Regarding the knowledge of chip decryption, we know from the surface that it has the meaning of chip and decryption. If we want to understand chip decryption more deeply, we must start from these two points. The following is to explain to everyone around the chip.
What we usually call "chip" refers to integrated circuits, which are the main products of microelectronics technology. The so-called microelectronics refers to the concepts of "strong electricity" and "weak electricity", which means that the electronic signals it processes are extremely small. It is the foundation of modern information technology. The electronic products we usually come into contact with, including communications, computers, intelligent systems, automatic control, space technology, radio, television, etc., are all developed based on microelectronics technology.
Information communication in China and electronic terminal equipment products have made great progress in recent years, but they are good at processing and assembly, assembly technology, and application engineering. The core technology of the product is less developed independently. The "core technology" mentioned here is mainly microelectronics technology. .It seems that the level of our house building is pretty good, but the bricks and tiles used to build the house can’t be produced yet. What’s worse is that "bricks" are still very expensive. Generally speaking, the cost of "chips" can affect the whole machine's cost.
Microelectronics technology involves many industries, including the chemical industry, optoelectronic technology, semiconductor materials, precision equipment manufacturing, software, etc. Among them, integrated circuit technology is the core, including integrated circuit design and manufacturing.
Wafers, multi-finger single crystal silicon wafers, are refined from ordinary silicon salad and are the most commonly used semiconductor materials. According to their diameters, they are divided into 4 inches, 5 inches, 6 inches, and 8 inches. Inches or even larger specifications. The larger the wafer, the more ICs that can be produced on the same wafer, which can reduce costs; but it requires higher material technology and production technology.
Pre- and post-process: In the IC manufacturing process, the process of wafer lithography (the so-called tape-out) is called the pre-process, which is the most critical technology for IC manufacturing; after the wafer is tape-out, it's cutting, packaging, and other processes It is called post-process.
Lithography: The main process method of IC production, which refers to the etching of circuits on wafers by photolithography.
Line width: 4 micron/1 micron/0.6 micron/0.35 micron/035 micron, etc., refers to the minimum wire width that can be achieved by the IC production process and is the main indicator of the advanced level of IC technology. The smaller the line width, the higher the integration, Integrate more circuit units on the same area.
Encapsulation: refers to connecting the circuit pins on the silicon chip to the external joints with wires to connect with other devices.
Memory: IC specially used to store data information.
Logic circuit: Digital circuit based on the principle of the binary system.