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"TG" refers to the glass transition temperature of the printed circuit board (PCB); it is the temperature point at which the PCB material begins to change. If the operating temperature exceeds the specified TG value, the circuit board will change from a solid-state to a rubber state and adversely affect the performance of the PCB.
Generally, standard PCBs are made of materials with a TG value of 140°C and can withstand an operating temperature of 110°C. These PCB materials will soften, melt, or even deform at high temperatures, which will reduce the mechanical and electrical properties of the entire product. Therefore, this ordinary PCB may not be suitable for the extreme temperature conditions common in applications such as industrial electronics, automobiles, and high-temperature electronics.
High TG PCB means that the TG value of the PCB material is greater than 170°C. The higher the TG value, the better the heat resistance, chemical resistance, and stability of the PCB.
Generally, the TG value of the PCB should be at least 10-20°C higher than the working temperature of the product. If the TG value is 130°C, the working temperature should be lower than 110°C; if the TG value is 170°C, the working temperature should be lower than 150°C. High heat is very scary for unprotected PCBs. The dielectric and conductors will be damaged, and mechanical stress will be generated due to the difference in thermal expansion rate, which will lead to unstable performance or even complete failure.
If you are using a high-power density design or need a lead-free PCB assembly manufacturing process, then high TG PCB may be the only partner in PCB manufacturing. The more heat you need to handle, the greater the impact on PCB design. Adding radiators and fans may increase the weight, size, and cost of the product. Lower power density power may limit the effectiveness of the overall result. In this case, high TG materials may be the right choice to become part of the overall thermal control solution.
Materials of High TG PCB
FR-4 is a NEMA grade designation for glass-reinforced epoxy laminate material. PCB made of FR-4 material has higher heat resistance than standard PCB. Generally, the TG value of FR-4 material is 120-180°C. If your requirement for TG is at least 200°C, you can also choose ceramic, polyimide, or PTFE materials.
NextPCB is an experienced PCB prototype and PCB assembly manufacturer, providing high TG PCB made of FR-4 with high heat resistance as substrate material. Many customers from the military, defense, electric power, nuclear energy, electric power, automotive, and other industries regard NextPCB as an important partner for their PCB design and manufacturing. If you have any plans for your PCB project, NextPCB will provide you with the ideal solution.
Check NextPCB High-Tg PCB manufacturing capacity in the table below:
Items |
Manufacturing Capabilities |
Material |
Tg140 FR-4, Tg150 FR-4, Tg170 FR-4, Tg150 FR-4 (Halogen-free), Tg170 FR-4 (Halogen-free) |
Min. Track/Spacing |
2mil |
Min. Hole Size |
0.15mm |
Finished Copper |
0.5-13oz |
Board Thickness |
0.2-6mm |
Surface Finishing |
HASL lead-free, Immersion gold, OSP, Hard Gold, Immersion Silver, ENEPIG |
Solder Mask |
Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green |
Silkscreen |
White, Black |
Via Process |
Tenting Vias, Plugged Vias, Vias not covered |
Testing |
Fly Probe Testing (Free) and A.O.I. testing |
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.2mm
Min. Trace / Space Outer: 0.102mm/0.1mm
Min. Drilled Hole: 0.1mm
Via Process: Tenting Vias
Surface Finish: ENIG+OSP
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.0mm
Min. Trace / Space Outer: 0.075mm
Min. Drilled Hole: 0.1mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4
Layer Count: 14 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 4/4mil
Min. Drilled Hole: 0.25mm
Via Process: Tenting Vias
Surface Finish: ENIG
PCB is the abbreviation of the...