Hot Air Solder Leveling and Lead-free HASL (Lead-Free Hot Air Solder Leveling) are the two prominent surface finishes in the PCB Manufacturing and Assembly Process. However, there is a noticeable difference; Lead-Free HASL does not use Tin and Lead Solder.
Yet, when choosing the right surface finish for your circuit boards, it is vital to choose a cost-effective and RoHS -compliant surface finish. Suppose you want to use HASL as your surface finish choice and need help deciding which surface finish to use. In that case, this guide examines the pros and cons differences between HASL and Lead-free HASL.
Surface Finish is metalizing the outer layer of a Printed Circuit Board being soldered. The function of PCB surface finish is to offer protection against corrosion on the copper circuitry. Also, it fosters easy soldering of components on the circuit board.
There are varied kinds of Surface Finishes employed in the PCB Industry. They are: Hot Air Solder Leveling (HASL), Electroless Nickel/Immersion Gold (ENIG), Immersion Silver (ImAg), Organic Solderability Preservative (OSP), and Immersion Tin (ImSn)
Hot Air Solder Leveling (HASL) is the least expensive PCB surface finish. Many PCB Manufacturers commonly use this surface finish as it is economical and widely available. When applying Hot Air Surface Leveling on circuit boards, the board is dipped in molten solder and then scrapped off with a hot air knife.
PCB Manufacturers that employ Through Hole Technology or Larger Surface Mount Technology designs, Hot Air Surface Leveling excels in these designs. For smaller boards, it is not ideal. Also, The solder used is typically Tin-Lead solder, making it RoHS non-compliant.
Lead-free Hot Air Solder Leveling is a type of surface finish that employs lead-free solder alloys. Instead of the conventional Tin-Lead eutectic alloys used by HASL, Lead-free HASL employs other solder alloys that do not contain lead.
When applying Lead-free HASL on the circuit board, molten solder is first used on the circuit board to achieve wetting. Then, air knives (usually set at a temperature above the lead-free solder melting point) are used to scrap off excess solder.
After the solder has solidified, the circuit board is passed through the washer, where solder flux residues are removed.
Despite being considered an environmental alternative to the standard Hot Air Surface Leveling, Lead-free Hot Air Surface Leveling is least employed in surface finishes. The reason is that other innovative surface finishes are available in the PCB market. They include Organic Solderability Preservative (OSP) and Electroless Nickel Immersion Gold (ENIG)
Many Customers understand the Hot Air Surface levelling process. Still, they need to learn the difference between HASL and Lead-free HASL. However, the differences between them are:
Choosing the proper Surface finishing during PCB production is essential. This careful consideration is because PCBs are found in every electronic component worldwide, ranging from colossal industrial engines to children’s toys.
Hence, PCB production is taken seriously to avoid exposing toxic materials such as lead to children and adults, which could adversely affect their health. Hence, since EU RoHS's inception in 2006, HASL has taken on a new approach by not utilizing lead in its surface finishes.
Hot Air Surface Leveling application in surface finishing is a common trend in the PCB industry. This guide has provided differences between Hot Air Surface Leveling and lead-free Hot Air Surface Leveling as they provide respective physical and mechanical strengths in their application.
Also, while HASL offers cost-effective benefits to PCB surface finishes, it is not RoHS compliant. As a result, should ensure high safety upon application of these finishes.