Preface: To ensure a good PCB solderability or electrical properties. Because copper tends to be present in the form of oxides in the air, seriously affecting the solderability and the electrical properties of the PCB, the PCB needs to be surface-finish.
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Design in different stages need to set different points, in the layout stage can be used to carry large grid layout of the components. For IC, non-locating connectors and other large components, you can use the 50 ~ 100mil grid accuracy of the layout, and for passive components such as small capacitors and inductors, the use of 25mil grid layout. The precision of the large grid facilitates the alignment and layout of the components.
There are many ways to solve the EMI problem. Modern EMI suppression methods include: EMI suppression coating, proper EMI suppression and EMI simulation design. This article starts with the most basic PCB layout and discusses the role and design techniques for PCB layered stacks in controlling EMI emissions.
At first glance, PCB is almost the same regardless of its internal quality. It isthrough the surface that we see differences, which are critical to thedurability and function of the PCB throughout the lifespan.