G

PCB material are divided into: 94HB, fireproof board (94VO, FR-1, FR-2), semi-glass (22F, CEM-1, CEM-3), and full glass (FR-4).

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PCB Design Principles

Posted on September 19, 2025 by G

Eight Principles of PCB Design

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Summary of Multilayer Board (BUM-PCB)

Posted on September 19, 2025 by G

Build up Multilayer PCB, BUM refers to the application of insulating dielectric on the insulating substrate, or the traditional double-panel or multi-layer board, and then electroless copper plating and electroplating copper to form wires and connecting holes. A multilayer printed board requiring a number of layers.

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Summary of Multilayer Board (BUM-PCB)

Posted on September 19, 2025 by G

As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.

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Circuit board PCB design and process

Posted on September 19, 2025 by G

Printed circuit board design is another important part of Protel 98. In this process, you can use the powerful functions provided by protel98/protel99se to realize the layout design of the board and complete the difficult wiring work.

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PCB basic manufacturing process

Posted on September 19, 2025 by G

The PCB manufacturing process begins with a "substrate" made of Glass Epoxy or similar material.

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PCB Design Process - Introduction to DFM

Posted on September 19, 2025 by G

Allow enough test interfaces to facilitate ICT testing

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Some basic concepts of PCB design

Posted on September 19, 2025 by G

The concepts of Layer, Via, Overlay, Pad, Mask, etc.,

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Eight Mistakes in PCB Design

Posted on September 19, 2025 by G

1: This board's PCB design requirements are not high, use finer lines, automatically cloth it.

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High-speed PCB Design: PCB basic concepts

Posted on January 09, 2026 by G

There are 8 concepts: Layer, Via, Pad, Silk screen layer (Overlay), SMD's particularity, Grid-like filling area (External Plane) and filling area (Fill),All kinds of membrane (Mask), Fly line

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Tag: PCB design

How to design Multilayer PCB

Posted on September 19, 2025 by G

Multi-layer and double-sided PCB design is similar, and even easier.

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Several PCB surface finish methods

Posted on September 22, 2025 by G

Preface: To ensure a good PCB solderability or electrical properties. Because copper tends to be present in the form of oxides in the air, seriously affecting the solderability and the electrical properties of the PCB, the PCB needs to be surface-finish.

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Tag: pcb surface

Надежный производитель печатных плат в Китае

Posted on January 07, 2026 by Robin

заказ печатных плат в китае, Надежное качество, низкая стоимость, Быстрый прототип, возможна доставка в Россию. PCB от $0,1 за 10 штук.

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Come and Meet Us: NextPCB Expo Schedule 2025

Posted on May 14, 2025 by Carmen Zheng

Building upon the success of 2024, NextPCB is excited to announce its participating in a number of key industry expos in 2025 across North America, Europe and the Pacific. Over the course of the year, NextPCB sales agents, engineers and representatives will be showcasing NextPCBs offerings and providing both existing and prospective partners opportunities to connect face-to-face.

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Prevent PCB Insulation Failure: PP Thickness & Stackup Guide

Posted on June 18, 2025 by Ivy

Solve PCB insulation breakdowns! Learn how PP thickness & stackup design impact high-voltage isolation in 6L boards. Get TG170 prepreg guidelines & optimized stackup templates for 1.6mm PCBs

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How to Achieve 50 Ohm Impedance Requirements for PCB Routing without extra charges

Posted on September 11, 2025 by Ivy

For PCBs with four or more layers, different suppliers offer distinct stack-up structures. At NextPCB, customers can choose among three standard four-layer stack-up options at no extra cost for production. However, deviations from these standard stack-ups will incur an additional cost of at least $80. NextPCB’s DFM software facilitates 50-ohm impedance control for traces under any stack-up configuration.

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Green PCBs: Why are Most PCBs Green

Posted on October 14, 2022 by NextPCB

Green PCBs have been around for decades. This guide provides beneficial reasons why the popular color choice for PCB is green.

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Tag: PCB Color Green PCB

Printed Circuit Board(PCB) Glass Transition Temperature(Tg)

Posted on June 21, 2024 by NextPCB

What is PCB tg Glass Transition Temperature. In this guide you will learn about the material, temperature and fr-4 Tg.

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Tag: TG

PCB Test Equipment Availability

PCB Single Sided Production Process

Introduction of PCB Material

PCB Design Principles

Summary of Multilayer Board (BUM-PCB)

Summary of Multilayer Board (BUM-PCB)

Circuit board PCB design and process

PCB basic manufacturing process

PCB Design Process - Introduction to DFM

Some basic concepts of PCB design

Eight Mistakes in PCB Design

High-speed PCB Design: PCB basic concepts

How to design Multilayer PCB

Several PCB surface finish methods

Надежный производитель печатных плат в Китае

Come and Meet Us: NextPCB Expo Schedule 2025

Prevent PCB Insulation Failure: PP Thickness & Stackup Guide

How to Achieve 50 Ohm Impedance Requirements for PCB Routing without extra charges

Green PCBs: Why are Most PCBs Green

Printed Circuit Board(PCB) Glass Transition Temperature(Tg)

Categories

Recommended Article:

BLOG

PCB Test Equipment Availability

PCB Single Sided Production Process

Introduction of PCB Material

PCB Design Principles

Summary of Multilayer Board (BUM-PCB)

Summary of Multilayer Board (BUM-PCB)

Circuit board PCB design and process

PCB basic manufacturing process

PCB Design Process - Introduction to DFM

Some basic concepts of PCB design

Eight Mistakes in PCB Design

High-speed PCB Design: PCB basic concepts

How to design Multilayer PCB

Several PCB surface finish methods

Надежный производитель печатных плат в Китае

Come and Meet Us: NextPCB Expo Schedule 2025

Prevent PCB Insulation Failure: PP Thickness & Stackup Guide

How to Achieve 50 Ohm Impedance Requirements for PCB Routing without extra charges

Green PCBs: Why are Most PCBs Green

Printed Circuit Board(PCB) Glass Transition Temperature(Tg)

Categories

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