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Choosing a PCB manufacturer often starts with a simple question: what can the factory actually build? This article lines up the standard-tier PCB capability pages published by three commonly compared manufacturers — JLCPCB's Rigid PCB capability page, PCBWay's "PCB Capabilities – Standard PCB" table, and NextPCB's Standard PCB Capabilities page — and compares them spec by spec: layer count, board size, thickness, copper weight, trace width and spacing, drilling, surface finish, solder mask, silkscreen, panelization, and testing.
* This article compares only the specifications explicitly published on each company's standard-tier capability page. A manufacturer may support additional processes, materials, or tolerances through engineering review, advanced capability programs, or custom quotations even if those capabilities are not listed on the standard page reviewed here.
All three manufacturers split their published specifications into at least two tiers: a "Standard" or "Rigid" tier for everyday FR-4 designs, and a separate "Advanced" tier for higher layer counts, exotic substrates (Rogers, ceramic, PTFE), tighter tolerances, and HDI structures. This comparison covers only the standard tier — JLCPCB's Rigid PCB capability page, PCBWay's Standard PCB capability table, and NextPCB's Standard PCB Capabilities page. Readers working on rigid-flex, Rogers, ceramic, or very high-layer-count boards should instead consult each company's advanced capability page; NextPCB's is published at Advanced PCB Manufacturing Capabilities.
PCB manufacturers update their published specifications periodically as equipment and processes change, so figures below reflect what was published at the time this article was written. For a project-specific check, running Gerber or ODB++ files through a free DFM review is the most reliable way to confirm whether a design fits within a factory's current capabilities.
Layer count and base material determine what kind of board a factory's standard tier can actually produce. JLCPCB's Rigid PCB page publishes layer counts up to 32 layers within its rigid tier, while PCBWay's Standard PCB table caps out at 14 layers, with anything above that routed to its Advanced PCB tier. NextPCB publishes support for up to 32-layer PCBs on its Standard PCB Capabilities page.
JLCPCB and PCBWay both list Aluminum-core and Copper-core boards directly on their standard/rigid capability pages;The NextPCB Standard PCB Capabilities page focuses on FR-4 materials, while specialty materials are documented elsewhere on the website.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Layer count | 1–32 layers | 1–14 layers (above 14 layers requires the Advanced PCB tier) | Commonly supports 1–20 layers; (above 20 layers requires the Advanced PCB tier) |
| Base materials listed on this page | FR-4 (Grade A laminates from Nan Ya, KB, Shengyi, etc.); Aluminum-Core (1 layer); Copper-Core (1 layer, direct heatsink contact ≥1×1mm); RF PCB (1 oz copper, 2-layer, Rogers/PTFE core) | FR-4, Aluminum, Copper Base (Flex, Rigid-Flex, HDI, Halogen-free, and High-Tg materials are routed to the Advanced PCB tier) | FR-4 only (Tg130 / Tg150 / Tg170); Aluminum, Copper Base (Flex, Rigid-Flex, HDI, Halogen-free, and High-Tg materials are routed to the Advanced PCB tier) |
| Controlled impedance | Supported for 4/6/8/10/12/14/16/18/20/…/32-layer stack-ups; tolerance ±10% | Not listed on the Standard PCB page | Supported for 4/6/8/10/12/14/16/18/20-layer stack-ups (NextPCB-designed by default, or customer-supplied stack-up); tolerance ±10%. Published stackups are available through 20 layers; even though overall PCB layer count support extends to 32 layers. |
Designers who need an impedance-controlled stack-up can model trace geometry with NextPCB's PCB Impedance Calculator before submitting Gerbers.
Maximum panel size is heavily material- and layer-dependent for all three manufacturers, so the figures below are broken out by configuration rather than reduced to a single number.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Maximum board size | FR-4 2-layer: 670×600mm (up to 1020×600mm for thinner boards under 0.8mm); FR-4 4-layer: 663×593mm (up to 1016×596mm for thinner boards); FR-4 6-layer and above: 656×586mm; Aluminum: 602×506mm; Copper: 480×286mm; Rogers/PTFE: 590×438mm | Single-sided and double-sided PCB: 600×1200mm; Multilayer PCB: 560×1150mm | 1–2 layers: 1500×600mm; 4 layers: 1500×500mm; 6+ layers: 500×400mm |
| Minimum board size | FR-4 / Rogers / PTFE: 3×3mm; castellated / plated edges: 10×10mm; Aluminum / Copper: 5×5mm | 3×3mm | ≥10×10mm |
| Outline / dimension tolerance | ±0.1mm (Precision) / ±0.2mm (Regular) for CNC routing; ±0.4mm for V-scoring | ±0.2mm for CNC routing; ±0.5mm for V-scoring | ±0.15mm for CNC routing; ±0.2mm for V-CUT |
Note on the board size figures above: JLCPCB's published capability diagram does not state whether its "maximum board size" row describes a single PCB outline or a full customer-supplied production panel. JLCPCB's own Help Center documentation (the "PCB Dimensions" article) states that a single board submitted under "Single PCB" delivery is limited to 400×500mm, with V-cut panels capped at 400×400mm and a 3×3mm minimum — figures well below the 600–1020mm range shown in the table above. The larger numbers most likely describe the maximum panel/array size the line can process under "Panel by Customer" delivery rather than a single uploaded board outline. Anyone designing a single, non-panelized board should size to the smaller limit and confirm the exact figure via DFM before finalizing a design.
*All NextPCB values were verified against the desktop version of the Standard PCB Capabilities page because some older mobile-rendered versions still display legacy dimensions.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Board thickness range | 0.4–4.5mm (standard steps: 0.4/0.6/0.8/1.0/1.2/1.6/2.0mm; 2.5mm and above reserved for 12+ layer boards) | 0.2–3.2mm (0.2/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/2.6/2.8/3.0/3.2mm) | 0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.0/3.2mm |
| Thickness tolerance (≥1.0mm) | ±10% | ±10% | ±10% |
| Thickness tolerance (<1.0mm) | ±0.1mm | ±0.1mm | ±0.1mm |
| Finished outer copper weight | 2-layer: 1/2/2.5/3.5/4.5oz; multilayer: 1/2oz | 1–8oz (Standard page) | Up to 2oz (Standard page) |
| Finished inner copper weight | 0.5/1/2oz (0.5oz by default) | 1/1.5/2/3/4oz | 0.5/1/2oz |
PCBWay's currently published Standard PCB table lists outer copper weight support up to 8 oz. JLCPCB's standard tier publishes the widest outer copper option specifically for 2-layer boards (up to 4.5oz). NextPCB's Standard PCB Capabilities page lists outer copper weight up to 2oz.
| Copper weight | JLCPCB min. trace / spacing | PCBWay min. trace / spacing | NextPCB min. trace / spacing |
|---|---|---|---|
| 0.5oz (inner layer) | Not broken out separately on this page | Not broken out separately on this page | 2.5 mil / 3 mil (≈0.06mm / 0.08mm) |
| 1oz (or ≤2oz general) | 4/4mil (0.1mm / 0.1mm)(1–2 layer), 3.5/3.5mil (multilayer), 3mil only in BGA fan-outs | 4 mil / 4 mil (0.1mm / 0.1mm) — published as one blanket figure, not broken out by copper weight | 3 mil / 3 mil (≈0.08mm / 0.08mm) |
| 2oz |
2-layer:6.5 / 6.5 mil (≈0.17 / 0.17 mm) Multilayer:6 / 6 mil (≈0.15 / 0.15 mm) |
Same blanket figure as above | 5.5 mil / 5.5 mil (≈0.14mm / 0.14mm) |
| 3.5oz | 10 mil / 10 mil (0.25mm / 0.25mm) | Not specified on this page | Not specified on this page |
| 4.5oz | 12mil / 12 mil (0.30mm / 0.30mm) | Not specified on this page | Not specified on this page |
| Track width tolerance | ±20% | Not specified on this page | Not specified on this page |
JLCPCB and NextPCB both publish trace/spacing figures that scale with copper weight, while PCBWay's Standard PCB page states a single 4 mil (0.1mm) figure for both minimum trace and minimum spacing regardless of copper weight. In the industry, designs that need finer geometry than what is listed on standard-tier pages typically require moving to an Advanced/HDI tier with finer trace/space and microvia specifications. Note also that the copper-weight rows above are not all describing the same layer position across vendors: NextPCB's published table explicitly restricts the 0.5oz figure to inner layers and the 1oz/2oz figures to outer layers, while JLCPCB's and PCBWay's pages do not make an inner/outer distinction explicit. Anyone using this table as a like-for-like benchmark should confirm which layer position each vendor's figure actually applies to.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Drill size range | 0.15–6.3mm | 0.15mm–6.0mm | 0.15mm–6.5mm (0.15mm minimum available for board thickness ≤1.2mm) |
| Hole position tolerance | ±0.05mm | Not specified separately from finished hole size tolerance | ≤0.05mm |
| Finished hole size tolerance, plated (PTH) | +0.13 / -0.08 mm | ±0.08mm | ±0.075mm |
| Finished hole size tolerance, non-plated (NPTH) | Not specified with sufficient clarity on the published page | ±0.05mm | ±0.05mm |
| Minimum non-plated holes | 0.5mm | Not specified separately on this page | ≥0.4mm |
| Minimum castellated / plated half-holes | 0.5mm | 0.4mm (minimum diameter of plated half-holes) | ≥0.5mm |
| Rectangular holes / slots | Not supported per the referenced page (sharp-corner rectangular holes and slots without rounded corners are not accepted) | Not specified on the Standard PCB page | Supported (rectangular holes and slots, with or without fillet angles) |
| PTH annular ring | Absolute minimum: 0.15mm (multilayer); recommended ≥0.20mm. | 0.15mm (6 mil) minimum annular ring width | 1oz copper: 3.5 mil (≈0.09mm); 2oz copper: 4.5 mil (≈0.11mm) |
| BGA minimum pad / via dimension | Minimum published value: 0.15mm (multilayer) Recommended: ≥0.20mm |
Not specified on the Standard PCB page | ≥0.2mm (1oz copper), with 0.15mm minimum distance between BGA vias |
NextPCB explicitly lists support for rectangular holes and slots, with or without fillet angles, whereas JLCPCB's capability page states that sharp-corner rectangular holes and slots without rounded corners are not supported. For any complex physical layouts, running Gerber or ODB++ files through NextPCB's free HQDFM design analysis tool before ordering is a reliable way to check for manufacturing compatibility.
Edge connectors on PCBs often require gold finger beveling to ensure smooth insertion and mating in card slots. Among the three standard-tier capability pages reviewed, only NextPCB's page explicitly publishes bevel angle, angle tolerance, and depth tolerance figures.These parameters are not explicitly stated on the standard-tier comparison pages of JLCPCB or PCBWay.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Gold finger beveling angles | Not specified on the referenced page | Not specified on the Standard PCB page | 20°, 30°, 45°, 60° |
| Angle tolerance | Not specified on the referenced page | Not specified on the Standard PCB page | ±5° |
| Bevel depth tolerance | Not specified on the referenced page | Not specified on the Standard PCB page | ±0.1mm |
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Surface finishes offered | HASL (leaded / lead-free), ENIG, OSP. Availability by material/layer count: FR-4 (≤4 layers) supports all three; FR-4 6+ layer and RF boards: ENIG only; Aluminum-core: HASL only; Copper-core: OSP only | HASL with lead, HASL lead-free, Immersion Gold, OSP, Hard Gold, Immersion Silver, Immersion Tin, ENEPIG | Surface finishes available but not itemized on the Standard PCB capability page. |
| Solder mask type | LPI (Liquid Photo Imageable) | LPI (Liquid Photo-Imageable); thermosetting ink used on low-cost, paper-based boards | Not named specifically on this page |
| Solder mask colors | Green, Purple, Red, Yellow, Blue, White, Black | Green, Red, Yellow, Blue, White, Black, Matte Green, Matte Black, Purple, None | Green, Red, Yellow, Blue, White, Matte Black, Black |
| Solder mask opening / expansion | Not specified with sufficient clarity on the published page | Not specified numerically on this page | ≥1.5 mil (≈0.04mm) |
| Solder mask bridge (minimum dam spacing) | ≈0.1mm | Not specified on this page | Green: 3.5 mil; Black/White: 5 mil; other colors: 4 mil |
PCBWay publishes the broadest copper-weight range on its Standard PCB page, though manufacturability depends on board thickness, layer count, and design rules.The Standard PCB Capabilities page does not enumerate specific finish options, although multiple finish types are available elsewhere on the NextPCB website.
Additionally, NextPCB offers via plugging/tenting and Via-in-Pad services through dedicated process pages, although these features are not itemized in the Standard PCB Capabilities table used for this comparison.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Minimum line width | 4/6/8 mil, depending on print method | 0.15mm minimum character width | Silkscreen printing: ≥5 mil (≈0.12mm); inkjet/printer printing: ≥3 mil (≈0.08mm) |
| Minimum character / text height | Not specified with sufficient clarity on the published page | 0.8mm | Silkscreen printing: ≥30 mil (≈0.76mm); inkjet/printer printing: ≥24 mil (≈0.61mm) |
| Character width-to-height ratio | 1:5 | 1:5 | ≥6:1 |
| Silkscreen colors | Not itemized separately on this page | White, Black, Yellow, None | Not itemized by color on this page |
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Panelization methods listed | Not specified with sufficient clarity on the published page | V-scoring, tab-routing, tab-routing with perforation (stamp holes) | Not itemized by method name, but the page covers both V-CUT and routed/milled panels separately |
| Panel spacing — routed / tab panels | Not specified with sufficient clarity on the published page | Minimum 1.6mm clearance between boards for break-routing | ≥1.6mm |
| Panel spacing — V-score panels | Not specified with sufficient clarity on the published page | Spacing between boards set to zero | 0mm |
| Round board panelization | Not specified with sufficient clarity on the published page | Not specified on the Standard PCB page | Supported for board size ≥80×80mm |
| Breakaway tab width | Not specified | Not specified | ≥4mm |
| Breakaway tab width (mouse-bite type) | Not specified | Not specified | ≥5mm |
| Stamp hole-to-hole spacing | Not specified | Not specified | Recommended 0.2–0.3mm between adjacent stamp holes |
| Edge rail width | Not specified | Not specified | ≥3mm |
| Castellated panel requirements | Not specified | Not specified | Supported (specific layout rules apply) |
NextPCB's Standard PCB Capabilities document lists unique mechanical panelization details directly, such as minimum dimensions for round board panelization (≥80×80mm), breakaway tabs (≥4mm, or ≥5mm for the mouse-bite variant), recommended stamp-hole-to-hole spacing (0.2–0.3mm), and edge rails (≥3mm), along with specific requirements for castellated panels. These finer details are not explicitly itemized on the other manufacturers' standard pages.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Electrical testing | Not listed on the referenced capability page (100% electrical testing stated elsewhere) | Fly Probe Testing (free), A.O.I. testing (free) | Flying probe testing (no pad-count limit) or fixture-based testing (up to 14,000 pads) |
| Certifications listed | Not listed on the referenced capability page. | ISO 9001:2008, UL Certificate | IPC-A-600, ISO 9001:2015, RoHS, UL [Certifications referenced from capability and certificate resources] |
NextPCB's full certification documentation is available on its Certificate page, and a category-by-category breakdown of electrical and visual test methods is covered in PCB & PCBA Test Methods by Category.
For a quick scan, the headline figures from every section above are condensed into one table here. Detailed breakdowns by layer count, copper weight, and material are in the sections above.
| Specification | JLCPCB (Rigid PCB) | PCBWay (Standard PCB) | NextPCB (Standard PCB) |
|---|---|---|---|
| Layer count | 1–32 layers | 1–14 layers | 1–32 layers |
| Materials on this page | FR-4, Aluminum-Core, Copper-Core, RF (Rogers/PTFE) | FR-4, Aluminum, Copper Base | FR-4 only (Tg130 / Tg150 / Tg170) |
| Largest published board size (this tier) | Up to 1020×600mm (certain thin-board configurations) | 600×1200mm | 1500×600mm |
| Smallest published board size | 3×3mm (FR-4) | 3×3mm | ≥10×10mm |
| Board thickness range | 0.4–4.5mm | 0.2–3.2mm | 0.6–3.2mm |
| Outer copper weight range | 1–4.5oz | 1–8oz (Standard page) | 1–2oz (Standard page) |
| Min. trace / spacing (lightest copper) | 4 / 4 mil (0.10 / 0.10 mm) (3 mil only stated as acceptable in BGA fan-outs) |
4/4 mil (0.1/0.1mm) | 2.5/3 mil (0.06/0.08mm) |
| Drill size range | 0.15–6.3mm | 0.15–6.0mm | 0.15–6.5mm |
| Gold finger beveling | Not specified on referenced page | Not specified on referenced page | Supported (20°, 30°, 45°, 60°) |
| Named surface finishes | 3 (HASL, ENIG, OSP); Availability varies by material and layer count. | 8 (incl. ENEPIG, Hard Gold, Immersion Silver/Tin) | Not itemized by name on standard page |
| Solder mask colors | 7 | 10 (incl. matte options and none) | 7 |
| Electrical testing stated | Not specified on referenced page (100% testing stated elsewhere) | Fly probe + AOI (free) | Flying probe or fixture (up to 14,000 pads) |
| Certifications stated | Not listed on referenced page | ISO 9001:2008, UL | IPC-A-600, ISO 9001:2015, RoHS, UL |
Based strictly on what each company has published for its standard tier: projects that require a very wide named finish menu (ENEPIG, Hard Gold, Immersion Silver/Tin) without leaving the standard tier are best matched by PCBWay's published table. Projects that need very thin boards (down to 0.2mm) or finished copper weight up to 8oz on a "standard"-labeled tier are also better matched by PCBWay's published range, though these two PCBWay figures in particular should be reconfirmed against the live page before relying on them (see the Sources & Methodology note below). Projects that need a large single- or double-sided panel (up to 1500×600mm) are well-suited to NextPCB's standard capabilities, while those needing a very small minimum board outline (down to 3×3mm for FR-4) are supported by JLCPCB and PCBWay.
Because exact fit depends on the full design — layer stack-up, copper weight per layer, finish, and tolerances together — the most reliable next step for any specific board is to request a quote or run the files through NextPCB's free DFM review, or to contact NextPCB directly with the design files for a manual capability check.
NextPCB figures in this article are taken directly from the live Standard PCB Capabilities page at the time of writing. NextPCB data was verified directly against the desktop HTML source code of the live Standard PCB Capabilities page rather than mobile-rendered content. JLCPCB figures are taken from screenshots of JLCPCB's published Rigid PCB capability page (PCB Specifications, Drilling, Traces, Soldermask, and Legend tables). PCBWay figures are taken from a screenshot of PCBWay's published "PCB Capabilities – Standard PCB" table. All three companies update their published specifications periodically, so figures should be treated as a snapshot rather than a permanent guarantee.
A small number of finer sub-specifications visible in the JLCPCB screenshots — for example, certain hole-size tolerance breakdowns, solder mask expansion ratio, and a few panelization figures — were not legible with enough confidence to report accurately and are marked "Not specified" in the tables above rather than estimated. This comparison does not include each company's Advanced PCB, Flex PCB, or PCB Assembly capability pages, which are published separately and cover different specifications.
*Because manufacturers periodically update their published specifications, readers should verify critical parameters directly against the latest capability pages before placing production orders.
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