Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.
The high precision of printed circuits refers to the use of fine line width/pitch, micro holes, narrow ring width (or no ring width), and buried, blind holes and other technologies to achieve high density. The high precision means that the result of "fine, small, narrow, thin" will inevitably bring high precision. Take the line width as an example: O.20mm line width, and O.16-0.24mm is qualified according to the regulations. The error is (O.20 soil 0.04) mm; and the line width of O.10mm, the same error is (0.10±O.02) mm, obviously the accuracy of the latter is doubled, and so on is not difficult to understand. Therefore, the high precision requirements are not discussed separately. But it is a prominent problem in production technology.
7. Solder mask 8. BGA plug hole 9. Network comparison 10. Character layer
4. Drilling Editing 5. Drilling Outline Drawing 6. Circuit Layer
1. Shape 2. Orig 3. Matrix
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as various microcontrollers. Simulation software.
How to deal with moisture sensitive components in PCB design involves the moisture sensitivity of plastic integrated circuits (ICs), which is getting worse and worse, due to many industrial trends, including the use of support for critical communications and The constant search for higher reliability products for technical applications. The failure rate of a moisture-sensitive device (MSD) alone is already at an unacceptable level, coupled with the ever-changing packaging technology. Shorter development cycles, shrinking sizes, new materials and larger chips are causing a rapid increase in the number of MSDs and a higher level of moisture/reflow sensitivity. Finally, the growth in the use of area-arranged packages such as BGA and CSP has also had a major impact. This is because these components tend to be packaged in tape-and-reel systems, each having a large number of components. When compared to the pin components in the IC tray, the key issue is that the exposure to moisture is longer.
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.
The anti-jamming measures that are not common in some literatures are detailed below. Considering the practical application, especially in the trial production of products, double panels are still widely used. The following contents are mainly for double panels.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
The following is an introduction to the testing experience and methods of inductors and transformers.
The following is an introduction to the testing experience and methods of capacitors.
The following is an introduction to the testing experience and methods of resistors.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
1. Right angle routing (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. Serpentine line (adjustment delay)
As early as the 1970s, there was already a literature report on BUM technology, but it was not until the early 1990s that the Japanese company (Yasu) developed a coating of photosensitive resin on the core board to form conductive micropores by photo-induced method. Even after the new method of manufacturing a high-density circuit board by the new method of addition, the high-density circuit board was successfully used in a Thinkpad type notebook computer, and the new technology was first published in 1991. It is called Surface Laminar Circuit, SLC (Surface Laminated Circuit Board). Since this technology has created an unprecedented high-density Interconnect, HDI (High-density Interconnect) new ideas, Japanese electronics manufacturers have developed and unveiled The BUM era in the history of PCB development.
Since the printed circuit board is not a general end product, the definition of the name is slightly confusing. For example, the motherboard for the personal computer is called the motherboard and cannot be directly called the circuit board. Although there is a circuit board in the motherboard, It's not the same, so when you evaluate the industry, you can't say the same thing. For example, because there are integrated circuit parts on the board, the news media called him an IC board, but in fact he is not equivalent to a printed circuit board.
When the signal propagates on the transmission line, the transient impedance sensed by the signal is related to the capacitance per unit length and the dielectric constant of the material.
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