||Batch process capability: 1-12 L Prototype process capability: 1-16 L
||Only allowed to accept 500*500mm temporarily. Exception please contact customer service
|Min. Line Width/Space
|| 4/4 mil (finished copper thickness 1OZ),， 5/5 mil (finished copper thickness 1.5OZ )， 6/6 mil (finished copper thickness 2OZ)， Suggest increase line width /spacing if condition allow
|Min. Hole Size (Mechanical drilling)
||Min. aperture of mechanical drilling is 0.2 mm. If conditions allow suggest enlarge to 0.3 mm or above
|Hole Tolerance (Mechanical drilling)
||The tolerance of mechanical drilling hole is ±0.07mm
|Hole Tolerance (Laser drilling)
||The tolerance of Laser drilling hole is ±0.01mm
|Via single-side Annular ring
||Min. Via is 3mil. Min. Components Hole is 5mil. Increasing via Annular ring is good for overcurrent.
|Effective Circuit bridge
||Effective Circuit bridge is the connecting line width between two pieces of copper in the circuit.
|Finished External Copper Thickness
||The thickness of the board including External plating and finishes
|Finished Internal Copper Thickness
||The thickness of the board including Internal plating and finishes
||White, Black, Blue, Green, Yellow and Red and so on.
|Min. Letter Width
||If the Min. Letter width is less than 0.15mm, the letters on the boards may not be clear because of design.
|Min. Letter Height
||If the Min. Letter height is less than 1mm, the letters on the boards may not be clear because of design.
|Letter Aspect Ratio
||The more suitable the Aspect Ratio is, the more convenient for fabrication is.
||HASL, HASL Leadfree, ENIG and OSP(for mass production).
|Board Thickness Range
|| Conventional board thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm, 3.0mm for mass production.
|Board Thickness Tolerance
||The Tolerance of the board thickness.
|Min. Slot Mill
||The minimum of the slot mill having copper is 0.65mm, without copper is 0.8mm.
|Space between Routing and Outline
||Min. Plated Slot Width is 0.65mm. Min. Nonplated Routing Slot is 0.8mm.
|| Half-hole is a special technology.
|Array Space (without gap):
||Panel, the space between boards is 0mm.
|Array Space (without gap)
||The gap should not less than 1.6mm. Otherwise, it would be difficuit for routing.
|Impedance control Tolerance
|Impedance control Bridge
|Pads Manufacturer Copper Pour Type
||Manufacturers adopt Hatch to pour copper. The customers use Pads design PCB please do pay attention to this item.
|Draw Slot in Pads Software
||Use Drill Drawing Layer
||If there are many non-metallic chemical slots on the boards, please draw on the Drill Drawing Layer
|Solder-mask Open layer in Protel/dxp software
|| Solder Layer
|| Few engineers mistakenly put this into paste layer. While Huaqiang PCB would not deal with paste layer.
|Protel /dxp Outline Layer
||Use Keepout Layer or Machanical Layer
||Please note: there are only one outline layer allowed in one file, two outline layers is not permitted. Please remove the useless outline layer. That’s to say, just choose either Keepout Layer or Machanical Layer to draw outline.
|Special Surface Treatment
|| Solder mask is green ink as usual said. Huaqiang PCB can not do S/M Bridge temporarily.
||FR - 4, High-frequency plate, Rogers, huaqiang FR4 double-sided PCB boards are made from A-class Jiantao material and the Multilayers boards are from Shengyi Material.