Feedback:
support@nextpcb.com
In recent years, the LED industry has developed rapidly, but the heat dissipation problem has always plagued the application and development of LEDs, especially high-power LEDs in the lighting field. The application of metal substrates provides a new way to effectively solve the heat dissipation problem of LEDs.
Metalcore PCB has special magnetic permeability, excellent heat dissipation, high mechanical strength, and good processing performance. For metalcore substrates, there are aluminum and copper substrates. The aluminum substrate is metal-based copper clad laminate with good heat transfer and heat dissipation function, but the copper substrate is better than aluminum, and its price is more expensive than aluminum.
1) Dissipate heat and control temperature effectively, Reduce the risk of damaging product performance;
2) Stable coefficient of thermal expansion (CTE) and the dimensional stability coefficient, even under deformation and stress caused by temperature changes;
The price of the metalcore PCB depends on the thickness of the copper foil, thermal conductivity, and material source. Because of their cost advantages, aluminum PCBs are very popular in the LED market,
and metalcore PCBs are widely used in fields ranging from LED lights, power converters, motor controllers, audio equipment to photovoltaic applications.
If you need to order aluminum PCB or other metal materials, please contact the online service. If you encounter challenges in choosing which material is more suitable for your PCB design, NextPCB experts will provide you with professional advice and solutions, including PCB prototypes, PCB assembly, and turnkey services in PCB manufacturing.
Items |
Manufacturing Capabilities |
Aluminum thickness |
0.8-2.0mm |
Thermal conductivity |
1.5W /(m·K)和2.0W /(m·K) |
Peeling strength |
> 9lb / in |
Solder resistance |
SF:288℃,> 180秒 |
Breakdown voltage |
> 3000v |
Dielectric loss angle |
0.03 |
Flammability |
UL 94V-0 |
Material: SYTECH
Layer Count: 4 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 0.1mm/0.1mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG+OSP
Material: Fr-4
Layer Count: 4 layers
PCB Thickness: 1.4mm
Min. Trace / Space Outer: 0.065mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4
Layer Count: 14 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 4/4mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
PCB is the abbreviation of the...