Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
25. Sensitive circuits or devices (such as reset circuits, WATCHDOG circuits, etc.) are at least 1000 mils away from the edge of the board, especially the interface edge of the board.
1. PCB clock frequency exceeds 5MHZ or signal rise time is less than 5ns, generally requires the use of multi-layer board design.
PCB layout is the most important step in the design of electronic products. PCB layout and wiring will directly affect the performance of the circuit. Nowadays, although there are many softwares that can realize automatic PCB layout and routing, as signal frequencies continue to increase, engineers often need to understand the basic principles and techniques of PCB layout and routing to make their design perfect.
This article describes various techniques for three types of interconnect design, including device mounting methods, wiring isolation, and measures to reduce lead inductance.
There are indications that the frequency of PCB design is getting higher and higher. As the data rate continues to increase, the bandwidth required for data transfer also contributes to signal frequencies up to 1 GHz, or even higher. Although this high-frequency signal technology far exceeds the millimeter wave technology range (30GHz), it does involve RF and low-end microwave technologies.
(1) Is the pin pitch correct? If the answer is no, it is very likely that you will not even get a weld.
It's not easy to think about packaging well:
1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.
Protel99's electrical layer is divided into two types, open a PCB design document press, shortcut L, there is a layer settings window. The SIGNAL LAYER on the left is a positive layer, including TOP LAYER, BOTTOM LAYER, and MIDLAYER, and the middle one (INTERNAL PLANES) is a negative layer, ie INTERNAL LAYER. Both layers have completely different properties and methods of use.
To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.
The concepts of Layer, Via, Overlay, Pad, Mask, etc.,
This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.
MOEMS packaging technology can be divided into several major aspects of die fixing, housing, wiring and optical interconnection. In MOEMS, commercial devices require a practical MOEMS hybrid reliable and safety shielded package. Due to the non-contact and non-insertion of optics, the packaging of PCB design MOEMS devices is much easier than the packaging of MEMS devices, and MEMS designs can be utilized, but excellent and reliable light alignment is required.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.
The Micro-Electro-Mechanical System (MOEMS) is an emerging technology that has recently become one of the hottest technologies in the world. MOEMS is a micro-electro-mechanical system (MEMS) that uses an optical subsystem. It contains micro-mechanical light modulators, micro-mechanical optical switches, ICs, and other components, and utilizes the miniaturization, multiplicity, and microelectronics of MEMS technology. Seamless integration of optical devices and electrical devices. Simply put, MOEMS is a further integration of system-level chips. Compared with large-scale opto-mechanical devices, PCB design MOEMS devices are smaller, lighter, and faster (having a higher resonant frequency) and can use mass production techniques. Compared with the waveguide mode, this free space mode has the advantages of lower coupling loss and smaller crosstalk. The changes in photonics and information technology directly promote the development of MOEMS. Figure 1 shows the relationship between microelectronics, micromechanics, optoelectronics, fiber optics, MEMS and MOEMS. Nowadays, information technology is rapidly developing and constantly updated. By 2010, the speed of light can reach Tb/s. The ever-increasing data rate and the demand for higher-performance next-generation devices have driven the demand for MOEMS and optical interconnects, and the application of PCB design MOEMS devices in the field of optoelectronics continues to grow.
Describes how it works when using only copper PCBs from a printed circuit board as a heat sink. First understand the circuit requirements.
8 Q&A in PCB Circuit Layout Design
The mechanical design includes selecting the appropriate board size, board thickness, board stacking, inner copper barrel, aspect ratio, and the like.
Most of the design performance of multi-substrate is similar to that of single-substrate or dual-substrate, that is, care should be taken not to fill too many circuits with too small space, resulting in unrealistic tolerances, high inner layer capacity, and possibly even endangering product quality. Security. Therefore, the performance specification should take into account the complete evaluation of thermal shock, insulation resistance, solder resistance, etc. of the inner-layer circuit. The following describes the important factors that should be considered in multi-substrate design.