Build with RAK3112: The Ultimate LoRa, WiFi & Bluetooth Module -NextPCB Accelerator #16

We're excited to announce the latest collaboration between NextPCB and RAK Wireless. This season, we're putting the spotlight on the powerful RAK3112 LoRa Module—a game-changing component that combines intelligence, connectivity, and versatility in one compact form. Whether you're building a Meshtastic device, an edge AI sensor, or a smart control panel, the RAK3112 offers the performance and integration you need. NextPCB Accelerator Program provides selected participants with essential resources to accelerate hardware development, including complimentary PCB fabrication, assembly services, and component sourcing support.

The RAK3112 module stands out in the market through its unique tri-mode connectivity capabilities. It seamlessly integrates LoRa, Wi-Fi, and Bluetooth technologies into a single compact unit, enabling developers to implement complex communication scenarios without requiring multiple discrete components. This integration significantly reduces design complexity while expanding the potential applications across various IoT domains.

Technical Highlights of the RAK3112 LoRa Module

Core Architecture:

• Built around the ESP32-S3 microcontroller, featuring a dual-core 240 MHz processor with vector instruction support and hardware-accelerated AI capabilities
• Integrated SX1262 LoRa transceiver supporting multiple LoRaWAN bands including EU868, US915, AU915, and AS923
• Comprehensive wireless connectivity: LoRa, Wi-Fi, and Bluetooth Low Energy (BLE)

Performance Characteristics:

• Memory configuration: Up to 16MB onboard flash storage
• Operating voltage: 3.0V to 3.6V
• Extended temperature range: -40°C to +85°C
• Compact dimensions: 15 mm × 23 mm × 3 mm stamp pad design

Advanced Capabilities:

• Native support for lightweight neural networks via ESP-DL framework
• Integrated LCD controller enabling graphical user interfaces
• Mesh networking ready with Meshtastic protocol compatibility
• Programmable through ESP-IDF, Arduino, and PlatformIO environments

Why Participate in This Program?

1. Free Prototyping Support: Get 2 free PCBA units, including PCB fabrication, components, assembly, and worldwide shipping (valued up to USD $500).
2. Comprehensive Technical Support: Get expert assistance with manufacturing engineering, design guidance, certification, and production.
3. Personalized Assistance: Receive dedicated one-on-one support throughout your manufacturing journey.

How to Apply:

Apply

Submit the application form through the event page.

Evaluation

You will receive a confirmation email once the evaluation is passed.

Free Prototype

Place the order and get 2 PCBA units completely free.

Mass Production

Enjoy seamless technical support and pre-arranged subsidized pricing.

Apply Now

Who Can Participate?

While we prioritize business projects, we welcome hobbyist designs that contribute to the open-source community and showcase interesting applications using RAK3112. All submissions must be original - publicly available designs are not eligible for sponsorship.

Campaign participants can only take advantage of one NextPCB Accelerator sponsorship per three months.

We believe the best ideas deserve a chance to grow. With the RAK3112 and NextPCB's manufacturing expertise, you can focus on what matters most—innovation.

Apply now and let's build the future of IoT—together：https://www.nextpcb.com/free-pcba-prototypes-nextpcb-accelerator

Documentation:

RAK3112 WisDuo LPWAN+BLE+WiFi Module Datasheet: https://docs.rakwireless.com/product-categories/wisduo/rak3112-module/datasheet/

RAK3112 WisDuo LPWAN+BLE+WiFi Module Quick Start Guide: https://docs.rakwireless.com/product-categories/wisduo/rak3112-module/quickstart/

#iot #RAK3112 #LoRa