To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.
The concepts of Layer, Via, Overlay, Pad, Mask, etc.,
This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.
MOEMS packaging technology can be divided into several major aspects of die fixing, housing, wiring and optical interconnection. In MOEMS, commercial devices require a practical MOEMS hybrid reliable and safety shielded package. Due to the non-contact and non-insertion of optics, the packaging of PCB design MOEMS devices is much easier than the packaging of MEMS devices, and MEMS designs can be utilized, but excellent and reliable light alignment is required.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.