Support Team
Feedback:
support@nextpcb.comHere you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The design performance of multi-layer boards is mostly similar to single-panel or double-panel, which is to avoid avoiding too many circuits to fill too small space, resulting in impractical tolerances, high inner layer capacity, and possibly even dangerous products. Quality safety. Therefore, the performance specification should consider the complete evaluation of the thermal shock, insulation resistance, welding resistance, etc. of the inner layer. The following sections describe important factors that should be considered in the design of multilayer boards.
All of the examples in this article were developed using the multisim design environment, but the same concepts apply even with different eda tools.
25. Sensitive circuits or devices (such as reset circuits, WATCHDOG circuits, etc.) are at least 1000 mils away from the edge of the board, especially the interface edge of the board.
The rise time of the signal is critical to understanding the signal integrity problem. Most of the problems in high-speed pcb design are related to it, and you must pay enough attention to him.
Multi-layer and double-sided PCB design is similar, and even easier.
The significance, classification and composition of electronic circuit diagram
The film consists of a protective film, an emulsion layer, a bonding film, a film base and an antihalation layer. The main components are silver salt photosensitive materials, gelatin and pigments. Under the action of light, the silver salt can be reduced to the center of the silver core, but it is not dissolved in water. Therefore, it can be suspended in a gelatin state and coated on the substrate. The emulsion also contains a pigment to sensitize. The exposed film is then obtained by actinic action.
Part 1-5
In the circuit design, often only pay attention to improve the wiring density, or pursue uniform layout, ignoring the influence of the line layout on preventing interference, causing a large number of signals to radiate into the space to form interference, which may lead to more electromagnetic compatibility problems. Therefore, good wiring is the key to success in design.
This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.
In the design of electronic systems, in order to avoid detours and save time, the anti-interference requirements should be fully considered and avoided, and remedial measures against interference should be avoided after the design is completed. There are three basic elements that form interference:
PageUp:Zoom in with the mouse
It can be classified according to PCB use, substrate type, structure, etc., and is generally divided by PCB structure.
The circuit diagram, which is a schematic diagram of the connection of the electronic components drawn by symbols of the circuit components, describes in detail the connection and direction of each component, the description of each pin, and some detection data.
A perfect PCB:
(1) Is the pin pitch correct? If the answer is no, it is very likely that you will not even get a weld.
Electromagnetic compatibility refers to the ability of an electronic device to work in a coordinated and efficient manner in various electromagnetic environments. The purpose of the electromagnetic compatibility design is to enable the electronic device to suppress various external interferences, enable the electronic device to work normally in a specific electromagnetic environment, and at the same time reduce the electromagnetic interference of the electronic device itself to other electronic devices.
Combine an actual DSP high-speed image data acquisition system to illustrate the generation of signal integrity problems and specific solutions.
Differential mode current and common mode current.
8 Q&A in PCB Circuit Layout Design
Dimensions: (mm) |
|
Quantity: (pcs) |
|
Layers: |
Thickness: |
Quote now |