Stop compromising between quality and cost. NextPCB offers transparent China-direct pricing with US/EU-standard quality control. IPC Class 2/3 compliance guaranteed.
Years QC Expertise
Fast Prototype
Components In_stock
On-time Delivery
In-house Factories
Defect Rate
E-test & AOI
12:00 2026/3/11
You no longer have to sacrifice customization for cost. NextPCB delivers the ideal solution, combining exceptional value with customized services to support your PCB projects, all backed by our adherence to: ISO 9001 | ISO 14001 | ISO 13485 | IATF 16949 | UL | RoHS | REACH | IPC-A-610 Class 2 & 3 View our Certifications
24 hours Quick-turn PrototypeAccelerate R&D with First-Pass Success. We turn complex designs into high-performance hardware—delivered faster than the competition.
Scale ProductionOnce your project is validated, NextPCB provides full-scale production services. We ensure your products are of the highest quality and consistency, all at a competitive price.
PCB Assembly36 Siemens SMT Production Lines. From assembly to final testing, we ensure quality and on-time delivery, every time. 24-hour expedited prototype assembly once all components are on hand.
Components SourcingGet all the components you need with our global sourcing services.
Online Gerber ViewerMore than a viewer—an integrated DFM analysis tool. Check your Gerber files and identify manufacturing risks directly in your browser, no software installation required.
Free DFM SoftwareBuilt on 15+ years of manufacturing experience, our automated DFM software helps you prevent costly errors and optimize your design for production.
Our production capabilities, built on high-grade materials and advanced technology, allow us to manufacture complex PCBs with a high degree of precision and reliability. We closely follow key IPC standards such as IPC-6012 and J-STD-001. All our PCBs are manufactured and assembled in accordance with IPC-A-600 and IPC-A-610 Class 2 workmanship criteria, with IPC-A-610 Class 3 available upon request for high-spec applications.
| Items | Standard Capabilities |
|---|---|
| Layer Count | 1-32 layers |
| Impedance Control | Supported for 4-32 layers, based on NextPCB's default stackup or customer-provided designs. NextPCB's Stackup & Impedence Calculator |
| Impedance Tolerance | ±10% for values > 50Ω； ±5Ω for values ≤ 50Ω |
| Material | FR-4 (Aluminum / Rogers/ Copper/Ceramic / Flexible / Rigid-Flex available). Check Our advanced pcb material We support a wide range of TG material options: TG130, TG135, TG150, TG155, TG170 |
| Board Thickness | from 0.6mm to 3.2mm |
| Thickness Tolerance (≥1.0mm) | ±10% |
| Thickness Tolerance (<1.0mm) | ±0.1mm |
| Max. Board Dimension | 1-2 layers: 1500x600mm, 4 layers: 1500x500mm, 6-32 layers: 400x500mm. For other sizes, please contact us. |
| Min. Board Dimension | ≥10×10mm |
| Outline Tolerance | ±0.15mm |
| Outer Layer Copper Weight | 1oz / 1.5oz / 2oz / 3oz / 4oz (up to 10oz for advanced pcb) |
| Inner Layer Copper Weight | 0.5oz / 1oz / 2oz / 3oz / 4oz (up to 6oz for advanced pcb) |
| Surface Finish | HASL / Lead Free HASL / ENIG / ENEPIG / OSP / Immersion Silver/Tin / Electroplated Gold / Gold Finger Plating / ENIG+OSP / Customized |
| HDI Structure | 1+N+1, 2+N+2, 3+N+3 |
| Gold Finger Beveling Angle | 20°, 30°, 45°, 60° |
| Gold Finger Beveling Angle Tolerance | ±5° |
| Gold Finger Beveling Depth Tolerance | ±0.1mm |
| Items | Capabilities |
|---|---|
| Minimum Line Width | Silkscreen printing: ≥5mil (~0.12mm) Printer printing: ≥3mil (~0.08mm) |
| Minimum Text Height | Silkscreen printing: ≥30mil (~0.76mm) Printer printing: ≥24mil (~0.61mm) |
| Character Width to Height Ratio | ≥6:1 |
| Pad to Silkscreen Clearance | >6mil (~0.15mm) |
| Solder Mask Opening | ≥1.5mil (~0.04mm) |
| Solder Bridge | Green: 3.5mil Black/White: 5mil Other colors: 4mil |
| Minimum Annular Ring (1oz Copper) | 3.5mil (~0.09mm) |
| Minimum Annular Ring (2oz Copper) | 4.5mil (~0.11mm) |
| Min. Trace Width & Spacing (0.5oz Inner) | 2.5mil (~0.06mm) / 3mil (~0.08mm) |
| Min. Trace Width & Spacing (1oz Outer) | 3mil (~0.08mm) / 3mil (~0.08mm) |
| Min. Trace Width & Spacing (2oz Outer) | 5.5mil (~0.14mm) / 5.5mil (~0.14mm) |
| Hole to Hole Clearance (Different Nets) | ≥12mil (~0.30mm) |
| Via to Via Clearance (Same Net) | ≥8mil (~0.20mm) |
| SMD Pad to SMD Pad Clearance | ≥0.15mm |
| Pad to Pad Clearance (With Hole) | ≥0.40mm |
| Via to Track Clearance | ≥7mil (~0.18mm) |
| PTH to Track Clearance | ≥9mil (~0.23mm) |
| NPTH to Track Clearance | ≥8mil (~0.20mm) |
| SMD Pad to Track Clearance | ≥4mil (~0.10mm) |
| Trace to Board Edge | ≥0.2mm |
| Trace to V-Cut Line | ≥0.4mm |
| Mechanical Drill Hole Size | 0.15mm - 6.5mm |
| Min. Non-Plated Holes | ≥0.4mm |
| Min. Plated Slots | ≥0.5mm |
| Min. Non-Plated Slots | ≥0.5mm |
| Min. Castellated Holes | ≥0.5mm |
| Items | Capabilities |
|---|---|
| Electrical Test | Flying Probe / Fixture Test |
| Solder Mask Color | Green, Red, Yellow, Blue, White, Matte Black, Black. |
| Solder Mask Thickness | On base material: 0.8mil On copper: 0.6mil |
| Drill Hole Tolerance | ≤0.05mm |
| Plated Hole Size Tolerance | ±0.075mm |
| Non-Plated Hole Size Tolerance | ±0.05mm |
| Rectangular Holes/Slots | With or without fillet angle |
| Blind/Buried Vias | Mechanical: Copper thickness ≥ 20µm Laser: Dimple ≤ 10µm |
| Via Pad Size | ≥0.1mm |
| PTH Hole Size (single side) | ≥0.2mm |
| Panelization without Spacing | 0mm |
| Panelization with Spacing | ≥1.6mm |
| Panelized Round Boards | ≥80mm x 80mm |
| Panelized Castellated Boards | Uses stamp holes and tooling strips on four edges. |
| Min. Breakaway Tab Width | ≥4mm (≥5mm for mouse bites) |
| Min. Edge Rails | ≥3mm |
| V-CUT Angle | 30°, 45°, 60° |
| Number of V-CUTs | ≤30 cuts |
| V-CUT Outline Size | 55mm ≤ L/W ≤ 480mm |
| V-CUT Residue Thickness | 0.25mm - 0.4mm |
| Items | Capabilities |
|---|---|
| PCB Assembly Lead Times |
From 24 hours to 7 days once all parts are ready: - Express turnaround: 24-hour assembly after component readiness - Standard production: Up to 7-day completion |
| Component Procurement Options |
Full turnkey: Comprehensive component sourcing by NextPCB Partial turnkey: Hybrid customer-supplied and NextPCB-sourced parts Kitted/Consigned: Complete customer-provided components |
| Assembly Technologies |
Surface Mount Assembly (SMT): High-precision chip placement supporting ultra-miniature components down to 01005 packages. Ball-Grid-Array Assembly (BGA): 0.35mm pitch with mandatory X-ray validation Through-Hole Assembly (THT): Traditional component mounting Mixed technology: Combined SMT & Thru-hole solutions Mixed Assembly: Integrated SMT and Thru‑hole soldering process (reflow + wave/manual soldering) Kit Assembly: Component kitting according to BOM for streamlined manual or automated assembly |
| Conformal Coating |
Moisture & Corrosion Protection: Professional-grade application to IPC standards for all harsh-environment applications. |
| Component Types |
BGA: 0.35mm pitch with X-ray QA Ultra-miniature: 01005/0402 passives High-density: Fine-pitch components as small as 0.38mm pitch ICs Connectors: Hard metric & cable assemblies Cable & Wire: Multiconductor cable and wire harness assemblies, enabling organized, insulated routing of multiple conductors within one outer jacket Bulk: Loose-packaged discrete components (resistors, capacitors, ICs, etc.) |
| Assembly Side(s) | Single/Double Sided: Supports both single- and double‑sided board assembly |
| SMT Parts Presentation |
Cut tape: Components supplied on cut tape, ideal for small quantities Partial reel: Components on partial reels, suitable for mid‑volume usage Reel: Full‑reel packaging, the standard for high‑volume SMT components Tube: Components packaged in tubes, typically for cylindrical or long parts Tray: Supplied in trays, used for large or sensitive components Laser-cut stainless steel: Delivered on precision laser‑cut stainless steel carriers for high‑precision or specialty components |
| Solder Types | Substrate Specialization: Rigid PCBs, Flex Circuits, Metal-Core Boards, Rigid-Flex PCB |
| Quality Inspection & Testing |
Visual inspection: Manual visual inspection of the PCB using magnifying tools to identify component placement, solder joint quality, and other visible defects. Solder Paste Inspection(SPI): 3D measurement of solder paste volume and alignment before component placement to ensure high-quality solder joints. AOI Scanning: Utilizes automated equipment to scan the PCB, detecting component absence, solder joint issues, polarity errors, and more. BGA placement – X-RAY checking: Employs X-ray technology to inspect internal solder joint quality of BGA, QFN, and other packages, ensuring no cold solder joints, voids or bridging. In-Circuit Test (ICT): Conducts electrical tests to verify connectivity and functionality of circuits on the PCB, detecting issues like shorts and opens. Free Functional Testing(FCT): Tests the PCB's functionality under actual operating conditions to ensure it meets design specifications and performance requirements. |
| After-Sales Service |
Should your assembled PCBs encounter transit issues or potential defects upon delivery, we provide immediate repair and rework assistance. With an exceptional quality standard (DPPM ≤ 0.1%), our dedicated engineering team stands ready to resolve concerns through prioritized communication ensuring swift solutions that maintain project momentum and uphold our quality partnership. Support Team: |
| Validate Your Projects at A Low Cost |
Accelerate your prototyping and innovation. NextPCB is providing up to a $200 discount on 1-10 piece PCB assembly services, so you can validate your designs at a lower cost and experience our premium quality and professional support. Learn More |
Note: If your design involves HDI (Up to 3-stage), Rigid-Flex, or substrates like Rogers and Teflon, standard capabilities may not apply. Explore our advanced PCB capabilities →
NextPCB Accelerator is a program that helps innovators and creators turn their ideas into products. It offers free turnkey PCBA prototypes, manufacturing support, subsidized pricing, and early access to selected chips and modules. The sponsorship includes free PCBs, components, assembly, and shipping for up to two boards worth $500.
Catch errors at the source. NextPCB provides you with a free, professional DFM and DFA deep check. Before production even begins, we proactively identify potential flaws in your design, preventing costly rework and expensive delays caused by design errors. This means a higher First Pass Yield on your prototypes, smoother project progression, and significant savings in both time and money. View our factories
A leading German manufacturer required mission-critical PCBs for their next-generation controllers. NextPCB delivered complex multi-layer boards with IPC Class 3 precision and ±0.05mm hole tolerances, ensuring flawless performance in harsh industrial environments and significantly reducing their time-to-market.
Our manufacturing processes are certified with ISO 9001, ISO 14001, ISO 13485, IATF 16949, UL, RoHS, and REACH. This guarantees every PCB meets stringent international quality standards.
View Our Quality Control Process >"NextPCB was a fantastic partner. The quality of our prototypes and the speed of delivery were far better than we anticipated. Their complimentary DFM and DFA checks were a huge plus, saving us valuable time and preventing costly mistakes." — Dr. Müller, Head of Development
More Voices >Use our simple online quote tool for a quick calculation or reach out to our team for a personalized consultation.
Get your PCB/PCBA from design to delivery in just a few steps with our transparent, no-hidden-fee pricing and real-time order tracking, ensuring a seamless transition from your Gerber files to high-quality boards delivered derectly to you.
Upload your Gerber/KiCad files for a quote. For assembly, add your BOM and Centroid files through our secure client portal.
Receive an transparent quote with various options in just minutes
Our engineers will review your design for manufacturability and assembly at no cost.
Your prototypes will be shipped directly to your door via your preferred method.
We are proud to partner with leading companies.
We offer flexible payment options to suit your procurement needs. We support PayPal, Bank Transfer (T/T), and major Credit Cards including Visa, MasterCard, Diners Club, and Discover. For long-term partners and qualified corporate clients, we provide Net 30 day payment terms to help you optimize your cash flow and manage scale production orders with ease.
We are experts in manufacturing high-precision, high-reliability PCBs, with a proven track record in scale production of 1-6 layer boards. Our capabilities extend to more complex designs like multilayer and HDI boards, supporting a diverse range of applications from solar panels and medical devices to industrial controllers and smart home electronics.
View our Standard PCB Capabilities and Advanced PCB Capabilities.
These special offers are designed to lower the barrier for you to experience our quality and efficiency, and we look forward to becoming your first choice for full-scale production projects in the near future.
Our competitive pricing is the result of several key factors that do not compromise on quality:
Thanks to continuous optimization, our prototype delivery reliability has reached an impressive 99.59%.
We employ a phased, full-process Quality Assurance System:
We ensure complete product traceability through unique markings and a rigorous data capture system. Each product has a unique marker, such as a serial number or QR code. Our Manufacturing Execution System tracks and records all critical details for every product—from raw materials and process parameters to quality inspection results (AOI, X-ray, ICT). This comprehensive data, combined with our strict adherence to international quality standards (ISO 9001, ISO 13485, etc.), ensures the complete traceability of the product's journey. Additionally, we provide UL marking services that can be applied to any board, further enhancing product credibility and traceability. This ensures every product meets customer requirements 100%.
We are confident in the quality of our PCBs. Every product undergoes rigorous quality control checks to ensure it meets our high standards and your specifications.
However, in the rare event that you encounter an issue, we've established a professional and transparent process to ensure a swift and fair resolution. We guarantee a response within 24 hours and will initiate a professional process to resolve the issue. This process includes problem analysis, a root cause investigation, and the formulation of a solution, which may include arranging for compensation or rework to ensure your rights are fully protected.
Yes, we offer comprehensive turnkey solutions that cover PCB manufacturing, component sourcing, PCB assembly, and final testing. This all-in-one service allows us to manage your entire project, from design files to the finished product, optimizing your supply chain, shortening lead times, and ensuring consistent quality. Simply share your project details with us, and our team will provide a customized solution for you.
Yes, NextPCB provides full support for Blind and Buried Vias as part of our High-Density Interconnect (HDI) manufacturing services. We utilize advanced laser drilling and sequential lamination processes to ensure high reliability for complex multi-layer designs.
Absolutely. We specialize in the manufacturing of high-frequency and high-speed PCBs where Signal Integrity and Power Integrity are non-negotiable.
