PCB process skills based on GENESIS2000 software (1)

writer: G April 04, 2019

1. Shape

There are two ways to make a shape:

1. Paint files by customer

steps:

a. Use the Select by net panel to select the component line border and copy it to the rout layer.

b. Delete all arcs;

c. Check the number of lines, for example, the rectangle should have four lines to remove the extra lines;

d. Check the angle of the line, the angle of the regular line should be 0 °, 90 ° and 45 °, such as 0.1 °, mostly for customer design errors;

e. Reconnect the line intersection and chamfer with the Rout→Connections function. The arc line attribute should be arc;

f. Change the line width to r10mil.

2. Dimension by customer

steps:

a. Create a rout layer in Matrix;

b. Select item 5 in the Options→Line parameters function;

c. Use the Add feature function in the panel to manually draw the shape according to the customer dimension in the rout layer, and set the line width to r10mil;

d. Use the Rout→Connections function to assist in the intersection of the connecting line and the chamfer to the shape.

e. If the Rout layer has entities such as Rect or Oval, convert it to an outline. Method: first select the entity and click Edit→Reshape→contourise to become Surface, execute Surface to outline, and input the line width value to be converted into contour.

After the shape is complete, use the Select by net command to select the shape graphic, then use the Edit→Create→Profile command to create the profile.

2. orig

Orig consists of the following three parts:

Layer alignment

steps:

a. Select all layers, use the drilling as the reference layer, and use the register function to achieve automatic alignment of the line, grounding, soldering and drilling;

b. Other layers (including the character layer) need to manually move the whole layer so that the outer frame and the outer border of the component surface layer overlap, and if necessary, mirror.

Inspection Method:

a. The center of each layer of pads should be aligned with the center of the hole;

b. The outer borders of each layer shall coincide with each other;

c. The face character of the component is a positive character, and the weld face character is an inverse word.

2. line to pad

steps:

a. Open the features Histogram of the solder mask, select all in the Lines List, press Highlight, compare the lines and characters to determine whether the pad needs to be turned;

b. Simultaneously select and open the component surface line and component surface solder mask, press the W command to the skeleton display mode, use the panel to select the line to be converted (usually the end of the line), and then use DFM→Cleanup→Construct pads (Ref .) The function converts by class. The welding surface method is the same;

c. Check the line except the frame line and the large area tin block by the method of step a;

d. If the r-shaped line is converted to an oval-shaped pad, use the Actions→reference Selection function to select all the oval reference solder mask layers on the circuit layer, and remove the voided of the solder mask layer (the same as the solder mask oval) The rest of the oval interrupts the line with the Edit→Reshape→Break command, and finally moves the removed oval back to the line layer. This operation should be used with caution when there is a positive or negative superposition.

3. Define SMD

Use the DFM→Cleanup→Set SMD attribute function, the parameter Types Other is set to *, and the pad that is not drilled in the outer layer is automatically set to SMD.

Delete the original edit in Matrix and copy orig to edit. The following operations are performed in edit if not specified.

3. Matrix 

Take the standard 4-layer board as an example, define the attributes of each layer, and sort the layers by the X command in the order of the board.

Drilling board

Board rout positive

Component face character board silk_screen positive

Component surface soldering board solder_mask positive

Component line

Formation board power_ground negative

Electric layer board power_ground negative

Welding surface line

Solder mask soldering board solder_mask positive

Welding surface character board silk_screen positive

1. The basis for correctly arranging the levels is as follows:

a. The customer provides a hierarchical order;

b. There is a hierarchical mark outside the board;

c. There are numerical symbols in the board, such as “1, 2, 3, 4...”.

2. The general basis for judging each layer as positive and negative is:

The center of the pad is positive for the body, and the center of the pad is hollow for negative.

  • PCB
  • SMT
  • Stencil

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