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The function of the PCB is to provide a base for completing the first-level assembly of the components and other necessary electronic circuit parts to form a module or finished product with a specific function. Therefore, the PCB plays an integral role in the entire electronic product. Therefore, the role is often the first to be questioned when the function of electronic products fails. It is often the PCB. Figure 1.1 shows the hierarchy of electronic components.
The diversification of the material-level manufacturing process is suitable for different electronic products and their special needs. The following summarizes some general different methods to briefly introduce the classification of PCB and its manufacturing method.
Material: Fr-4
Layer Count: 14 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 4/4mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4(+RCC)
Layer Count: 10 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.125mm
Via Process: Tenting Vias
Surface Finish: ENIG
PCB is the abbreviation of the...