Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
1. 3 points above the connection, as far as possible through the line in order to facilitate testing, the length of the line as short as possible.
Electrolytic capacitor due to the positive and negative polarity, so when used in the circuit can not reverse the connection.
There are two main roles.
75. -48V to -48V signal is only the return flow, there is no convergence to other places? If you can not, please explain the reason in the remarks column.
1. The information received is completed (including: schematics, *.brd, bill of materials, PCB design and change requirements, standardization requirements, process design documents)
PCB wiring requirements to avoid one of the cases is the right-angle alignment. In principle, right-angle alignment changes the line width of the transmission line, resulting in discontinuities in impedance. In fact, not only the right-angle alignment, angle, acute angle alignment may cause impedance changes.
LED switching power supply research and development speed in recent years has been a significant technological leap. As the last design link, PCB design is also very important, because once there is a problem in this part, it is likely to cause more electromagnetic interference to the entire LED switching power supply system, for the power supply stability and security Will also have an adverse effect. So, PCB design how to do it is correct?
Rx:the resistance, a lot of resistance in the circuit diagram, according to theserial number, R1, R2...
Preface: To ensure a good PCB solderability or electrical properties. Because copper tends to be present in the form of oxides in the air, seriously affecting the solderability and the electrical properties of the PCB, the PCB needs to be surface-finish.
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Design in different stages need to set different points, in the layout stage can be used to carry large grid layout of the components. For IC, non-locating connectors and other large components, you can use the 50 ~ 100mil grid accuracy of the layout, and for passive components such as small capacitors and inductors, the use of 25mil grid layout. The precision of the large grid facilitates the alignment and layout of the components.
There are many ways to solve the EMI problem. Modern EMI suppression methods include EMI suppression coating, proper EMI suppression, and EMI simulation design. This article starts with the most basic PCB layout and discusses the role and design techniques for PCB layered stacks in controlling EMI emissions.
At first glance, PCB is almost the same regardless of its internal quality. It isthrough the surface that we see differences, which are critical to the durability and function of the PCB throughout the lifespan.