April 04, 2019
1. Shape 2. Orig 3. Matrix
April 02, 2019
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as various microcontrollers. Simulation software.
April 02, 2019
How to deal with moisture sensitive components in PCB design involves the moisture sensitivity of plastic integrated circuits (ICs), which is getting worse and worse, due to many industrial trends, including the use of support for critical communications and The constant search for higher reliability products for technical applications. The failure rate of a moisture-sensitive device (MSD) alone is already at an unacceptable level, coupled with the ever-changing packaging technology. Shorter development cycles, shrinking sizes, new materials and larger chips are causing a rapid increase in the number of MSDs and a higher level of moisture/reflow sensitivity. Finally, the growth in the use of area-arranged packages such as BGA and CSP has also had a major impact. This is because these components tend to be packaged in tape-and-reel systems, each having a large number of components. When compared to the pin components in the IC tray, the key issue is that the exposure to moisture is longer.
April 02, 2019
1) In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%). Mainly use 4 to 6 layers. Double panels with a thickness of 1mm or less can be used in the case of very sensitive cost. To ensure that the reverse surface is a complete formation, and because the thickness of the double panel is above 1mm, the formation and signal layer are made. The FR4 medium is thicker. In order to make the RF signal line impedance reach 50 ohms, the width of the signal trace is often about 2 mm, which makes the spatial distribution of the board difficult to control. For a four-layer board, in general, the top layer only goes the RF signal line, the second layer is the complete ground, the third layer is the power supply, and the bottom layer generally goes to the digital signal line that controls the state of the RF device (such as setting the clk of the ADF4360 series PLL, Data, LE signal line.) The power supply of the third layer is preferably not made into a continuous plane, but the power supply traces of each RF device are star-shaped and finally connected to one point. The power trace of the third RF device should not cross the underlying digital line.
March 29, 2019
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.