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PCB Type >> Communication HDI

Communication HDI

Material: Fr-4

Layer Count: 6 layers

PCB Thickness: 1.0mm

Min. Trace / Space Outer: 0.075mm

Min. Drilled Hole: 0.1mm

Via Process: Tenting Vias

Surface Finish: ENIG

Product Features

Features:
1) Years of experience in half-hole production, using Da Chuan Routing machine, routing the half-hole then routing the shape, meet the strict shape requirements;
2) Minimum line width and line spacing: 0.075/0.075mm, minimum BGA pad: 0.25mm, meet customer's special needs;
3) Electroplated Copper Filling of  Blind Holes by Universal DVCP(Double Track Vertical Continuous Copper Plating Equipment )  to ensure that there are no voids in the holes and quality of customer products;
4) Strict sampling inspection mode, guarantee customers' product yield.

Recommended Products

  • HDI-14 layers

    Material: Fr-4

    Layer Count: 14 layers

    PCB Thickness: 1.6mm

    Min. Trace / Space Outer: 4/4mil

    Min. Drilled Hole: 0.25mm

    Via Process: Tenting Vias

    Surface Finish: ENIG

  • HDI-6 layers

    Material: Fr-4

    Layer Count: 6 layers

    PCB Thickness: 1.6mm

    Min. Trace / Space Outer: 3/3mil

    Min. Drilled Hole: 0.25mm

    Via Process: Tenting Vias

    Surface Finish: ENIG

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11:34 AM August 31, 2020

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