NextPCB

Quality is Not an Act, It's a Habit.

NextPCB delivers more than just circuit boards; we deliver confidence. Explore our meticulous quality control systems that ensure every board meets the highest standards of performance and reliability.

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ISO 9001 ISO14001 IATF 16949 for Automotive ISO 13485 for Medical UL Certified RoHS Compliant REACH Compliant
99.59%
On-Time Delivery Rate
≤0.1%
Defect Rate (DPPM)
100%
Electrical Test Coverage
24hr
Technical Support

PCB Fabrication - Precision in Every Layer

We don't just build boards, we build trust. Guaranteed Manufacturing Precision, uncompromising quality.

1. Pre-Production Control

  • Comprehensive DFM Check: Our engineers conduct a thorough Design for Manufacturability review on every file, identifying potential issues before they impact your project.
  • Premium Material Sourcing: We use only A-grade laminates from globally recognized suppliers (e.g., Shengyi, Kingboard, Rogers).
  • Rigorous Material IQC: All incoming raw materials are tested for key parameters, ensuring a stable and reliable foundation. Full traceability is guaranteed.

2. In-Process Quality Control

  • Post-Etch AOI Scan: 100% of inner and outer layers are scanned by high-resolution Automated Optical Inspection (AOI) to detect defects like shorts or opens.
  • X-Ray Layer Alignment: Precision X-ray drilling ensures flawless layer-to-layer registration for complex multilayer PCBs.
  • Plating Thickness Verification: X-Ray Fluorescence (XRF) is used to meticulously monitor copper and surface finish plating thickness.

3. Final Inspection & Testing

  • 100% E-Test Guarantee: Every board undergoes Flying Probe or Bed-of-Nails testing to ensure complete electrical integrity against your netlist.
  • Impedance Control TDR: For high-frequency designs, Time-Domain Reflectometer tests verify precise impedance values.
  • IPC-A-600 Standard Inspection: Final visual and dimensional inspection is performed by our certified QA team to meet IPC Class 2 or Class 3 standards.

Turnkey PCB Assembly - Reliability, Precision, Traceability

Quality is built into every step, not just inspected in. We ensure your product's integrity with authentic components, intelligent automation, and comprehensive testing, confirming the highest level of operational integrity and reliability.

Component Inspection
Component IQC Verification
Component Verification
Material Registration
Inventory
Vast Inventory Management
Component Storage
Climate-Controlled and ESD-Protected Warehouse
 
 
 
 

Component Sourcing & Incoming QC

Flawless assembly starts with authentic components. We address the critical concern of counterfeit parts head-on for our global clientele.

Authorized Distribution Channels: We source exclusively from major authorized distributors like Digi-Key, Mouser, and Arrow, ensuring 100% genuine components.

Multi-Point Incoming Inspection (IQC): Every component reel is verified for part number, quantity, and moisture sensitivity. We perform sample testing to confirm electrical characteristics before releasing to production.

Automated SMT Line
ASM (SIEMENS) E by SIPLACE Pick and Place machines
SPI Machine
ALeader ALD-ST2-300I Solder Paste Inspection Machine
AOI Checking
Automated Optical Inspection (AOI)
X-Ray Checking
BGA X-Ray Inspection
 
 
 
 

Automated & Intelligent Assembly Process

Our state-of-the-art 36 SMT lines are equipped with multiple checkpoints to ensure quality is built-in, not inspected-in.

Solder Paste Inspection (SPI): We analyze 100% of solder paste deposits for volume, area, and height, preventing soldering defects before a single component is placed.

In-Line AOI & X-Ray: Post-reflow, boards are inspected by Automated Optical Inspection. For BGA and other leadless packages, X-Ray Inspection is utilized to guarantee perfect solder joint integrity, a must for high-reliability applications.

Visual Inspection
IPC-A-610 Visual Inspection
Functional Testing 1
Functional Test (Custom Test Fixtures)
EMI Test
Electromagnetic Interference (EMI) Test Equipment
FAI
First Article Inspection (FAI)
 
 
 
 

Comprehensive Testing & Final Assurance

We provide a full suite of testing options to deliver a product that works perfectly out of the box, every time.

First Article Inspection (FAI): A comprehensive, independent verification of the initial assembled board to confirm all components, specifications, and polarity are accurate before commencing mass production.

In-Circuit & Flying Probe Testing: Verifies component placement and electrical pathways post-assembly to catch any manufacturing faults.

Functional Testing (FCT): We execute your custom test procedures, simulating the board's real-world environment to provide the ultimate confirmation of its performance and functionality.

IPC-A-610 Workmanship Standards: Our certified operators and inspectors ensure every PCBA meets the highest workmanship standards (IPC Class 2 or Class 3) before final packaging.

Partner with a Proven Quality Leader

Stop worrying about reliability. Let NextPCB's proven quality control processes be the foundation of your next great product. Upload your design files and experience the NextPCB difference today!

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PCB & PCBA Quality Assurance FAQ

We understand that quality and reliability are critical to your projects. Below are answers to the most frequently asked questions about our manufacturing quality control and standards.

1. Quality Standards and Compliance

Q: What are your key quality certifications, workmanship standards, and environmental compliance measures? ▼

Our core facility is certified to ISO 9001 (Quality Management). We also comply with a full suite of standards to ensure high reliability and compliance across various sectors:

  • Sector-Specific Systems: ISO 13485 (Medical Devices) and IATF 16949 (Automotive).
  • Product Standards: UL.
  • Workmanship: Adherence to IPC-A-610 Class 2 & 3.
  • Environmental Compliance: RoHS and REACH. View all our certifications

2. Manufacturing Process Control & Testing

Q: What inspection and testing methods do you employ during PCB fabrication? ▼

We perform comprehensive checks including:

  • AOI for inner and outer layers (traces, pads, solder mask).
  • Electrical Test (E-Test): Flying Probe for prototypes/small batches, and 'Bed of Nails' for mass production, ensuring 100% open/short circuit verification.
  • Micro-section analysis for multilayer registration and plated-through-hole quality (plating thickness, hole integrity).
  • Reliability Testing: Includes Thermal Shock for durability under temperature stress and Solderability Tests to ensure optimal component assembly.
Q: How do you ensure the quality of BGA and fine-pitch component soldering? ▼

Our PCBA process incorporates:

  • SPI (Solder Paste Inspection) after stencil printing to verify volume and alignment before reflow.
  • AOI after reflow for component presence, polarity, and general solder joint quality.
  • X-Ray Inspection for hidden solder joints, specifically for BGAs, QFNs, and other bottom-terminated components to check for voids and shorts.
Q: Do you offer Functional Testing? ▼

Yes. We are equipped to handle In-Circuit Test (ICT) and Functional Circuit Test (FCT). Customers must provide the test procedure, test fixture, and any required software, or we can assist in designing and fabricating the custom test fixture. We currently offer free functional test service for orders of 1 to 10 units.

Q: Do you offer Design for Assembly (DFA) review? ▼

Yes. We provide a free DFA review on all projects. Our experienced engineers check your design files for potential manufacturability issues, such as component spacing, solder mask clearance, and pad-to-pad clearances. This proactive review helps prevent assembly errors, streamlines production, and reduces the risk of costly rework, ensuring a smoother and more reliable manufacturing process from the very start.

3. Traceability, Reliability & Risk Management

Q: How do you handle material authenticity and supply chain risk? ▼

We have a comprehensive Approved Vendor List. For components, we prioritize procurement from verified authorized distributors and direct manufacturers(like DigiKey, Mouser, Arrow Electronics, TI and STMicroelectronics etc.) to mitigate the risk of counterfeit parts. Our processes comply with anti-counterfeiting standards as defined by the industry.

Q: What level of traceability can you provide for my finished boards? ▼

We offer full traceability through unique serial numbers or QR codes etched onto the PCB/PCBA. This allows us to track the board's entire history, including:

  • Raw material batch/lot numbers.
  • Date of manufacture and production line data.
  • Key inspection and test results (e.g., AOI/X-Ray images, FCT results, Microsection/Thermal shock/Solderability test reports).
Q: What is your process for handling a quality non-conformance (Complaint)? ▼

Any quality issue is immediately logged under our Corrective and Preventive Action system. We execute a structured root cause analysis, a detailed report outlining the cause, containment, corrective action, and prevention measures is provided to the customer.