Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
The detection of components is a basic skill of appliance repair. How to accurately and effectively detect the relevant parameters of components and determine whether the components are normal is not a one-size-fits-all thing.
1) In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
The moisture sensitivity of plastic integrated circuits (ICs) is getting worse and worse, due to many industry trends, including the constant search for higher reliability products to support critical communications and technology applications.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
In the PCB layout, the handling of the power and ground wires is very important. The noise interference generated by the power cables and ground wires should be minimized to ensure the quality of the products.
1. Right angle line (three aspects) 2. Differential traces ("equal length, equidistant, reference plane") 3. The snake line (adjustment delay)
Protel for Windows should pay attention to the problem when switching to Gerber. Protel for DOS should turn attention to the problem Gerber. 3. PowerPCB should pay attention to the problem when transferring to Gerber.4. PADS should pay attention to the problem when transferring to Gerber.
The PROTEL99 electrical layer is divided into two types, the positive layer and the negative layer. These two layers have completely different properties and usage methods.
The high precision of printed circuits refers to the use of fine line width/pitch, micro holes, narrow ring width (or no ring width), and buried, blind holes and other technologies to achieve high density. The high precision means that the result of "fine, small, narrow, thin" will inevitably bring high precision. Take the line width as an example: O.20mm line width, and O.16-0.24mm is qualified according to the regulations. The error is (O.20 soil 0.04) mm; and the line width of O.10mm, the same error is (0.10±O.02) mm, obviously the accuracy of the latter is doubled, and so on is not difficult to understand. Therefore, the high precision requirements are not discussed separately. But it is a prominent problem in production technology.
7. Solder mask 8. BGA plug hole 9. Network comparison 10. Character layer
4. Drilling Editing 5. Drilling Outline Drawing 6. Circuit Layer
1. Shape 2. Orig 3. Matrix
The below describes several EDA software commonly used in circuit design. There are many EDA softwares in this industry, such as transformer design, electrical design, integrated circuit design, etc., as well as various microcontrollers. Simulation software.
How to deal with moisture sensitive components in PCB design involves the moisture sensitivity of plastic integrated circuits (ICs), which is getting worse and worse, due to many industrial trends, including the use of support for critical communications and The constant search for higher reliability products for technical applications. The failure rate of a moisture-sensitive device (MSD) alone is already at an unacceptable level, coupled with the ever-changing packaging technology. Shorter development cycles, shrinking sizes, new materials and larger chips are causing a rapid increase in the number of MSDs and a higher level of moisture/reflow sensitivity. Finally, the growth in the use of area-arranged packages such as BGA and CSP has also had a major impact. This is because these components tend to be packaged in tape-and-reel systems, each having a large number of components. When compared to the pin components in the IC tray, the key issue is that the exposure to moisture is longer.
In the low-power RF PCB design, the standard FR4 material is used (good insulation properties, uniform material, dielectric constant ε = 4, 10%).
PowerPCB enables users to achieve high-quality design and vividly reflects all aspects of the electronics design industry. Its constraint-driven design approach reduces product completion time. You can define safety spacing, routing rules, and design rules for high-speed circuits for each signal, and apply these plans hierarchically to the board, to each layer, to each type of network, to each network, to each group. On the network, each pin is placed to ensure the correctness of the layout design. It includes a wide range of features including clustering tools, dynamic routing editing, dynamic electrical performance checks, automatic dimensioning and powerful CAM output capabilities. It also has the ability to integrate third-party software tools such as the SPECCTRA router.
The anti-jamming measures that are not common in some literatures are detailed below. Considering the practical application, especially in the trial production of products, double panels are still widely used. The following contents are mainly for double panels.
Reasonable layout of components is the basic premise for designing high quality PCB drawings. The requirements for component layout mainly include installation, stress, heat, signal and aesthetic requirements.
PCB design tools have grown steadily in recent years to address the challenges of this increasingly complex design landscape. A major change – the adoption of 3D capabilities, is expected to allow designers to balance design innovation with the competitiveness of the global marketplace.
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