Here you'll find insights into PCB design, tech trends, assembly issues, and trending topics
in the general news media as they relate to printed circuit board technology.
As experts in the manufacture and assembly of printed circuit boards, we work to make our blog a helpful resource on PCB topics and the industries that we work with, including automotive, consumer electronics, aerospace and many more.
At present, electronic equipment is still used in printed circuit boards as the main assembly method for various electronic devices and systems. Practice has proved that even if the circuit schematic design is correct, improper design of the printed circuit board will also have an adverse effect on the reliability of electronic equipment. For example, if the two fine parallel lines of the printed board are in close proximity, a delay in the signal waveform is formed, and reflection noise is formed at the end of the transmission line. Therefore, when designing a printed circuit board, it should be noted that the correct method is used.
In a highly competitive market for battery-powered products, the designer is always required to use a double-layer circuit board in the design when considering the target cost.
The schematic design before single-panel proofing is a preliminary preparation work. When drawing a schematic diagram, it is necessary to pay attention to the final connection of each file as a whole in the hierarchical design. This also has important significance for the future work. Due to software differences, some software may appear to be physically connected (electrically). If you do not use related detection tools to detect, if something goes wrong, it will be too late to wait until the board is ready. Therefore, it is important to emphasize the importance of doing it in order, and we hope to draw everyone’s attention.
The design of a printed circuit board (PCB) refers to the layout of the circuit through the design principle drawing to produce the circuit board at the lowest possible cost. In the past, this usually required expensive specialized tools to complete, but now, with the increasing popularity of free high-performance software tools, such as DesignSparkPCB, and design models, circuit board designers have greatly accelerated the design speed.
As the PCB size requirements are getting smaller and smaller, device density requirements are getting higher and higher, and PCB design is becoming more and more difficult. How to achieve a high PCB layout rate and shorten the design time, careful analysis of the design and careful setup of the tool software before starting the wiring will make the design more in line with the requirements.
Allow enough test interfaces to facilitate ICT testing
EMC, including EMI/ESD issues, is usually 80-90% related to grounding design. The most likely EMI/ESD problems are the grounding of analog, digital, and power supplies, as well as grounding methods.
The basic principles of high-speed PCB layout are as follows:
There are also two ways of layout, manual routing and automatic routing. PowerPCB provides manual routing capabilities that are powerful, including automatic push and online design rule checking (DRC). Automatic routing is performed by Specctra's cabling engine. Usually these two methods work together. The common steps are manual-auto-manual.
25. Sensitive circuits or devices (such as reset circuits, WATCHDOG circuits, etc.) are at least 1000 mils away from the edge of the board, especially the interface edge of the board.
1. PCB clock frequency exceeds 5MHZ or signal rise time is less than 5ns, generally requires the use of multi-layer board design.
PCB layout is the most important step in the design of electronic products. PCB layout and wiring will directly affect the performance of the circuit. Nowadays, although there are many softwares that can realize automatic PCB layout and routing, as signal frequencies continue to increase, engineers often need to understand the basic principles and techniques of PCB layout and routing to make their design perfect.
This article describes various techniques for three types of interconnect design, including device mounting methods, wiring isolation, and measures to reduce lead inductance.
There are indications that the frequency of PCB design is getting higher and higher. As the data rate continues to increase, the bandwidth required for data transfer also contributes to signal frequencies up to 1 GHz, or even higher. Although this high-frequency signal technology far exceeds the millimeter wave technology range (30GHz), it does involve RF and low-end microwave technologies.
(1) Is the pin pitch correct? If the answer is no, it is very likely that you will not even get a weld.
It's not easy to think about packaging well:
1. Try to increase the distance (S) between parallel lines, at least greater than 3H, and H refers to the distance the signal is routed to the reference plane. The popular saying is to walk around the big bend. As long as S is big enough, it can almost completely avoid the mutual coupling effect.
Protel99's electrical layer is divided into two types, open a PCB design document press, shortcut L, there is a layer settings window. The SIGNAL LAYER on the left is a positive layer, including TOP LAYER, BOTTOM LAYER, and MIDLAYER, and the middle one (INTERNAL PLANES) is a negative layer, ie INTERNAL LAYER. Both layers have completely different properties and methods of use.
To solve signal integrity problems, it is best to have multiple tools to analyze system performance. If there is an A/D converter in the signal path, then when evaluating the circuit performance, it is easy to find three basic problems: all three methods evaluate the conversion process, as well as the conversion process and PCB layout and other parts of the circuit. Interaction. Three areas of concern relate to the use of frequency domain analysis, time domain analysis, and DC analysis techniques. This article will explore how to use these tools to determine the root cause of issues related to PCB layout and layout. We will study how to decide what to look for; where to find it; how to test the problem through testing; and how to solve problems found.
The concepts of Layer, Via, Overlay, Pad, Mask, etc.,