Blog >> Blog Details Page
Basic principle of pcb cascading design
Posted:05:26 PM December 18, 2018 writer: G

What a smart CAD engineer needs to do is: how to comprehensively consider the opinions of all parties to achieve the best combination.

The following is a cascading design reference summarized by EDADOC experts based on their personal experience in PCB design of communication products, and shared with everyone. Basic Principles of PCB Layout Design After completing the layout (or pre-layout), the CAD engineer will focus on the analysis of the wiring bottle diameter of the board, and then combine the EDA software report parameters on the wiring density (PIN/RAT), and integrate the board such as the differential line. The number and type of signals with special wiring requirements such as sensitive signal lines and special topologies determine the number of wiring layers. The performance of the integrated board is based on the power supply, the type and distribution of the boards, and the number of signal layers with special wiring requirements. Indicator requirements and cost tolerance, determine the power supply of the board, the number of layers of the ground, and their relative placement with the signal layer.

The general principle of the layout of veneer layers:

A) the layer adjacent to the component side is a ground plane, providing a device shielding layer and providing a reflow plane for the top layer wiring;

B) all signal layers are as close as possible to the ground plane (ensuring that the critical signal layer is adjacent to the ground plane);

C) the main power source is as adjacent as possible to it;

D) Try to avoid direct proximity of the two signal layers;

E) Consider the symmetry of the laminated structure. When setting the layer of a specific PCB, it is necessary to flexibly master the above principles. According to the requirements of the actual board, determine the layout of the layers and avoid moving the hard cover.

The following is a list of recommended layouts for common veneers for your reference (not limited to these, depending on the actual situation). Note: S——SIGNAL LAYER P——POWER LAYER G——GROUND LAYER

  • PCB
    Prototype
  • PCB
    Assembly
  • SMD
    Stencil

Dimensions: (mm)

×

Quantity: (pcs)

5
5
10
15
20
25
30
40
50
75
100
120
150
200
250
300
350
400
450
500
600
700
800
900
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
6500
7000
7500
8000
9000
10000

Other Quantities:(quantity*length*width is greater than 10㎡)

OK

Layers:

Thickness:

Quote now