Support Team
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support@nextpcb.comIdentify and resolve manufacturing issues before production with our comprehensive DFA (Fabrication, Design, and Assembly) check service - completely free of charge.
Our DFA check service helps identify potential issues before production, saving you time, money, and frustration.
Identify and resolve potential manufacturing issues before they cause delays in your production timeline.
Fixing issues before production starts is significantly less expensive than making changes during or after manufacturing.
Ensure your designs are optimized for efficient manufacturing, resulting in higher quality products and faster delivery.
Our engineering team will analyze your PCBA files and provide a comprehensive DFA report within one working day.
Drag and drop your PCBA files here
or
PCBA file needs to include Gerber, coordinate files, and BOM(zip/rar/7z)
All files will be kept strictly confidential.
Your files will be analyzed and a detailed DFA report will be sent to your email within one working day.
Download our free HQDFM software to perform detailed Design for Analysis checks directly on your workstation. Instantly identify potential manufacturing issues before sending your design for production.
Our comprehensive DFA check covers these critical aspects of your PCBA design.
| Production Process | Issue Description | Severity |
|---|---|---|
| Production process | Check if the Gerber files are complete, including all layers and drill files | High |
| Verify PCB silk layer has all component reference designators with correct orientation | High | |
| Customer document confirm | Check if documentation includes necessary information (position, x/y coordinates, rotation angle, orientation) | High |
| Verify BOM for part number and quantity matching, component type and value description consistency, and proper reference designators | High | |
| PCB | For components smaller than 0402 or with pitch less than 0.5mm, PCB surface treatment must use ENIG to avoid solder paste defects and inconsistent size issues | High |
| For dense QFP components (pin pitch < 0.5mm) or BGA with ball pitch < 1.27mm, avoid HASL surface treatment to prevent uneven surface affecting soldering | High | |
| For BGAs with solder pad diameter < 10mil (0.25mm), PCB surface treatment should not use HASL (with or without lead), use ENIG instead | High | |
| Verify Gerber parameters consistency across systems: material, Tg value, board thickness, surface finish, stack-up, solder mask color, silkscreen color, copper weight, and impedance control requirements | High | |
| Check if Gerber has thermal relief pads. ICs should use thermal relief pads, while other components may use solid pads or thermal relief pads depending on size | High | |
| PCB copper should maintain at least 0.4mm distance from edges (V-cut ≥ 0.4mm; routing board ≥ 0.2mm) to prevent copper exposure or line damage | Medium | |
| Verify component package compatibility with solder paste design | High | |
| Check if through-hole dimensions are appropriate. For selective wave soldering components, ensure diameter is at least 0.3mm larger than component lead diameter | High | |
| PCB | For asymmetrical connectors/sockets, verify silkscreen indicates pin 1 or orientation | High |
| Check if silkscreen indicates ON position for switches (or pin positions) | High |
Hear from engineers who have used our DFA check service.
Upload your files today and receive a comprehensive DFA report within one working day - completely free of charge.
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