Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
The following is an introduction to the testing experience and methods of inductors and transformers.
The following is an introduction to the testing experience and methods of capacitors.
The following is an introduction to the testing experience and methods of resistors.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
1. Right angle routing (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. Serpentine line (adjustment delay)
As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.
Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.
When the signal propagates on the transmission line, the transient impedance sensed by the signal is related to the capacitance per unit length and the dielectric constant of the material.
In high-speed circuit design, the traditional approach to locating signal integrity problems is to use hardware triggers to isolate events and/or to capture events using deep acquisition storage techniques before looking for problems. As the speed and complexity of high-performance circuit systems continue to increase, the limitations of using oscilloscopes to locate signal integrity problems are becoming more prominent.
Modern digital circuits can be up to GHz and rise time is within 50ps. At such a rate, the negligence on the PCB design trace is even one foot, and the resulting voltage, delay and interface problems will not only be limited to this line, but will also affect the entire board and Adjacent boards.
Radiated EMI interference can come from an undirected source and an unintentional antenna. Conductive EMI interference can also come from a source of radiated EMI interference or caused by some board components. Once your board receives conductive interference, it resides in the PCB trace of the application circuit. Some common sources of radiated EMI interference include the components discussed in previous articles, as well as on-board switching power supplies, cables and switches, or clock networks.
How to define differential pairs in the schematic
Many people think that the work of PCB Layout is very boring. Every day, thousands of wires are routed to the board, and various packages are repeated, and the work of pulling the wires is repeated. However, designers must make trade-offs between various design rules, taking into account performance, cost, process and other aspects, but also notice that the layout of the board is neat and tidy, not as simple as it seems, and requires more wisdom. Let's talk about developing some good work habits during design, which will make your design more reasonable, easier to produce, and better.
The main parasitic components generated by board layout are resistors, capacitors, and inductors. When switching from a circuit diagram to an actual board, all parasitic components have a chance to interfere with circuit performance. When a system mixes digital and analog components, careful routing is key to the success of the board. In particular, digital traces that are often close to high-impedance analog traces will cause severe coupling noise, which can only be avoided by keeping the two traces at a distance. This article quantifies the toughest board parasitic components, board capacitors, and lists the performance examples that can be clearly seen on the board.
Which method do you know below to reduce noise and electromagnetic interference in PCB design?
This article uses Protel99 SE as a design tool to analyze and discuss the basic principles and experience and skills in PCB design.
Although the high-speed simulation tools and interconnect tools at this stage can help designers solve some of the problems, high-speed PCB design also requires the accumulation of experience and in-depth communication between the industry.
The via design consists of a pad and a pad area around the hole and an inner electrically isolated area. The parasitic inductance, parasitic capacitance, etc. of the vias affect the high-speed signals passing through the vias. The size of the vias and the pads connected to them have a direct effect on the properties of the vias.