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Material: Fr-4(+RCC)
Layer Count: 10 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 3/3mil
Min. Drilled Hole: 0.125mm
Via Process: Tenting Vias
Surface Finish: ENIG
NextPCB is a high-quality PCB Manufacturer in Shenzhen China. With professional PCB manufacturing capabilities, our PCB engineers with more than 10 years of experience will double-check your engineering files. Besides, NextPCB is certified by IATF16949, ISO9001, ISO14001, UL, CQC, RoHS and REACH; more importantly, we handle the whole process including PCB prototype, PCB manufacturing, PCB assembly, testing, and final shipment. We are capable of assembling BGA, Micro-BGA, QFN, and other leadless package parts. We also have an online parts shop, you can choose any parts you need.
Material: SYTECH
Layer Count: 4 layers
PCB Thickness: 1.6mm
Min. Trace / Space Outer: 0.1mm/0.1mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG+OSP
Material: Fr-4
Layer Count: 4 layers
PCB Thickness: 1.4mm
Min. Trace / Space Outer: 0.065mm
Min. Drilled Hole: 0.2mm
Via Process: Tenting Vias
Surface Finish: ENIG
Material: Fr-4
Layer Count: 6 layers
PCB Thickness: 1.2mm
Min. Trace / Space Outer: 0.102mm/0.1mm
Min. Drilled Hole: 0.1mm
Via Process: Tenting Vias
Surface Finish: ENIG+OSP
PCB is the abbreviation of the...
