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Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
This article analyzes the causes of various interference through several typical examples. It also introduces some special rules in the design of PCB and the requirements of anti-jamming design.
MOEMS packaging technology can be divided into several major aspects of die fixing, housing, wiring and optical interconnection. In MOEMS, commercial devices require a practical MOEMS hybrid reliable and safety shielded package. Due to the non-contact and non-insertion of optics, the packaging of PCB design MOEMS devices is much easier than the packaging of MEMS devices, and MEMS designs can be utilized, but excellent and reliable light alignment is required.
MOEMS packaging requirements are: resistance to mechanical and thermal shock, vibration and chemical resistance, and long life. Including wafer and wafer adhesion thickness, wafer cutting, die attach chip mounting process, thermal control, stress isolation, hermetic packaging, inspection and adjustment.
The Micro-Electro-Mechanical System (MOEMS) is an emerging technology that has recently become one of the hottest technologies in the world. MOEMS is a micro-electro-mechanical system (MEMS) that uses an optical subsystem. It contains micro-mechanical light modulators, micro-mechanical optical switches, ICs, and other components, and utilizes the miniaturization, multiplicity, and microelectronics of MEMS technology. Seamless integration of optical devices and electrical devices. Simply put, MOEMS is a further integration of system-level chips. Compared with large-scale opto-mechanical devices, PCB design MOEMS devices are smaller, lighter, and faster (having a higher resonant frequency) and can use mass production techniques. Compared with the waveguide mode, this free space mode has the advantages of lower coupling loss and smaller crosstalk. The changes in photonics and information technology directly promote the development of MOEMS. Figure 1 shows the relationship between microelectronics, micromechanics, optoelectronics, fiber optics, MEMS and MOEMS. Nowadays, information technology is rapidly developing and constantly updated. By 2010, the speed of light can reach Tb/s. The ever-increasing data rate and the demand for higher-performance next-generation devices have driven the demand for MOEMS and optical interconnects, and the application of PCB design MOEMS devices in the field of optoelectronics continues to grow.
Describes how it works when using only copper PCBs from a printed circuit board as a heat sink. First understand the circuit requirements.
8 Q&A in PCB Circuit Layout Design
The mechanical design includes selecting the appropriate board size, board thickness, board stacking, inner copper barrel, aspect ratio, and the like.
Most of the design performance of multi-substrate is similar to that of single-substrate or dual-substrate, that is, care should be taken not to fill too many circuits with too small space, resulting in unrealistic tolerances, high inner layer capacity, and possibly even endangering product quality. Security. Therefore, the performance specification should take into account the complete evaluation of thermal shock, insulation resistance, solder resistance, etc. of the inner-layer circuit. The following describes the important factors that should be considered in multi-substrate design.
The application of differential signal in high-speed circuit design is more and more extensive. The most critical signal in the circuit always uses differential structure design. What other way is it so popular? How can we ensure good performance in PCB design? With these two questions, we will discuss the next section. What is a differential signal? In layman's terms, the driver sends two equal-valued, inverted signals. The receiver determines whether the logic state is "0" or "1" by comparing the difference between these two voltages. The pair of traces carrying the differential signal is called differential trace.
Layout is one of the most basic job skills for PCB design engineers. The quality of the traces will directly affect the performance of the entire system. Most of the high-speed design theories will eventually be implemented and verified through Layout. It can be seen that wiring is critical in high-speed PCB design. The following will analyze the rationality of some situations that may be encountered in actual wiring, and give some comparatively optimized routing strategies. Mainly from the right-angle routing to elaborate.
In the PCB board layout, the power line and the ground wire are very important. The noise interference generated by the power line and the ground wire should be minimized to ensure the quality of the product.
To popularize LED lamps, it is necessary not only to significantly reduce costs but also to solve technical problems. How to solve the problems of energy efficiency and reliability, Doug Bailey, vice president of marketing for Power Integrations, shared the experience of efficient and reliable LED driver design.
1: This board's PCB design requirements are not high, use finer lines, automatically cloth it.
First, the appearance should not only consider the neat and orderly placement of components, but also consider the beautiful and smooth lines.
Many people say that pcb design is an art. This sentence is not wrong, but it is not a purely artistic appreciation but a practical art combined with electronic science. Electrical performance is always the most important pursuit of PCB design, and it is the primary goal. Do not give up electrical performance in order to pursue orderliness and beauty. But then again, PCBs that achieve the best electrical performance are generally pretty beautiful.
In the design of the PCB, the anti-ESD design of the PCB can be achieved through layering, proper layout and installation. In the design process, most of the design modifications can be limited to increasing or decreasing components through prediction. By adjusting the PCB layout, ESD can be well guarded.
Right-angle alignment is generally required in pcb cabling to avoid the situation, but also almost one of the standards to measure the quality of the cabling, then the right angle of the trace will have much impact on the signal transmission? In principle, a right-angled trace will cause the linewidth of the transmission line to change, resulting in an impedance discontinuity. In fact, not only the right-angle traces, but also the angles of sharp angles and acute angles may cause impedance changes.
During the assessment, designers must ask themselves: What scale is crucial to them? Force them to review their existing development tool capabilities and begin ordering some new features.
This article will address the challenges faced by PCB design and what to consider as a PCB designer in evaluating a PCB design tool.
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