Beyond PCB/PCBA: Deploying IoT Telemetrics Devices at Scale - NextPCB Case Study

The Need for Affordable, Scalable Telematics

In the competitive landscape of fleet management and logistics, operators are under constant pressure to enhance efficiency, ensure safety, and reduce operational costs. The demand is clear: reliable, low-cost telematics solutions that provide real-time vehicle intelligence, not just simple location tracking.

The Challenge: Scaling a Complex IoT Platform Across Continents

A North American fleet management technology company came to NextPCB with a sophisticated but costly telematics prototype. Their device needed to process real-time vehicle diagnostics, GPS tracking, driver behavior analytics, and cellular communications—all within a single, ruggedized unit that could withstand harsh automotive environments. 

The challenge wasn't just PCB manufacturing and assembly; it was transforming a new prototype into a scalable, reliable, and cost-effective platform suitable for deployment across thousands of commercial vehicles

Project Snapshot

Client: Confidential North American fleet technology provider

Product: Automotive-grade telematics & vehicle diagnostics unit

Core Technologies: Multi-processor design with CAN bus integration, OBD-II connectivity, and multi-mode cellular connectivity (LTE-M with 2G/GSM fallback)

Key Services: Full turnkey manufacturing, NPI optimization for scale, 100% functional testing and firmware programming, and box building.

Critical Challenges: Ensuring devices manufactured and tested in China perform reliably under Western regulatory and network conditions while achieving automotive-grade reliability at consumer electronics pricing.

Outcome: 35% Cost Reduction, 99.5% First-time Pass Rate.

Services Provided by NextPCB

Our client entered with a functional prototype but needed a manufacturing partner to transition their design to mass production while maintaining strict cost targets. Working closely with the client, NextPCB delivered a comprehensive turnkey solution encompassing:

PCB Fabrication & Assembly: High-volume, IATF 16949-certified production of multilayer PCBs with mixed-technology assembly, including through-hole parts with unique soldering requirements, conformal coating, and dry ice cleaning.

Testing & Firmware: End-of-line (EOL) validation using optimized test fixtures, secure firmware installation, and individual device serialization to the client's specifications to ensure quality and full lifecycle traceability.

Enclosure Production: Custom design refinement and injection molding for a durable, IP67-rated weather-resistant housing.

Packaging & Customization: Complete box-build with customized packaging solutions.

Design for Manufacturing: NPI optimization to reduce costs and improve production efficiency and yield in a mass production setting.

Key Challenge: Bridging International Testing Standards

One of the most significant hurdles emerged during the testing phase. The client's original testing protocols were developed for Western regulatory environments and network conditions, which differed substantially from the Chinese manufacturing environment, where the devices would be tested during production.

The problem: During initial tests, cellular connection was found to be slow and intermittent, with an increasing number of devices failing to connect at all. Liaising with local network operators and experts, NextPCB worked with the client to debug the issue and discover that the eSIMs and testing firmware were configured for LTE-M with legacy 2G/GSM fallback. Since LTE-M is not available in China and many Asian countries, the devices were relying on a fragmented 2G signal to undergo tests.

Mobile IoT Deployment Map as of Dec 2025 courtesy of GSMA.com

The solution: NextPCB's team collaborated closely with the client's engineering team to develop and test a dual-stage testing protocol that validated devices under both Chinese manufacturing conditions (NB-IoT) and Western operational environments (LTE-M). 

This adaptive approach ensured that every device met performance standards regardless of its final destination, eliminating costly field failures and returns.

Through our New Product Introduction (NPI) process, NextPCB identified multiple opportunities to optimize the design for high-volume manufacturing:

Component and Supply Chain Optimization

BOM Cost Reduction: Identified and qualified functionally equivalent automotive-grade components, achieving significant cost savings while maintaining performance and compliance.

Supply Chain Risk Mitigation: Identified multiple suppliers for critical components to mitigate risk and prevent production disruption.

Strategic Procurement: Liaised directly with suppliers on the client’s behalf to develop custom solutions and secure optimal pricing.

Manufacturing Efficiency

Panel Layout Optimization: Redesigned the PCB panel to maximize throughput while accommodating the device's unique mechanical and thermal constraints.

Assembly Streamlining: Developed custom post-reflow fixtures to simplify handling and reduce manual assembly steps.

Production Digitization: Integrated a Manufacturing Execution System (MES) workflow for automated, traceable QR code labeling and serialization.

Test Process Enhancement: Optimized the client's test jig and test workflow for rapid, foolproof testing, cutting test cycle time.

Risk Mitigation & DFM: Conducted a full production risk assessment, identifying and resolving potential bottlenecks before the manufacturing ramp-up.

Electromechanical and Packaging Support

Supplier Sourcing: Identified and vetted specialized local manufacturers with proven expertise in high-volume injection molding for durable enclosures.

Logistics-Optimized Packaging: Redesigned packaging to meet stringent overseas export safety regulations while minimizing dimensional weight (DIM weight) to reduce shipping costs.

Results: Scalable, Reliable Production at Target Cost

The collaboration yielded significant outcomes:

• 30% Reduction in unit manufacturing cost compared to the client’s initial estimates
• 99.2% First-Pass Yield achieved through comprehensive testing protocols
• Scalable Production from an initial 500-unit batch to an ongoing 10,000-unit monthly capacity
• Zero Field Failures attributable to manufacturing or testing issues
• 90-Day Reduction in time-to-market versus the client’s projected timeline

Why choose NextPCB for your IoT Hardware Products?

Whether you're developing automotive asset trackers, consumer IoT devices, or industrial sensors, NextPCB go beyond just PCB/PCBA production to provide a complete manufacturing ecosystem to scale your prototype to market.

Our international experience bridges communication, cultural, and technical barriers, allowing us to develop custom solutions that make the most of our advanced manufacturing capabilities, mature supply chain, and engineering expertise.

Ready to scale? Contact us for a comprehensive review and quote to optimize cost, reliability, and global compliance under one roof.