Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
In the circuit design, often only pay attention to improve the wiring density, or pursue uniform layout, ignoring the influence of the line layout on preventing interference, causing a large number of signals to radiate into the space to form interference, which may lead to more electromagnetic compatibility problems. Therefore, good wiring is the key to success in design.
In design, layout is an important part. The quality of the layout results will directly affect the effect of the wiring, so it can be considered that a reasonable layout is the first step in the success of PCB design.
There are two ways to route: automatic routing and interactive wiring.
As device operating frequencies become higher and higher, the signal integrity issues faced by high-speed PCB design become a bottleneck in traditional design, and engineers face increasing challenges in designing complete solutions. Although the high-speed simulation tools and interconnect tools can help designers solve some of the problems, high-speed PCB design requires more experience and deep communication between the industry.
The differential signal pairs with very close wirings are also closely coupled to each other. This mutual coupling reduces EMI emissions. The main disadvantage of differential signal lines is the increased PCB area. This paper introduces the circuit board design process. Wiring strategy for differential signal line routing.
In circuit design, we are generally concerned about the quality of the signal, but sometimes we are often limited to the signal line for research, and the power and ground as the ideal situation to deal with, although this can simplify the problem, but in high-speed design This simplification is no longer feasible.
How to reduce the mutual interference between digital signals and analog signals?
(1) The design of the circuit schematic: The design of the circuit schematic is mainly the PROTEL099 schematic design system (AdvancedSchematic) to draw a circuit schematic. In this process, we should make full use of the various schematic drawing tools and various editing functions provided by PROTEL99 to achieve our goal, that is, to obtain a correct and exquisite circuit schematic.
In this article,I will tell you a new way to solve the problem of high speed singal pcb design
At present, in the manufacture of printed circuit boards, the wires are mostly copper wires. The physical properties of the copper metal itself determine that there must be a certain impedance in the conduction process. The inductance component in the wires affects the transmission of voltage signals. The composition affects the transmission of the current signal, and the influence of the inductance is particularly prominent in the high-frequency line.
Via is one of the important components of a multilayer PCB, and drilling costs typically account for 30% to 40% of PCB board costs.
Common impedance interference is caused by a large number of ground lines on the PCB. When two or more loops share a ground line, different loop currents generate a certain voltage drop on the common ground. This voltage drop will affect the circuit performance when amplified. When the current frequency is high, it will be very The large inductive reacts to the circuit.
The basic principle of CB cascading design: For PCB manufacturers, PCB cascading solutions need to consider many factors.
In SoC design, the coupling between signals can cause signal integrity problems. Neglecting signal integrity problems can lead to crosstalk between signals. Reliability, manufacturability and system performance will also be reduced. This article describes the design of ASIC chips. A method for solving signal integrity problems.
The frequency measurement is generally performed by a scanning spectrum analyzer, which scans the amplitude of each frequency signal and stores it under a certain resolution bandwidth (RBW), thereby displaying the information of the amplitude as a function of the entire frequency band. The RBW is an important consideration for scanning spectrum analyzers to provide excellent dynamic range and high accuracy of the static spectral components of the signal. However, the main disadvantage of a scanning spectrum analyzer is that it tests the amplitude of a frequency point of the signal only at one point in time.
Wireless signals are an integral part of many embedded systems today, and manufacturers of mobile terminals are discussing media convergence, where consumers can browse the web or watch the game in a notebook, mobile phone, portable digital TV or PDA.
Through the calculation and analysis of signal integrity to find the solution space of the design, and finally on the basis of the solution space to complete the PCB board design and verification.
As integrated circuit output switching speeds increase and PCB board density increases, signal integrity has become one of the issues that must be addressed in high-speed digital PCB design. Factors such as components and PCB boards, layout of components on the PCB, and wiring of high-speed signals can cause signal integrity problems, resulting in unstable system operation or even no work at all.
There are many simulation tools for analyzing signal integrity, each with its own characteristics.
For chip design, there are usually two ways to solve signal integrity problems. The RF solution focuses on the transmission line, often using impedance matching on the package boundary, while the digital (ie, broadband) solution emphasizes the choice of package, controlling the number of simultaneous switching and switching speed, and using between the external power supply pins of the package and ground. Bypass capacitors, the capacitance inside the IC is achieved by the overlap of the metal layers, which provides a local low-impedance path for high-speed transient currents to prevent ground bounce.