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High TG PCB

"TG" refers to the glass transition temperature of the printed circuit board (PCB); it is the temperature point at which the PCB material begins to change. If the operating temperature exceeds the specified TG value, the circuit board will change from a solid-state to a rubber state and adversely affect the performance of the PCB.

Generally, standard PCBs are made of materials with a TG value of 140°C and can withstand an operating temperature of 110°C. These PCB materials will soften, melt, or even deform at high temperatures, which will reduce the mechanical and electrical properties of the entire product. Therefore, this ordinary PCB may not be suitable for the extreme temperature conditions common in applications such as industrial electronics, automobiles, and high-temperature electronics.

High TG PCB means that the TG value of the PCB material is greater than 170°C. The higher the TG value, the better the heat resistance, chemical resistance, and stability of the PCB.

 

Features:

Generally, the TG value of the PCB should be at least 10-20°C higher than the working temperature of the product. If the TG value is 130°C, the working temperature should be lower than 110°C; if the TG value is 170°C, the working temperature should be lower than 150°C. High heat is very scary for unprotected PCBs. The dielectric and conductors will be damaged, and mechanical stress will be generated due to the difference in thermal expansion rate, which will lead to unstable performance or even complete failure.

If you are using a high-power density design or need a lead-free PCB assembly manufacturing process, then high TG PCB may be the only partner in PCB manufacturing. The more heat you need to handle, the greater the impact on PCB design. Adding radiators and fans may increase the weight, size, and cost of the product. Lower power density power may limit the effectiveness of the overall result. In this case, high TG materials may be the right choice to become part of the overall thermal control solution.

 

Materials:

FR-4 is a NEMA grade designation for glass-reinforced epoxy laminate material. PCB made of FR-4 material has higher heat resistance than standard PCB. Generally, the TG value of FR-4 material is 120-180°C. If your requirement for TG is at least 200°C, you can also choose ceramic, polyimide, or PTFE materials.

NextPCB is an experienced PCB prototype and PCB assembly manufacturer, providing high TG PCB made of FR-4 with high heat resistance as substrate material. Many customers from the military, defense, electric power, nuclear energy, electric power, automotive, and other industries regard NextPCB as an important partner for their PCB design and manufacturing. If you have any plans for your PCB project, NextPCB will provide you with the ideal solution.

 

Check NextPCB High-Tg PCB manufacturing capacity in the table below:

 

Items

Manufacturing Capabilities

Material

Tg140 FR-4, Tg150 FR-4, Tg170 FR-4, Tg150 FR-4 (Halogen-free), Tg170 FR-4 (Halogen-free)

Min. Track/Spacing

2mil

Min. Hole Size

0.15mm

Finished Copper

0.5-13oz

Board Thickness

0.2-6mm

Surface Finishing

HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, ENEPIG

Solder Mask

Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green

Silkscreen

White, Black

Via Process

Tenting Vias, Plugged Vias, Vias not covered

Testing

Fly Probe Testing (Free) and A.O.I. testing

 

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11:34 AM August 31, 2020

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