Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The PCB manufacturing process begins with a "substrate" made of Glass Epoxy or similar material.
Printed circuit boards (PCBs) appear in almost every electronic device. If there are electronic parts in a certain device, they are also mounted on different sizes of PCB.
Total 7 things.
Signal integrity issues can cause problems when you struggle to stabilize the various signals on the board. The IBIS model is an easy way to solve these problems. You can use the IBIS model to extract some important variables for signal integrity calculations and finding solutions for PCB design. The various values you extract from the IBIS model are an integral part of signal integrity design calculations.
If you find that the design experience accumulated in the previous low-speed era does not seem to work now, the same design, no problem before, but now can not work, then congratulations, you have encountered the core problem in hardware design: signal integrity . It is a good thing for you to meet one day earlier. In the past low-speed era, the signal rise time is longer when the level jumps, usually a few ns. Interconnects between devices do not affect the functionality of the circuit, and there is no need to care about signal integrity issues. But in today's high-speed era, with the increase in IC output switching speed, many are in the picosecond level, and almost all designs have encountered signal integrity problems regardless of the signal period. In addition, the pursuit of low power makes the core voltage lower and lower, 1.2v core voltage is already very common. Therefore, the noise margin that the system can tolerate is getting smaller and smaller, which makes the signal integrity problem more prominent.
Many signal integrity problems are caused by short signal rise time. This article talks about a basic concept: the relationship between signal rise time and signal bandwidth.
Via is one of the important components of a multi-layer PCB. The cost of drilling is usually 30% to 40% of the cost of PCB board. Simply put, each hole in the PCB can be called a via. From the perspective of function, the vias can be divided into two categories:
1. Printed circuit board size and device layout. 2. Decoupling capacitor configuration. 3. The heat dissipation design. 4. Electromagnetic compatibility design. 5. Ground wire design.
The design of the high-frequency circuit PCB is a complicated process, and many factors involved may directly affect the performance of the high-frequency circuit. Therefore, designers need to continuously research and explore in the actual work, accumulate experience, and combine the new EDA (Electronic Design Automation) technology to design high-performance circuit PCB with excellent performance.
Routing is the overall requirement for high-frequency PCB design based on a reasonable layout. Wiring includes both automatic routing and manual routing. Generally, regardless of the number of critical signal lines, these signal lines are manually wired first. After the wiring is completed, these signal lines are carefully inspected, fixed after inspection, and then automatically routed to other wirings. That is, the combination of manual and automatic wiring is used to complete the wiring of the PCB.
Although Protel99SE has the function of automatic layout, it can not fully meet the working needs of high-frequency circuits. It is often necessary to rely on the designer's experience. According to the specific situation, the manual layout method is used to optimize the position of some components, and then combined with automatic layout. Complete the overall design of the PCB. The rationality of the layout directly affects the life, stability, EMC (electromagnetic compatibility) of the product, etc., must be from the overall layout of the circuit board, the feasibility of wiring and the manufacturability of the PCB, mechanical structure, heat dissipation, EMI (electromagnetic Comprehensive considerations such as interference), reliability, and signal integrity.
Designers may design odd-numbered printed circuit boards (PCBs). If the wiring does not require an extra layer, why use it? Isn't reducing layers not making the board thinner? If the board is one less layer, is the cost lower? However, in some cases, adding a layer will reduce the cost.
A number of issues that should be noted for PCB board reliability design in high speed DSP systems.
This article will show you how to avoid those hidden but common mistakes, and introduce a few tips to help engineers discover hidden errors in PCB copy board software. Most software development projects rely on code inspection, structural testing, and functional testing to identify software defects. Although these traditional techniques are very important and can find most software problems, they cannot detect many common errors in today's complex systems.
In any power supply design, the physical design of the PCB is the last link. The design method determines the electromagnetic interference and power supply stability. Let's analyze these links in detail:
PCB is a support for circuit components and devices in electronic products. It provides electrical connections between circuit components and devices. With the rapid development of electricity technology, the density of PGB is getting higher and higher. PCB design has a great impact on the ability to interfere with interference. Therefore, when designing PCBs. The general principles of PCB design must be followed and should meet the requirements for anti-interference design.
The direct cause of the temperature rise of the printed board is due to the existence of circuit power consumption devices. The electronic devices have different degrees of power consumption, and the heat generation intensity varies with the power consumption.
The heat generated during the operation of the electronic device causes the internal temperature of the device to rise rapidly. If the heat is not dissipated in time, the device will continue to heat up, and the device will fail due to overheating, and the reliability of the electronic device will decrease. Therefore, it is very important to dissipate the board.
At present, electronic equipment is used in various electronic devices and systems, and printed circuit boards are still the main assembly method. Practice has proved that even if the schematic design of the circuit is correct and the printed circuit board is not properly designed, it will adversely affect the reliability of the electronic device. For example, if the two thin parallel lines of the printed board are in close proximity, a delay in the signal waveform is formed, and reflected noise is formed at the end of the transmission line. Therefore, when designing a printed circuit board, care should be taken to use the correct method.
Under normal PCB design conditions, the following factors are mainly affected by PCB manufacturing:
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