1. Cut the copper clad laminate;
Cut the copper-covered board, pay attention to the cutting specifications, and bake the board before cutting.
2. Grinding board;
The cut copper clad plate is cleaned in the grinding machine, so that the surface is free of dust, burrs and other impurities, and the first process is integrated after the grinding and baking.
3. Printed circuit;
Printed on the side of the copper, the ink has anti-corrosion effect
Remove excess ink, add ink to the place where less ink is printed. If a large number of defects are found, it needs to be adjusted. The defective product can be placed in the second step of etching to clean the ink. After cleaning and drying, it can be returned to this process for reprocessing.
5. The ink is to be dried;
The excess copper skin is etched away with the reagent, and the copper skin on the circuit with the ink is retained, and then the ink on the circuit is cleaned by the reagent, and the three processes are integrated.
7. Drilling positioning holes;
The etched plate drilling locating hole
8. Grinding board;
The substrate on which the positioning hole is drilled is cleaned and dried, and is the same as the 2 substrate
9. Silk screen printing;
Silk screen printing of the insert components on the back of the substrate, some marking code, silk screen printing and drying, the two processes are integrated
10. Grinding board;
11. Solder masking;
The green solder resist is screen printed on the cleaned substrate, green is not needed at the pad, and the ink is directly dried after printing. The two processes are integrated.
Forming with a punching machine, it is possible to form the sheet twice without the need for V-pit treatment, such as a small circular plate, first from the screen printing surface to the solder mask surface into a small circular plate, and then from the solder mask surface to the silk screen surface punching hole, etc.
The small round plate does not need V-cut treatment, and the substrate is cut out by the machine into the split plate slot.
Firstly grind the board, clean the substrate dust, dry it, and then apply a thin layer of rosin on the side of the pad. The three processes are integrated.
15. FQC test;
Check if the substrate is deformed, whether the hole position and the line are good
Flatten the deformed substrate and flatten the substrate without operating the process
17. Packaging and shipping.
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